JPS57116666A - Thermal head - Google Patents

Thermal head

Info

Publication number
JPS57116666A
JPS57116666A JP339881A JP339881A JPS57116666A JP S57116666 A JPS57116666 A JP S57116666A JP 339881 A JP339881 A JP 339881A JP 339881 A JP339881 A JP 339881A JP S57116666 A JPS57116666 A JP S57116666A
Authority
JP
Japan
Prior art keywords
head
attached
flexible circuit
solder
thermal head
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP339881A
Other languages
Japanese (ja)
Inventor
Kunihiro Inoue
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Suwa Seikosha KK
Original Assignee
Seiko Epson Corp
Suwa Seikosha KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp, Suwa Seikosha KK filed Critical Seiko Epson Corp
Priority to JP339881A priority Critical patent/JPS57116666A/en
Publication of JPS57116666A publication Critical patent/JPS57116666A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B41J2/32Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
    • B41J2/345Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads characterised by the arrangement of resistors or conductors

Abstract

PURPOSE:To obtain the extremely compact and inexpensive thermal head by providing slits or hollow parts in the lead electrode of the extremely compact thermal head, thereby facilitating the connection between the head and a flexible circuit. CONSTITUTION:A tantarum nitride film is attached on an alumina substrate 5 on which partial glaze is formed by magnetron sputtering, and Cr-Cu-Cr layers are evaporated on said film. A photoetching method is used for a heating part and electrodes 3 and 4. An oxidation resisting layer of SiO2 and an abrasion resisting layer of Ta2O5 are attached on the upper part of the head at the part A except for a soldering part. Then the device is put in a solder bath and solder 3 is attached by a dipping method. The head is connected to the flexible circuit 7 by applying heat from the bottom and applying pressure from the top. In this constituion, even through the solder leaks to the slit parts 6, the quantity of leakage is not so large as the quantity shown by the Figure. The short circuit to other electrodes, which has occured in the conventional circuits, does not occur, and the yield rate of the connection between the head and the flexible circuit becomes 100%.
JP339881A 1981-01-13 1981-01-13 Thermal head Pending JPS57116666A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP339881A JPS57116666A (en) 1981-01-13 1981-01-13 Thermal head

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP339881A JPS57116666A (en) 1981-01-13 1981-01-13 Thermal head

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP9563589A Division JPH02276651A (en) 1989-04-14 1989-04-14 Thermal head

Publications (1)

Publication Number Publication Date
JPS57116666A true JPS57116666A (en) 1982-07-20

Family

ID=11556253

Family Applications (1)

Application Number Title Priority Date Filing Date
JP339881A Pending JPS57116666A (en) 1981-01-13 1981-01-13 Thermal head

Country Status (1)

Country Link
JP (1) JPS57116666A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58110272A (en) * 1981-12-25 1983-06-30 Seiko Instr & Electronics Ltd Thermal head
JPS60179270A (en) * 1984-02-27 1985-09-13 Rohm Co Ltd Wire connection structure for thermal printhead

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5439893A (en) * 1977-09-06 1979-03-27 Hitachi Ltd Structure of contact portion between conductors
JPS5523871U (en) * 1978-07-29 1980-02-15

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5439893A (en) * 1977-09-06 1979-03-27 Hitachi Ltd Structure of contact portion between conductors
JPS5523871U (en) * 1978-07-29 1980-02-15

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58110272A (en) * 1981-12-25 1983-06-30 Seiko Instr & Electronics Ltd Thermal head
JPS60179270A (en) * 1984-02-27 1985-09-13 Rohm Co Ltd Wire connection structure for thermal printhead
JPH0354631B2 (en) * 1984-02-27 1991-08-20

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