JPS57119947A - Epoxy resin composition - Google Patents
Epoxy resin compositionInfo
- Publication number
- JPS57119947A JPS57119947A JP517381A JP517381A JPS57119947A JP S57119947 A JPS57119947 A JP S57119947A JP 517381 A JP517381 A JP 517381A JP 517381 A JP517381 A JP 517381A JP S57119947 A JPS57119947 A JP S57119947A
- Authority
- JP
- Japan
- Prior art keywords
- compd
- epoxy resin
- phosphine
- epoxy
- org
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003822 epoxy resin Substances 0.000 title abstract 3
- 239000000203 mixture Substances 0.000 title abstract 3
- 229920000647 polyepoxide Polymers 0.000 title abstract 3
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 abstract 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 2
- 239000013522 chelant Substances 0.000 abstract 2
- 239000003795 chemical substances by application Substances 0.000 abstract 2
- 229910052751 metal Inorganic materials 0.000 abstract 2
- 239000002184 metal Substances 0.000 abstract 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 abstract 2
- 229910000073 phosphorus hydride Inorganic materials 0.000 abstract 2
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 abstract 2
- 239000004593 Epoxy Substances 0.000 abstract 1
- 239000007983 Tris buffer Substances 0.000 abstract 1
- 229910052782 aluminium Inorganic materials 0.000 abstract 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract 1
- 235000010210 aluminium Nutrition 0.000 abstract 1
- 238000013329 compounding Methods 0.000 abstract 1
- 229910002026 crystalline silica Inorganic materials 0.000 abstract 1
- 125000003700 epoxy group Chemical group 0.000 abstract 1
- 239000000945 filler Substances 0.000 abstract 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 abstract 1
- 239000011810 insulating material Substances 0.000 abstract 1
- 229920003986 novolac Polymers 0.000 abstract 1
- 229920005989 resin Polymers 0.000 abstract 1
- 239000011347 resin Substances 0.000 abstract 1
- 235000012239 silicon dioxide Nutrition 0.000 abstract 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Organic Insulating Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP517381A JPS57119947A (en) | 1981-01-19 | 1981-01-19 | Epoxy resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP517381A JPS57119947A (en) | 1981-01-19 | 1981-01-19 | Epoxy resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57119947A true JPS57119947A (en) | 1982-07-26 |
| JPH0150249B2 JPH0150249B2 (enrdf_load_stackoverflow) | 1989-10-27 |
Family
ID=11603841
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP517381A Granted JPS57119947A (en) | 1981-01-19 | 1981-01-19 | Epoxy resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57119947A (enrdf_load_stackoverflow) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59227146A (ja) * | 1983-06-07 | 1984-12-20 | Sharp Corp | 樹脂封止型半導体装置 |
| JPS6086790A (ja) * | 1983-10-18 | 1985-05-16 | 松下電器産業株式会社 | 可撓性発熱線 |
| JPS63130621A (ja) * | 1986-11-21 | 1988-06-02 | Toshiba Corp | 半導体装置封止用エポキシ樹脂組成物 |
| JP2014129475A (ja) * | 2012-12-28 | 2014-07-10 | Kyoritsu Kagaku Sangyo Kk | 熱カチオン重合性組成物 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56130953A (en) * | 1980-03-17 | 1981-10-14 | Shin Etsu Chem Co Ltd | Epoxy resin composition for sealing semiconductor device |
-
1981
- 1981-01-19 JP JP517381A patent/JPS57119947A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56130953A (en) * | 1980-03-17 | 1981-10-14 | Shin Etsu Chem Co Ltd | Epoxy resin composition for sealing semiconductor device |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59227146A (ja) * | 1983-06-07 | 1984-12-20 | Sharp Corp | 樹脂封止型半導体装置 |
| JPS6086790A (ja) * | 1983-10-18 | 1985-05-16 | 松下電器産業株式会社 | 可撓性発熱線 |
| JPS63130621A (ja) * | 1986-11-21 | 1988-06-02 | Toshiba Corp | 半導体装置封止用エポキシ樹脂組成物 |
| JP2014129475A (ja) * | 2012-12-28 | 2014-07-10 | Kyoritsu Kagaku Sangyo Kk | 熱カチオン重合性組成物 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0150249B2 (enrdf_load_stackoverflow) | 1989-10-27 |
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