JPS57103342A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS57103342A
JPS57103342A JP56176057A JP17605781A JPS57103342A JP S57103342 A JPS57103342 A JP S57103342A JP 56176057 A JP56176057 A JP 56176057A JP 17605781 A JP17605781 A JP 17605781A JP S57103342 A JPS57103342 A JP S57103342A
Authority
JP
Japan
Prior art keywords
whisker
lead frame
semiconductor device
leads
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56176057A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6211784B2 (https=
Inventor
Manabu Bonshihara
Yuichi Haneda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP56176057A priority Critical patent/JPS57103342A/ja
Publication of JPS57103342A publication Critical patent/JPS57103342A/ja
Publication of JPS6211784B2 publication Critical patent/JPS6211784B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/456—Materials
    • H10W70/457—Materials of metallic layers on leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP56176057A 1981-11-02 1981-11-02 Semiconductor device Granted JPS57103342A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56176057A JPS57103342A (en) 1981-11-02 1981-11-02 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56176057A JPS57103342A (en) 1981-11-02 1981-11-02 Semiconductor device

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP4595474A Division JPS5731298B2 (https=) 1974-04-25 1974-04-25

Publications (2)

Publication Number Publication Date
JPS57103342A true JPS57103342A (en) 1982-06-26
JPS6211784B2 JPS6211784B2 (https=) 1987-03-14

Family

ID=16006959

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56176057A Granted JPS57103342A (en) 1981-11-02 1981-11-02 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS57103342A (https=)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0396050U (https=) * 1990-01-23 1991-10-01
JP2000223634A (ja) * 1999-01-28 2000-08-11 Hitachi Ltd 半導体装置
US6774466B1 (en) * 1999-01-28 2004-08-10 Renesas Technology Corp. Semiconductor device
JP2006269903A (ja) * 2005-03-25 2006-10-05 Shinko Electric Ind Co Ltd 半導体装置用リードフレーム
WO2011001737A1 (ja) * 2009-06-29 2011-01-06 オーエム産業株式会社 電気部品の製造方法及び電気部品

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0396050U (https=) * 1990-01-23 1991-10-01
US8455986B2 (en) 1999-01-28 2013-06-04 Renesas Electronics Corporation Mosfet package
JP2000223634A (ja) * 1999-01-28 2000-08-11 Hitachi Ltd 半導体装置
US7332757B2 (en) 1999-01-28 2008-02-19 Renesas Technology Corp. MOSFET package
US7342267B2 (en) 1999-01-28 2008-03-11 Renesas Technology Corp. MOSFET package
US7394146B2 (en) 1999-01-28 2008-07-01 Renesas Tehcnology Corp. MOSFET package
US6774466B1 (en) * 1999-01-28 2004-08-10 Renesas Technology Corp. Semiconductor device
US7985991B2 (en) 1999-01-28 2011-07-26 Renesas Electronics Corporation MOSFET package
US7400002B2 (en) 1999-01-28 2008-07-15 Renesas Technology Corp. MOSFET package
US8183607B2 (en) 1999-01-28 2012-05-22 Renesas Electronics Corporation Semiconductor device
US8816411B2 (en) 1999-01-28 2014-08-26 Renesas Electronics Corporation Mosfet package
JP2006269903A (ja) * 2005-03-25 2006-10-05 Shinko Electric Ind Co Ltd 半導体装置用リードフレーム
CN102575369A (zh) * 2009-06-29 2012-07-11 Om产业股份有限公司 电气元件的制造方法和电气元件
WO2011001737A1 (ja) * 2009-06-29 2011-01-06 オーエム産業株式会社 電気部品の製造方法及び電気部品
JP5679216B2 (ja) * 2009-06-29 2015-03-04 オーエム産業株式会社 電気部品の製造方法
CN102575369B (zh) * 2009-06-29 2015-08-05 Om产业股份有限公司 电气元件的制造方法和电气元件

Also Published As

Publication number Publication date
JPS6211784B2 (https=) 1987-03-14

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