JPS57104217A - Surface heat treatment - Google Patents

Surface heat treatment

Info

Publication number
JPS57104217A
JPS57104217A JP18158880A JP18158880A JPS57104217A JP S57104217 A JPS57104217 A JP S57104217A JP 18158880 A JP18158880 A JP 18158880A JP 18158880 A JP18158880 A JP 18158880A JP S57104217 A JPS57104217 A JP S57104217A
Authority
JP
Japan
Prior art keywords
laser beam
matter
heated
wavelength
exposed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP18158880A
Other languages
English (en)
Other versions
JPS641045B2 (ja
Inventor
Ken Ishikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP18158880A priority Critical patent/JPS57104217A/ja
Publication of JPS57104217A publication Critical patent/JPS57104217A/ja
Publication of JPS641045B2 publication Critical patent/JPS641045B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26—Bombardment with radiation

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Toxicology (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Recrystallisation Techniques (AREA)
  • Lasers (AREA)
JP18158880A 1980-12-22 1980-12-22 Surface heat treatment Granted JPS57104217A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18158880A JPS57104217A (en) 1980-12-22 1980-12-22 Surface heat treatment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18158880A JPS57104217A (en) 1980-12-22 1980-12-22 Surface heat treatment

Publications (2)

Publication Number Publication Date
JPS57104217A true JPS57104217A (en) 1982-06-29
JPS641045B2 JPS641045B2 (ja) 1989-01-10

Family

ID=16103428

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18158880A Granted JPS57104217A (en) 1980-12-22 1980-12-22 Surface heat treatment

Country Status (1)

Country Link
JP (1) JPS57104217A (ja)

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58201326A (ja) * 1982-05-20 1983-11-24 Matsushita Electric Ind Co Ltd レ−ザ加熱方法および加熱装置
JPS60245124A (ja) * 1984-05-18 1985-12-04 Sony Corp 半導体装置の製法
JPS61145818A (ja) * 1984-12-20 1986-07-03 Sony Corp 半導体薄膜の熱処理方法
JPH0360015A (ja) * 1989-07-27 1991-03-15 Sanyo Electric Co Ltd レーザアニール装置
JPH0750257A (ja) * 1994-07-11 1995-02-21 Sony Corp 半導体装置の製法
JPH0758342A (ja) * 1994-07-11 1995-03-03 Sony Corp 薄膜トランジスタの製法
JPH07176499A (ja) * 1994-06-21 1995-07-14 Semiconductor Energy Lab Co Ltd 光照射装置
JPH09199421A (ja) * 1996-09-26 1997-07-31 Semiconductor Energy Lab Co Ltd 光照射方法
US6528397B1 (en) 1997-12-17 2003-03-04 Matsushita Electric Industrial Co., Ltd. Semiconductor thin film, method of producing the same, apparatus for producing the same, semiconductor device and method of producing the same
JP2004247717A (ja) * 2003-01-21 2004-09-02 Semiconductor Energy Lab Co Ltd レーザ照射方法及び半導体装置の作製方法、並びにレーザ照射装置。
JP2004266102A (ja) * 2003-02-28 2004-09-24 Semiconductor Energy Lab Co Ltd レーザ照射装置およびレーザ照射方法、並びに半導体装置の作製方法。
JP2005210129A (ja) * 2004-01-22 2005-08-04 Ultratech Inc 低濃度ドープされたシリコン基板のレーザ熱アニール
US7494942B2 (en) 2003-09-29 2009-02-24 Ultratech, Inc. Laser thermal annealing of lightly doped silicon substrates
US7674663B2 (en) 2002-10-07 2010-03-09 Semiconductor Energy Laboratory Co., Ltd. Method of irradiating laser, laser irradiation system, and manufacturing method of semiconductor device
US7700462B2 (en) 2003-02-28 2010-04-20 Semiconductor Energy Laboratory Co., Ltd Laser irradiation method, laser irradiation apparatus, and method for manufacturing semiconductor device
JP2011249607A (ja) * 2010-05-27 2011-12-08 V Technology Co Ltd レーザアニール方法及び装置
JP2012231158A (ja) * 2003-09-29 2012-11-22 Ultratech Inc 低濃度ドープシリコン基板のレーザー熱アニール
JP2013055111A (ja) * 2011-09-01 2013-03-21 Phoeton Corp レーザ光合成装置、レーザアニール装置およびレーザアニール方法

Cited By (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58201326A (ja) * 1982-05-20 1983-11-24 Matsushita Electric Ind Co Ltd レ−ザ加熱方法および加熱装置
JPH0420254B2 (ja) * 1982-05-20 1992-04-02 Matsushita Electric Ind Co Ltd
JPS60245124A (ja) * 1984-05-18 1985-12-04 Sony Corp 半導体装置の製法
JPS61145818A (ja) * 1984-12-20 1986-07-03 Sony Corp 半導体薄膜の熱処理方法
JPH07118444B2 (ja) * 1984-12-20 1995-12-18 ソニー株式会社 半導体薄膜の熱処理方法
JPH0360015A (ja) * 1989-07-27 1991-03-15 Sanyo Electric Co Ltd レーザアニール装置
JPH07176499A (ja) * 1994-06-21 1995-07-14 Semiconductor Energy Lab Co Ltd 光照射装置
JPH0750257A (ja) * 1994-07-11 1995-02-21 Sony Corp 半導体装置の製法
JPH0758342A (ja) * 1994-07-11 1995-03-03 Sony Corp 薄膜トランジスタの製法
JPH09199421A (ja) * 1996-09-26 1997-07-31 Semiconductor Energy Lab Co Ltd 光照射方法
US6528397B1 (en) 1997-12-17 2003-03-04 Matsushita Electric Industrial Co., Ltd. Semiconductor thin film, method of producing the same, apparatus for producing the same, semiconductor device and method of producing the same
US6806498B2 (en) 1997-12-17 2004-10-19 Matsushita Electric Industrial Co., Ltd. Semiconductor thin film, method and apparatus for producing the same, and semiconductor device and method of producing the same
US7674663B2 (en) 2002-10-07 2010-03-09 Semiconductor Energy Laboratory Co., Ltd. Method of irradiating laser, laser irradiation system, and manufacturing method of semiconductor device
JP2004247717A (ja) * 2003-01-21 2004-09-02 Semiconductor Energy Lab Co Ltd レーザ照射方法及び半導体装置の作製方法、並びにレーザ照射装置。
JP2004266102A (ja) * 2003-02-28 2004-09-24 Semiconductor Energy Lab Co Ltd レーザ照射装置およびレーザ照射方法、並びに半導体装置の作製方法。
US7700462B2 (en) 2003-02-28 2010-04-20 Semiconductor Energy Laboratory Co., Ltd Laser irradiation method, laser irradiation apparatus, and method for manufacturing semiconductor device
JP4515034B2 (ja) * 2003-02-28 2010-07-28 株式会社半導体エネルギー研究所 半導体装置の作製方法
US7494942B2 (en) 2003-09-29 2009-02-24 Ultratech, Inc. Laser thermal annealing of lightly doped silicon substrates
JP2012231158A (ja) * 2003-09-29 2012-11-22 Ultratech Inc 低濃度ドープシリコン基板のレーザー熱アニール
JP2005210129A (ja) * 2004-01-22 2005-08-04 Ultratech Inc 低濃度ドープされたシリコン基板のレーザ熱アニール
JP2010109375A (ja) * 2004-01-22 2010-05-13 Ultratech Inc 低濃度ドープされたシリコン基板のレーザ熱アニール
JP2011249607A (ja) * 2010-05-27 2011-12-08 V Technology Co Ltd レーザアニール方法及び装置
JP2013055111A (ja) * 2011-09-01 2013-03-21 Phoeton Corp レーザ光合成装置、レーザアニール装置およびレーザアニール方法

Also Published As

Publication number Publication date
JPS641045B2 (ja) 1989-01-10

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