JPS57113240A - Wire bonding apparatus - Google Patents

Wire bonding apparatus

Info

Publication number
JPS57113240A
JPS57113240A JP56000041A JP4181A JPS57113240A JP S57113240 A JPS57113240 A JP S57113240A JP 56000041 A JP56000041 A JP 56000041A JP 4181 A JP4181 A JP 4181A JP S57113240 A JPS57113240 A JP S57113240A
Authority
JP
Japan
Prior art keywords
frame
bonding
lead
guide rails
lead post
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56000041A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6231818B2 (enrdf_load_stackoverflow
Inventor
Nobuhito Yamazaki
Takeshi Hasegawa
Minoru Torihata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Shinkawa Seisakusho Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd, Shinkawa Seisakusho Co Ltd filed Critical Shinkawa Ltd
Priority to JP56000041A priority Critical patent/JPS57113240A/ja
Publication of JPS57113240A publication Critical patent/JPS57113240A/ja
Publication of JPS6231818B2 publication Critical patent/JPS6231818B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/1016—Shape being a cuboid
    • H01L2924/10161—Shape being a cuboid with a rectangular active surface

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP56000041A 1981-01-05 1981-01-05 Wire bonding apparatus Granted JPS57113240A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56000041A JPS57113240A (en) 1981-01-05 1981-01-05 Wire bonding apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56000041A JPS57113240A (en) 1981-01-05 1981-01-05 Wire bonding apparatus

Publications (2)

Publication Number Publication Date
JPS57113240A true JPS57113240A (en) 1982-07-14
JPS6231818B2 JPS6231818B2 (enrdf_load_stackoverflow) 1987-07-10

Family

ID=11463220

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56000041A Granted JPS57113240A (en) 1981-01-05 1981-01-05 Wire bonding apparatus

Country Status (1)

Country Link
JP (1) JPS57113240A (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0455079U (enrdf_load_stackoverflow) * 1990-09-17 1992-05-12

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5022574A (enrdf_load_stackoverflow) * 1973-06-26 1975-03-11
JPS5080763A (enrdf_load_stackoverflow) * 1973-11-14 1975-07-01
JPS5160410A (ja) * 1974-11-25 1976-05-26 Hitachi Ltd Kotonaruichinisonzaisurufukusuno zahyono gentenitsuchiho
JPS5174575A (enrdf_load_stackoverflow) * 1974-12-25 1976-06-28 Shinkawa Seisakusho Kk
JPS54121672A (en) * 1978-03-14 1979-09-20 Nichiden Kikai Kk Wire bonding device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5022574A (enrdf_load_stackoverflow) * 1973-06-26 1975-03-11
JPS5080763A (enrdf_load_stackoverflow) * 1973-11-14 1975-07-01
JPS5160410A (ja) * 1974-11-25 1976-05-26 Hitachi Ltd Kotonaruichinisonzaisurufukusuno zahyono gentenitsuchiho
JPS5174575A (enrdf_load_stackoverflow) * 1974-12-25 1976-06-28 Shinkawa Seisakusho Kk
JPS54121672A (en) * 1978-03-14 1979-09-20 Nichiden Kikai Kk Wire bonding device

Also Published As

Publication number Publication date
JPS6231818B2 (enrdf_load_stackoverflow) 1987-07-10

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