JPS5661454A - Heat-sensitive element consisting of polyamide composition - Google Patents

Heat-sensitive element consisting of polyamide composition

Info

Publication number
JPS5661454A
JPS5661454A JP13754879A JP13754879A JPS5661454A JP S5661454 A JPS5661454 A JP S5661454A JP 13754879 A JP13754879 A JP 13754879A JP 13754879 A JP13754879 A JP 13754879A JP S5661454 A JPS5661454 A JP S5661454A
Authority
JP
Japan
Prior art keywords
sensitive element
heat
polyamide composition
element consisting
000ppm
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13754879A
Other languages
Japanese (ja)
Other versions
JPS6243464B2 (en
Inventor
Mitsuaki Iyama
Toshio Muraki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toray Industries Inc
Original Assignee
Toray Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Industries Inc filed Critical Toray Industries Inc
Priority to JP13754879A priority Critical patent/JPS5661454A/en
Publication of JPS5661454A publication Critical patent/JPS5661454A/en
Publication of JPS6243464B2 publication Critical patent/JPS6243464B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Thermistors And Varistors (AREA)

Abstract

PURPOSE: To provide a heat-sensitive element in which impedance characteristics are remarkably changed with temperatures, by a method wherein liCl is blended with a specified polyamide resin.
CONSTITUTION: (B) 100W6,000ppm, perf. 300W3,000ppm (calculated as Li) of LiCl is blended with (A) a polyamide resin contg. not more than 14 amide gp. per 100 carbon atoms (e.g. a polyaminoundecamide). The mixt, is melt-kneaded and then molded into a rod or a sheet to form the desired heat-sensitive element.
EFFECT: Electrical properties are remarkably changed with temperatures. The amount of the element is not changed with time by bleedout. The element does not corrode aluminum and copper which are used for signal conductors.
COPYRIGHT: (C)1981,JPO&Japio
JP13754879A 1979-10-26 1979-10-26 Heat-sensitive element consisting of polyamide composition Granted JPS5661454A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13754879A JPS5661454A (en) 1979-10-26 1979-10-26 Heat-sensitive element consisting of polyamide composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13754879A JPS5661454A (en) 1979-10-26 1979-10-26 Heat-sensitive element consisting of polyamide composition

Publications (2)

Publication Number Publication Date
JPS5661454A true JPS5661454A (en) 1981-05-26
JPS6243464B2 JPS6243464B2 (en) 1987-09-14

Family

ID=15201263

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13754879A Granted JPS5661454A (en) 1979-10-26 1979-10-26 Heat-sensitive element consisting of polyamide composition

Country Status (1)

Country Link
JP (1) JPS5661454A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61233057A (en) * 1985-04-08 1986-10-17 Daicel Chem Ind Ltd Polyamide resin composition
JPH06124805A (en) * 1992-10-13 1994-05-06 Totoku Electric Co Ltd High-molecular temperature sensing element

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5227594A (en) * 1975-08-27 1977-03-01 Daicel Chem Ind Ltd Heat sensing material composed of polyamid component

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5227594A (en) * 1975-08-27 1977-03-01 Daicel Chem Ind Ltd Heat sensing material composed of polyamid component

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61233057A (en) * 1985-04-08 1986-10-17 Daicel Chem Ind Ltd Polyamide resin composition
JPH06124805A (en) * 1992-10-13 1994-05-06 Totoku Electric Co Ltd High-molecular temperature sensing element

Also Published As

Publication number Publication date
JPS6243464B2 (en) 1987-09-14

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