JPS562646A - Removal and reinstallation of silicon chip - Google Patents

Removal and reinstallation of silicon chip

Info

Publication number
JPS562646A
JPS562646A JP7816579A JP7816579A JPS562646A JP S562646 A JPS562646 A JP S562646A JP 7816579 A JP7816579 A JP 7816579A JP 7816579 A JP7816579 A JP 7816579A JP S562646 A JPS562646 A JP S562646A
Authority
JP
Japan
Prior art keywords
chip
removal
preheating
temperature
heat ray
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7816579A
Other languages
Japanese (ja)
Inventor
Tasao Soga
Tomiro Yasuda
Kazuya Takahashi
Akihiro Kenmochi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP7816579A priority Critical patent/JPS562646A/en
Publication of JPS562646A publication Critical patent/JPS562646A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/98—Methods for disconnecting semiconductor or solid-state bodies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/799—Apparatus for disconnecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818—Bonding techniques
    • H01L2224/81801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE:To perform the installation and removal of silicon chip without using preheating means by a method wherein a heat ray for the installation and removal of chip is utilized effectively for the preheating of a substrate. CONSTITUTION:A shielding plate 4A has an opening hole at an appointed place having a taper in the direction of a heat source. The shielding plate is constituted by laminating an Au thin film 10 and a protective film 11 like glass, etc., on the chip side of a quartz plate 9. At the place except the installing and removing part of chip, about 10% of heat ray is absorbed by the quartz plate to contribute to the temperature rise, and about 30% of heat ray is reflected 2 to contribute to the temperature rise of a chip to be installed and removed. The remained 60% of heat ray contributes to the preheating of a substrate 7 passing through the shielding plate 4A. When the chip to be installed and removed is heated to the temperature of 350 deg.C by an infrared rays lamp, the temperature of part of substrate 7 surrounding the chip is made to so rise to 150 deg.C as to make the hot plate for preheating to be needless. By this way, the temperature of chip necessary for the installation and removal can be made to arise in the same irradiating time.
JP7816579A 1979-06-22 1979-06-22 Removal and reinstallation of silicon chip Pending JPS562646A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7816579A JPS562646A (en) 1979-06-22 1979-06-22 Removal and reinstallation of silicon chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7816579A JPS562646A (en) 1979-06-22 1979-06-22 Removal and reinstallation of silicon chip

Publications (1)

Publication Number Publication Date
JPS562646A true JPS562646A (en) 1981-01-12

Family

ID=13654311

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7816579A Pending JPS562646A (en) 1979-06-22 1979-06-22 Removal and reinstallation of silicon chip

Country Status (1)

Country Link
JP (1) JPS562646A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01311885A (en) * 1988-06-07 1989-12-15 Ono Sokki Co Ltd Slip measuring device for induction motor
JPH0226239U (en) * 1988-08-08 1990-02-21
US5391501A (en) * 1992-11-12 1995-02-21 Hitachi, Ltd. Method for manufacturing integrated circuits with a step for replacing defective circuit elements
EP0691679A3 (en) * 1994-06-07 1996-05-01 Texas Instruments Inc Process for manufacturing an integrated circuit package assembly
JP2013021325A (en) * 2011-07-06 2013-01-31 Samsung Electronics Co Ltd Device for removing semiconductor chip using laser

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01311885A (en) * 1988-06-07 1989-12-15 Ono Sokki Co Ltd Slip measuring device for induction motor
JPH0226239U (en) * 1988-08-08 1990-02-21
US5391501A (en) * 1992-11-12 1995-02-21 Hitachi, Ltd. Method for manufacturing integrated circuits with a step for replacing defective circuit elements
EP0691679A3 (en) * 1994-06-07 1996-05-01 Texas Instruments Inc Process for manufacturing an integrated circuit package assembly
JP2013021325A (en) * 2011-07-06 2013-01-31 Samsung Electronics Co Ltd Device for removing semiconductor chip using laser
US9768141B2 (en) 2011-07-06 2017-09-19 Samsung Electronics Co., Ltd. Removal apparatuses for semiconductor chips
US10629564B2 (en) 2011-07-06 2020-04-21 Samsung Electronics Co., Ltd. Removal apparatuses for semiconductor chips

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