JPS57123254A - Polyamide resin composition - Google Patents
Polyamide resin compositionInfo
- Publication number
- JPS57123254A JPS57123254A JP860881A JP860881A JPS57123254A JP S57123254 A JPS57123254 A JP S57123254A JP 860881 A JP860881 A JP 860881A JP 860881 A JP860881 A JP 860881A JP S57123254 A JPS57123254 A JP S57123254A
- Authority
- JP
- Japan
- Prior art keywords
- polyamide resin
- copper
- resin composition
- compd
- modified ethylene
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Abstract
PURPOSE: A polyamide resin composition with improved impact resistance and heat resistance, prepd. by compounding a polyamide resin contg. a specified modified ethylene copolymer with a copper compd.
CONSTITUTION: 100pts.wt. polyamide resin is compounded with 1W100pts.wt. modified ethylene copolymer obtd. by the graft polymn. of a copolymer consisting of ethylene and a 3C or higher α-olefin with 0.05W1.5wt% α, β-unsaturated carboxylic acid or its deriv., and with 0.001W2pts.wt. copper compd., or 0.001W 2pts.wt. copper compd. and 0.005W10pts.wt. thiodicarboxylate ester or phenolic antioxidant. Copper iodide, cuprous chloride, etc. is suitable as the copper compd. It is possible to prepare a polyamide resin composition having an improved heat resistance by the incorporation of the thiodicarboxylate ester or phenolic antioxidant in said polyamide resin, modified ethylene copolymer and copper compd.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP860881A JPS57123254A (en) | 1981-01-23 | 1981-01-23 | Polyamide resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP860881A JPS57123254A (en) | 1981-01-23 | 1981-01-23 | Polyamide resin composition |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57123254A true JPS57123254A (en) | 1982-07-31 |
JPH0141660B2 JPH0141660B2 (en) | 1989-09-06 |
Family
ID=11697668
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP860881A Granted JPS57123254A (en) | 1981-01-23 | 1981-01-23 | Polyamide resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57123254A (en) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5924751A (en) * | 1982-08-02 | 1984-02-08 | Toray Ind Inc | Polyamide resin composition |
JPS5927948A (en) * | 1982-08-06 | 1984-02-14 | Toray Ind Inc | Resin composition |
JPS59140258A (en) * | 1983-01-31 | 1984-08-11 | Dainippon Ink & Chem Inc | Polyamide resin composition |
JPS63170460A (en) * | 1987-10-12 | 1988-07-14 | Toray Ind Inc | Resin composition |
US4939185A (en) * | 1984-02-10 | 1990-07-03 | General Electric Company | Enhancing color stability to sterilizing radiation of polymer compositions |
JPH05262980A (en) * | 1992-03-19 | 1993-10-12 | Mitsui Petrochem Ind Ltd | Thermoplastic resin composition and its molded article |
JPH0649357A (en) * | 1992-03-19 | 1994-02-22 | Mitsui Petrochem Ind Ltd | Polyamide resin composition and connector |
WO2000078869A1 (en) * | 1999-06-18 | 2000-12-28 | Solvay Advanced Polymers, Llc | Method for reducing mold deposit formation during molding of polyamides and composition therefor |
-
1981
- 1981-01-23 JP JP860881A patent/JPS57123254A/en active Granted
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5924751A (en) * | 1982-08-02 | 1984-02-08 | Toray Ind Inc | Polyamide resin composition |
JPS5927948A (en) * | 1982-08-06 | 1984-02-14 | Toray Ind Inc | Resin composition |
JPS6157345B2 (en) * | 1982-08-06 | 1986-12-06 | Toray Industries | |
JPS59140258A (en) * | 1983-01-31 | 1984-08-11 | Dainippon Ink & Chem Inc | Polyamide resin composition |
US4939185A (en) * | 1984-02-10 | 1990-07-03 | General Electric Company | Enhancing color stability to sterilizing radiation of polymer compositions |
JPS63170460A (en) * | 1987-10-12 | 1988-07-14 | Toray Ind Inc | Resin composition |
JPH0420027B2 (en) * | 1987-10-12 | 1992-03-31 | Toray Industries | |
JPH05262980A (en) * | 1992-03-19 | 1993-10-12 | Mitsui Petrochem Ind Ltd | Thermoplastic resin composition and its molded article |
JPH0649357A (en) * | 1992-03-19 | 1994-02-22 | Mitsui Petrochem Ind Ltd | Polyamide resin composition and connector |
WO2000078869A1 (en) * | 1999-06-18 | 2000-12-28 | Solvay Advanced Polymers, Llc | Method for reducing mold deposit formation during molding of polyamides and composition therefor |
Also Published As
Publication number | Publication date |
---|---|
JPH0141660B2 (en) | 1989-09-06 |
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