JPS57116666A - Thermal head - Google Patents
Thermal headInfo
- Publication number
- JPS57116666A JPS57116666A JP339881A JP339881A JPS57116666A JP S57116666 A JPS57116666 A JP S57116666A JP 339881 A JP339881 A JP 339881A JP 339881 A JP339881 A JP 339881A JP S57116666 A JPS57116666 A JP S57116666A
- Authority
- JP
- Japan
- Prior art keywords
- head
- attached
- flexible circuit
- solder
- thermal head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/345—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads characterised by the arrangement of resistors or conductors
Abstract
PURPOSE:To obtain the extremely compact and inexpensive thermal head by providing slits or hollow parts in the lead electrode of the extremely compact thermal head, thereby facilitating the connection between the head and a flexible circuit. CONSTITUTION:A tantarum nitride film is attached on an alumina substrate 5 on which partial glaze is formed by magnetron sputtering, and Cr-Cu-Cr layers are evaporated on said film. A photoetching method is used for a heating part and electrodes 3 and 4. An oxidation resisting layer of SiO2 and an abrasion resisting layer of Ta2O5 are attached on the upper part of the head at the part A except for a soldering part. Then the device is put in a solder bath and solder 3 is attached by a dipping method. The head is connected to the flexible circuit 7 by applying heat from the bottom and applying pressure from the top. In this constituion, even through the solder leaks to the slit parts 6, the quantity of leakage is not so large as the quantity shown by the Figure. The short circuit to other electrodes, which has occured in the conventional circuits, does not occur, and the yield rate of the connection between the head and the flexible circuit becomes 100%.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP339881A JPS57116666A (en) | 1981-01-13 | 1981-01-13 | Thermal head |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP339881A JPS57116666A (en) | 1981-01-13 | 1981-01-13 | Thermal head |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9563589A Division JPH02276651A (en) | 1989-04-14 | 1989-04-14 | Thermal head |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS57116666A true JPS57116666A (en) | 1982-07-20 |
Family
ID=11556253
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP339881A Pending JPS57116666A (en) | 1981-01-13 | 1981-01-13 | Thermal head |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57116666A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58110272A (en) * | 1981-12-25 | 1983-06-30 | Seiko Instr & Electronics Ltd | Thermal head |
JPS60179270A (en) * | 1984-02-27 | 1985-09-13 | Rohm Co Ltd | Wire connection structure for thermal printhead |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5439893A (en) * | 1977-09-06 | 1979-03-27 | Hitachi Ltd | Structure of contact portion between conductors |
JPS5523871U (en) * | 1978-07-29 | 1980-02-15 |
-
1981
- 1981-01-13 JP JP339881A patent/JPS57116666A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5439893A (en) * | 1977-09-06 | 1979-03-27 | Hitachi Ltd | Structure of contact portion between conductors |
JPS5523871U (en) * | 1978-07-29 | 1980-02-15 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58110272A (en) * | 1981-12-25 | 1983-06-30 | Seiko Instr & Electronics Ltd | Thermal head |
JPS60179270A (en) * | 1984-02-27 | 1985-09-13 | Rohm Co Ltd | Wire connection structure for thermal printhead |
JPH0354631B2 (en) * | 1984-02-27 | 1991-08-20 |
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