JPS5446472A - Device and method for fabrication of semiconductor device - Google Patents

Device and method for fabrication of semiconductor device

Info

Publication number
JPS5446472A
JPS5446472A JP11365677A JP11365677A JPS5446472A JP S5446472 A JPS5446472 A JP S5446472A JP 11365677 A JP11365677 A JP 11365677A JP 11365677 A JP11365677 A JP 11365677A JP S5446472 A JPS5446472 A JP S5446472A
Authority
JP
Japan
Prior art keywords
nozzle
mount
capillary
pellet
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11365677A
Other languages
Japanese (ja)
Inventor
Yoshiyuki Hayakawa
Yoshiyasu Inoue
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP11365677A priority Critical patent/JPS5446472A/en
Publication of JPS5446472A publication Critical patent/JPS5446472A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85009—Pre-treatment of the connector or the bonding area
    • H01L2224/8503—Reshaping, e.g. forming the ball or the wedge of the wire connector
    • H01L2224/85035—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball"
    • H01L2224/85043—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball" using a flame torch, e.g. hydrogen torch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85053—Bonding environment
    • H01L2224/8509—Vacuum
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Abstract

PURPOSE: To reduce the manufacture cost by enabling one unit to attain both mount ing and bonding operations sequentially which are needed for the fabrication of semiconductor pellets.
CONSTITUTION: Pellet 16 arranged on an adhesive tape, etc., is positioned under nozzle 11 constituting the mount-bonding unit and then vacuum-adsorbed inside the inverted pyramid at the tip of nozzle 11. Next, nozzle 11 is raised and the arm holding this is turned around to carry pellet 16 to the mount position of the frame; and nozzle 11 is lowered and pellet 16 is pressed onto the mount by capillary 13. The vacuum of pipe tap 12 is filled with nitrogen gas, ball 15 is generated at the tip of bonding wire 14 penetrating through capillary, and pressure is applied onto capillary 13, thereby anchoring ball 15 and pellet 16 together. Next, nozzle 11 is raised together with capillary 13, wire 14 is cut off by a hydrogen torch, and this operation is repeated, thereby attaining the mount bonding
COPYRIGHT: (C)1979,JPO&Japio
JP11365677A 1977-09-20 1977-09-20 Device and method for fabrication of semiconductor device Pending JPS5446472A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11365677A JPS5446472A (en) 1977-09-20 1977-09-20 Device and method for fabrication of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11365677A JPS5446472A (en) 1977-09-20 1977-09-20 Device and method for fabrication of semiconductor device

Publications (1)

Publication Number Publication Date
JPS5446472A true JPS5446472A (en) 1979-04-12

Family

ID=14617796

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11365677A Pending JPS5446472A (en) 1977-09-20 1977-09-20 Device and method for fabrication of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5446472A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0476926A (en) * 1990-07-19 1992-03-11 Toshiba Corp Semiconductor manufacturing equipment
US5581119A (en) * 1994-03-04 1996-12-03 National Semiconductor Corporation IC having heat spreader attached by glob-topping

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0476926A (en) * 1990-07-19 1992-03-11 Toshiba Corp Semiconductor manufacturing equipment
US5871610A (en) * 1990-07-19 1999-02-16 Kabushiki Kaisha Toshiba Apparatus for automatically mounting a plurality of semiconductor chips on a lead frame
US5581119A (en) * 1994-03-04 1996-12-03 National Semiconductor Corporation IC having heat spreader attached by glob-topping

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