JPS57120389A - Planar type semiconductor - Google Patents
Planar type semiconductorInfo
- Publication number
- JPS57120389A JPS57120389A JP56005878A JP587881A JPS57120389A JP S57120389 A JPS57120389 A JP S57120389A JP 56005878 A JP56005878 A JP 56005878A JP 587881 A JP587881 A JP 587881A JP S57120389 A JPS57120389 A JP S57120389A
- Authority
- JP
- Japan
- Prior art keywords
- film
- opened
- ion implantation
- electrodes
- resist
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N52/00—Hall-effect devices
- H10N52/01—Manufacture or treatment
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Formation Of Insulating Films (AREA)
- Hall/Mr Elements (AREA)
- Junction Field-Effect Transistors (AREA)
Abstract
PURPOSE:To obtain a stable and high quality semiconductor by selectively using a SiO2 film and a SiN film having different stress directions, moderating effects on GaAs crystal surface thereby removing by a dry etching an insulation layer in the predetermined region at the time of forming element electrodes. CONSTITUTION:A SiO2 film 2 is formed on the surface of an semi-insulative GaAs crystal substrate of (100) and a window is opened for ion implantation region by the photo etching method. The Si injection layer 4 is formed leaving a resist 3 on the film 2, and a SiN film 5 is formed after removing the resist film. Element electrodes are opened by the photo etching method and the Si injection layer 6 is formed by ion implanting Si<+>. An active layers 4a, 4b are formed by activating the ion implantation layer and by heat treatment. Au, Ta and Au are consecutively vapor deposites as ohmic electrodes in the element electrode region to make a GaAs hole element.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56005878A JPS57120389A (en) | 1981-01-20 | 1981-01-20 | Planar type semiconductor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56005878A JPS57120389A (en) | 1981-01-20 | 1981-01-20 | Planar type semiconductor |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS57120389A true JPS57120389A (en) | 1982-07-27 |
Family
ID=11623159
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP56005878A Pending JPS57120389A (en) | 1981-01-20 | 1981-01-20 | Planar type semiconductor |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57120389A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63229720A (en) * | 1987-03-18 | 1988-09-26 | Nec Corp | Compound semiconductor device |
-
1981
- 1981-01-20 JP JP56005878A patent/JPS57120389A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63229720A (en) * | 1987-03-18 | 1988-09-26 | Nec Corp | Compound semiconductor device |
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