JPS5683927A - Replacement of semiconductor chip carrier - Google Patents

Replacement of semiconductor chip carrier

Info

Publication number
JPS5683927A
JPS5683927A JP16103779A JP16103779A JPS5683927A JP S5683927 A JPS5683927 A JP S5683927A JP 16103779 A JP16103779 A JP 16103779A JP 16103779 A JP16103779 A JP 16103779A JP S5683927 A JPS5683927 A JP S5683927A
Authority
JP
Japan
Prior art keywords
chip carrier
replacement
semiconductor chip
mother board
shielding plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16103779A
Other languages
Japanese (ja)
Inventor
Takehisa Tsujimura
Mamoru Yanagisawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP16103779A priority Critical patent/JPS5683927A/en
Publication of JPS5683927A publication Critical patent/JPS5683927A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE:To accomplish an efficient replacement of a chip carrier by selectively adding a radiant heat thereto through a window in a heat shielding plate following the preheating of a mother board. CONSTITUTION:A mother board 1 in N2 is preheated on a heating plate 8 up to about 150 deg.C. Subsequently, an infrared lamp 9 irradiates it placed on a heat shielding plate 5 and after a solder on an electrode 4 of a chip carrier is solvent in a square column, the chip carrier is removed and a new one is inserted and fused. This eliminates repositioning and rechecking thereby enabling highly reliable replacement along with extremely limited man-hours.
JP16103779A 1979-12-12 1979-12-12 Replacement of semiconductor chip carrier Pending JPS5683927A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16103779A JPS5683927A (en) 1979-12-12 1979-12-12 Replacement of semiconductor chip carrier

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16103779A JPS5683927A (en) 1979-12-12 1979-12-12 Replacement of semiconductor chip carrier

Publications (1)

Publication Number Publication Date
JPS5683927A true JPS5683927A (en) 1981-07-08

Family

ID=15727387

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16103779A Pending JPS5683927A (en) 1979-12-12 1979-12-12 Replacement of semiconductor chip carrier

Country Status (1)

Country Link
JP (1) JPS5683927A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62271496A (en) * 1986-02-13 1987-11-25 デイジタル　イクイプメント　コ−ポレ−シヨン Repair station for surface mounting technology and method ofrepairing circuit board employing surface mounting technology
JPS6355577U (en) * 1986-09-29 1988-04-14
WO1997039611A1 (en) * 1996-04-16 1997-10-23 Matsushita Electric Industrial Co., Ltd. Method and device for removing ic component
US5984165A (en) * 1996-11-29 1999-11-16 Fujitsu Limited Method of bonding a chip part to a substrate using solder bumps
JP2014033137A (en) * 2012-08-06 2014-02-20 Fujitsu Ltd Rework device of electronic component, rework method, and heat insulation cover member for rework device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5147270A (en) * 1974-10-18 1976-04-22 Matsushita Electric Ind Co Ltd Purintohaisenbanno handazukeshuseiho
JPS543958A (en) * 1977-06-13 1979-01-12 Nippon Kokan Kk <Nkk> Liquid agitator

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5147270A (en) * 1974-10-18 1976-04-22 Matsushita Electric Ind Co Ltd Purintohaisenbanno handazukeshuseiho
JPS543958A (en) * 1977-06-13 1979-01-12 Nippon Kokan Kk <Nkk> Liquid agitator

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62271496A (en) * 1986-02-13 1987-11-25 デイジタル　イクイプメント　コ−ポレ−シヨン Repair station for surface mounting technology and method ofrepairing circuit board employing surface mounting technology
JPH0453118B2 (en) * 1986-02-13 1992-08-25 Digital Equipment Corp
JPS6355577U (en) * 1986-09-29 1988-04-14
WO1997039611A1 (en) * 1996-04-16 1997-10-23 Matsushita Electric Industrial Co., Ltd. Method and device for removing ic component
US6156150A (en) * 1996-04-16 2000-12-05 Matsushita Electric Industrial Co., Ltd. IC component separating method and separating apparatus
US5984165A (en) * 1996-11-29 1999-11-16 Fujitsu Limited Method of bonding a chip part to a substrate using solder bumps
JP2014033137A (en) * 2012-08-06 2014-02-20 Fujitsu Ltd Rework device of electronic component, rework method, and heat insulation cover member for rework device

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