JPS57114245A - Assembling of semiconductor device - Google Patents

Assembling of semiconductor device

Info

Publication number
JPS57114245A
JPS57114245A JP56000593A JP59381A JPS57114245A JP S57114245 A JPS57114245 A JP S57114245A JP 56000593 A JP56000593 A JP 56000593A JP 59381 A JP59381 A JP 59381A JP S57114245 A JPS57114245 A JP S57114245A
Authority
JP
Japan
Prior art keywords
adhesive material
pellet
semiconductor device
creeping
flattened
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56000593A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6320378B2 (enExample
Inventor
Nobuyuki Yanagihara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP56000593A priority Critical patent/JPS57114245A/ja
Publication of JPS57114245A publication Critical patent/JPS57114245A/ja
Publication of JPS6320378B2 publication Critical patent/JPS6320378B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/011—Apparatus therefor
    • H10W72/0113—Apparatus for manufacturing die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H10W72/01351—Changing the shapes of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Die Bonding (AREA)
JP56000593A 1981-01-06 1981-01-06 Assembling of semiconductor device Granted JPS57114245A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56000593A JPS57114245A (en) 1981-01-06 1981-01-06 Assembling of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56000593A JPS57114245A (en) 1981-01-06 1981-01-06 Assembling of semiconductor device

Publications (2)

Publication Number Publication Date
JPS57114245A true JPS57114245A (en) 1982-07-16
JPS6320378B2 JPS6320378B2 (enExample) 1988-04-27

Family

ID=11478029

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56000593A Granted JPS57114245A (en) 1981-01-06 1981-01-06 Assembling of semiconductor device

Country Status (1)

Country Link
JP (1) JPS57114245A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5961141A (ja) * 1982-09-30 1984-04-07 Nec Corp ペレツトボンデイング方法
JPS60146342U (ja) * 1984-03-10 1985-09-28 新日本無線株式会社 接着剤塗布装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5363870A (en) * 1976-11-19 1978-06-07 Hitachi Ltd Assembling method of semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5363870A (en) * 1976-11-19 1978-06-07 Hitachi Ltd Assembling method of semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5961141A (ja) * 1982-09-30 1984-04-07 Nec Corp ペレツトボンデイング方法
JPS60146342U (ja) * 1984-03-10 1985-09-28 新日本無線株式会社 接着剤塗布装置

Also Published As

Publication number Publication date
JPS6320378B2 (enExample) 1988-04-27

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