JPS57123254A - Polyamide resin composition - Google Patents

Polyamide resin composition

Info

Publication number
JPS57123254A
JPS57123254A JP860881A JP860881A JPS57123254A JP S57123254 A JPS57123254 A JP S57123254A JP 860881 A JP860881 A JP 860881A JP 860881 A JP860881 A JP 860881A JP S57123254 A JPS57123254 A JP S57123254A
Authority
JP
Japan
Prior art keywords
polyamide resin
copper
resin composition
compd
modified ethylene
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP860881A
Other languages
Japanese (ja)
Other versions
JPH0141660B2 (en
Inventor
Takahiro Omura
Seiichiro Maruyama
Takafumi Kato
Hiroyuki Kawasaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Kasei Corp
Original Assignee
Mitsubishi Kasei Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Kasei Corp filed Critical Mitsubishi Kasei Corp
Priority to JP860881A priority Critical patent/JPS57123254A/en
Publication of JPS57123254A publication Critical patent/JPS57123254A/en
Publication of JPH0141660B2 publication Critical patent/JPH0141660B2/ja
Granted legal-status Critical Current

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  • Compositions Of Macromolecular Compounds (AREA)

Abstract

PURPOSE: A polyamide resin composition with improved impact resistance and heat resistance, prepd. by compounding a polyamide resin contg. a specified modified ethylene copolymer with a copper compd.
CONSTITUTION: 100pts.wt. polyamide resin is compounded with 1W100pts.wt. modified ethylene copolymer obtd. by the graft polymn. of a copolymer consisting of ethylene and a 3C or higher α-olefin with 0.05W1.5wt% α, β-unsaturated carboxylic acid or its deriv., and with 0.001W2pts.wt. copper compd., or 0.001W 2pts.wt. copper compd. and 0.005W10pts.wt. thiodicarboxylate ester or phenolic antioxidant. Copper iodide, cuprous chloride, etc. is suitable as the copper compd. It is possible to prepare a polyamide resin composition having an improved heat resistance by the incorporation of the thiodicarboxylate ester or phenolic antioxidant in said polyamide resin, modified ethylene copolymer and copper compd.
COPYRIGHT: (C)1982,JPO&Japio
JP860881A 1981-01-23 1981-01-23 Polyamide resin composition Granted JPS57123254A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP860881A JPS57123254A (en) 1981-01-23 1981-01-23 Polyamide resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP860881A JPS57123254A (en) 1981-01-23 1981-01-23 Polyamide resin composition

Publications (2)

Publication Number Publication Date
JPS57123254A true JPS57123254A (en) 1982-07-31
JPH0141660B2 JPH0141660B2 (en) 1989-09-06

Family

ID=11697668

Family Applications (1)

Application Number Title Priority Date Filing Date
JP860881A Granted JPS57123254A (en) 1981-01-23 1981-01-23 Polyamide resin composition

Country Status (1)

Country Link
JP (1) JPS57123254A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5924751A (en) * 1982-08-02 1984-02-08 Toray Ind Inc Polyamide resin composition
JPS5927948A (en) * 1982-08-06 1984-02-14 Toray Ind Inc Resin composition
JPS59140258A (en) * 1983-01-31 1984-08-11 Dainippon Ink & Chem Inc Polyamide resin composition
JPS63170460A (en) * 1987-10-12 1988-07-14 Toray Ind Inc Resin composition
US4939185A (en) * 1984-02-10 1990-07-03 General Electric Company Enhancing color stability to sterilizing radiation of polymer compositions
JPH05262980A (en) * 1992-03-19 1993-10-12 Mitsui Petrochem Ind Ltd Thermoplastic resin composition and its molded article
JPH0649357A (en) * 1992-03-19 1994-02-22 Mitsui Petrochem Ind Ltd Polyamide resin composition and connector
WO2000078869A1 (en) * 1999-06-18 2000-12-28 Solvay Advanced Polymers, Llc Method for reducing mold deposit formation during molding of polyamides and composition therefor

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5924751A (en) * 1982-08-02 1984-02-08 Toray Ind Inc Polyamide resin composition
JPS5927948A (en) * 1982-08-06 1984-02-14 Toray Ind Inc Resin composition
JPS6157345B2 (en) * 1982-08-06 1986-12-06 Toray Industries
JPS59140258A (en) * 1983-01-31 1984-08-11 Dainippon Ink & Chem Inc Polyamide resin composition
US4939185A (en) * 1984-02-10 1990-07-03 General Electric Company Enhancing color stability to sterilizing radiation of polymer compositions
JPS63170460A (en) * 1987-10-12 1988-07-14 Toray Ind Inc Resin composition
JPH0420027B2 (en) * 1987-10-12 1992-03-31 Toray Industries
JPH05262980A (en) * 1992-03-19 1993-10-12 Mitsui Petrochem Ind Ltd Thermoplastic resin composition and its molded article
JPH0649357A (en) * 1992-03-19 1994-02-22 Mitsui Petrochem Ind Ltd Polyamide resin composition and connector
WO2000078869A1 (en) * 1999-06-18 2000-12-28 Solvay Advanced Polymers, Llc Method for reducing mold deposit formation during molding of polyamides and composition therefor

Also Published As

Publication number Publication date
JPH0141660B2 (en) 1989-09-06

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