JPS57107038A - Manufacturing device for semiconductor - Google Patents

Manufacturing device for semiconductor

Info

Publication number
JPS57107038A
JPS57107038A JP18434480A JP18434480A JPS57107038A JP S57107038 A JPS57107038 A JP S57107038A JP 18434480 A JP18434480 A JP 18434480A JP 18434480 A JP18434480 A JP 18434480A JP S57107038 A JPS57107038 A JP S57107038A
Authority
JP
Japan
Prior art keywords
wafer
clothes
scrubber material
scrubber
purification
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18434480A
Other languages
Japanese (ja)
Inventor
Shoichi Komatsu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Suwa Seikosha KK
Original Assignee
Seiko Epson Corp
Suwa Seikosha KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp, Suwa Seikosha KK filed Critical Seiko Epson Corp
Priority to JP18434480A priority Critical patent/JPS57107038A/en
Publication of JPS57107038A publication Critical patent/JPS57107038A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H01L21/3046—Mechanical treatment, e.g. grinding, polishing, cutting using blasting, e.g. sand-blasting

Abstract

PURPOSE:To avoid occurrence of a crack on a substrate surface while permitting a pure clothes to make contact with the substrate surface at all times by forming the clothes in a windable structure like a belt, in a wafer scrubber for establishing a purification by rubbing the substrate surface of a semiconductor with the clothes. CONSTITUTION:A wafer 1 to be purified is mounted on a rotatable wafer chuck stage 2 and the surface of the wafer 1 is purified by rubbing the surface of the wafer with a scrubber material 3 including a brush or clothes. Based upon such a constitution, the scrubber material 3 is formed in a belt shape, the scrubber material 3 is wound by two roll rods 5 and a press rod 1, at the same time it makes contact with the surface of the wafer 1, the surface of the wafer 1 is rubbed by a pure scrubber material to establish the purification for the wafer, and the scrubber material 3 is replaced after it has been used for a long time. The purification can be performed more effectively by shifting the scrubber material 3 vertically or transversely. In such a way, a crack due to the dusts adhered on the wafer 1 can be prevented and further occurrence of contamination also be avoided.
JP18434480A 1980-12-25 1980-12-25 Manufacturing device for semiconductor Pending JPS57107038A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18434480A JPS57107038A (en) 1980-12-25 1980-12-25 Manufacturing device for semiconductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18434480A JPS57107038A (en) 1980-12-25 1980-12-25 Manufacturing device for semiconductor

Publications (1)

Publication Number Publication Date
JPS57107038A true JPS57107038A (en) 1982-07-03

Family

ID=16151635

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18434480A Pending JPS57107038A (en) 1980-12-25 1980-12-25 Manufacturing device for semiconductor

Country Status (1)

Country Link
JP (1) JPS57107038A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6082377A (en) * 1997-11-18 2000-07-04 Frey; Bernhard M. Vertical wafer cleaning and drying system

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6082377A (en) * 1997-11-18 2000-07-04 Frey; Bernhard M. Vertical wafer cleaning and drying system

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