JPS57123254A - Polyamide resin composition - Google Patents
Polyamide resin compositionInfo
- Publication number
- JPS57123254A JPS57123254A JP860881A JP860881A JPS57123254A JP S57123254 A JPS57123254 A JP S57123254A JP 860881 A JP860881 A JP 860881A JP 860881 A JP860881 A JP 860881A JP S57123254 A JPS57123254 A JP S57123254A
- Authority
- JP
- Japan
- Prior art keywords
- polyamide resin
- copper
- resin composition
- compd
- modified ethylene
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920006122 polyamide resin Polymers 0.000 title abstract 6
- 239000011342 resin composition Substances 0.000 title abstract 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 5
- 229910052802 copper Inorganic materials 0.000 abstract 5
- 239000010949 copper Substances 0.000 abstract 5
- 229920001038 ethylene copolymer Polymers 0.000 abstract 3
- 125000000816 ethylene group Chemical group [H]C([H])([*:1])C([H])([H])[*:2] 0.000 abstract 3
- 150000002148 esters Chemical class 0.000 abstract 2
- 239000002530 phenolic antioxidant Substances 0.000 abstract 2
- 229910021591 Copper(I) chloride Inorganic materials 0.000 abstract 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 abstract 1
- 239000005977 Ethylene Substances 0.000 abstract 1
- 238000013329 compounding Methods 0.000 abstract 1
- 229920001577 copolymer Polymers 0.000 abstract 1
- OXBLHERUFWYNTN-UHFFFAOYSA-M copper(I) chloride Chemical compound [Cu]Cl OXBLHERUFWYNTN-UHFFFAOYSA-M 0.000 abstract 1
- GBRBMTNGQBKBQE-UHFFFAOYSA-L copper;diiodide Chemical compound I[Cu]I GBRBMTNGQBKBQE-UHFFFAOYSA-L 0.000 abstract 1
- 229940045803 cuprous chloride Drugs 0.000 abstract 1
- 238000010348 incorporation Methods 0.000 abstract 1
- 150000007934 α,β-unsaturated carboxylic acids Chemical class 0.000 abstract 1
- 239000004711 α-olefin Substances 0.000 abstract 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP860881A JPS57123254A (en) | 1981-01-23 | 1981-01-23 | Polyamide resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP860881A JPS57123254A (en) | 1981-01-23 | 1981-01-23 | Polyamide resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57123254A true JPS57123254A (en) | 1982-07-31 |
| JPH0141660B2 JPH0141660B2 (enrdf_load_stackoverflow) | 1989-09-06 |
Family
ID=11697668
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP860881A Granted JPS57123254A (en) | 1981-01-23 | 1981-01-23 | Polyamide resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57123254A (enrdf_load_stackoverflow) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5924751A (ja) * | 1982-08-02 | 1984-02-08 | Toray Ind Inc | ポリアミド樹脂組成物 |
| JPS5927948A (ja) * | 1982-08-06 | 1984-02-14 | Toray Ind Inc | 樹脂組成物 |
| JPS59140258A (ja) * | 1983-01-31 | 1984-08-11 | Dainippon Ink & Chem Inc | ポリアミド樹脂組成物 |
| JPS63170460A (ja) * | 1987-10-12 | 1988-07-14 | Toray Ind Inc | 樹脂組成物 |
| US4939185A (en) * | 1984-02-10 | 1990-07-03 | General Electric Company | Enhancing color stability to sterilizing radiation of polymer compositions |
| JPH05262980A (ja) * | 1992-03-19 | 1993-10-12 | Mitsui Petrochem Ind Ltd | 熱可塑性樹脂組成物およびその成形体 |
| JPH0649357A (ja) * | 1992-03-19 | 1994-02-22 | Mitsui Petrochem Ind Ltd | ポリアミド系樹脂組成物およびコネクター |
| WO2000078869A1 (en) * | 1999-06-18 | 2000-12-28 | Solvay Advanced Polymers, Llc | Method for reducing mold deposit formation during molding of polyamides and composition therefor |
-
1981
- 1981-01-23 JP JP860881A patent/JPS57123254A/ja active Granted
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5924751A (ja) * | 1982-08-02 | 1984-02-08 | Toray Ind Inc | ポリアミド樹脂組成物 |
| JPS5927948A (ja) * | 1982-08-06 | 1984-02-14 | Toray Ind Inc | 樹脂組成物 |
| JPS59140258A (ja) * | 1983-01-31 | 1984-08-11 | Dainippon Ink & Chem Inc | ポリアミド樹脂組成物 |
| US4939185A (en) * | 1984-02-10 | 1990-07-03 | General Electric Company | Enhancing color stability to sterilizing radiation of polymer compositions |
| JPS63170460A (ja) * | 1987-10-12 | 1988-07-14 | Toray Ind Inc | 樹脂組成物 |
| JPH05262980A (ja) * | 1992-03-19 | 1993-10-12 | Mitsui Petrochem Ind Ltd | 熱可塑性樹脂組成物およびその成形体 |
| JPH0649357A (ja) * | 1992-03-19 | 1994-02-22 | Mitsui Petrochem Ind Ltd | ポリアミド系樹脂組成物およびコネクター |
| WO2000078869A1 (en) * | 1999-06-18 | 2000-12-28 | Solvay Advanced Polymers, Llc | Method for reducing mold deposit formation during molding of polyamides and composition therefor |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0141660B2 (enrdf_load_stackoverflow) | 1989-09-06 |
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