JPS5174575A - - Google Patents
Info
- Publication number
- JPS5174575A JPS5174575A JP49148045A JP14804574A JPS5174575A JP S5174575 A JPS5174575 A JP S5174575A JP 49148045 A JP49148045 A JP 49148045A JP 14804574 A JP14804574 A JP 14804574A JP S5174575 A JPS5174575 A JP S5174575A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/1015—Shape
- H01L2924/1016—Shape being a cuboid
- H01L2924/10162—Shape being a cuboid with a square active surface
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
- Control Of Position Or Direction (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14804574A JPS542069B2 (enrdf_load_stackoverflow) | 1974-12-25 | 1974-12-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14804574A JPS542069B2 (enrdf_load_stackoverflow) | 1974-12-25 | 1974-12-25 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5174575A true JPS5174575A (enrdf_load_stackoverflow) | 1976-06-28 |
| JPS542069B2 JPS542069B2 (enrdf_load_stackoverflow) | 1979-02-01 |
Family
ID=15443891
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14804574A Expired JPS542069B2 (enrdf_load_stackoverflow) | 1974-12-25 | 1974-12-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS542069B2 (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57113240A (en) * | 1981-01-05 | 1982-07-14 | Shinkawa Ltd | Wire bonding apparatus |
| JPS57113239A (en) * | 1981-01-05 | 1982-07-14 | Shinkawa Ltd | Ultrasonic wire bonding apparatus |
-
1974
- 1974-12-25 JP JP14804574A patent/JPS542069B2/ja not_active Expired
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57113240A (en) * | 1981-01-05 | 1982-07-14 | Shinkawa Ltd | Wire bonding apparatus |
| JPS57113239A (en) * | 1981-01-05 | 1982-07-14 | Shinkawa Ltd | Ultrasonic wire bonding apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS542069B2 (enrdf_load_stackoverflow) | 1979-02-01 |