JPS5731298B2 - - Google Patents
Info
- Publication number
- JPS5731298B2 JPS5731298B2 JP4595474A JP4595474A JPS5731298B2 JP S5731298 B2 JPS5731298 B2 JP S5731298B2 JP 4595474 A JP4595474 A JP 4595474A JP 4595474 A JP4595474 A JP 4595474A JP S5731298 B2 JPS5731298 B2 JP S5731298B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/072—Connecting or disconnecting of bump connectors
- H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
- H10W90/726—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4595474A JPS5731298B2 (https=) | 1974-04-25 | 1974-04-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4595474A JPS5731298B2 (https=) | 1974-04-25 | 1974-04-25 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56176057A Division JPS57103342A (en) | 1981-11-02 | 1981-11-02 | Semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS50139671A JPS50139671A (https=) | 1975-11-08 |
| JPS5731298B2 true JPS5731298B2 (https=) | 1982-07-03 |
Family
ID=12733659
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4595474A Expired JPS5731298B2 (https=) | 1974-04-25 | 1974-04-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5731298B2 (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57143835A (en) * | 1981-02-27 | 1982-09-06 | Citizen Watch Co Ltd | Mounting method of ic |
| JPS63291445A (ja) * | 1987-05-23 | 1988-11-29 | Fuji Plant Kogyo Kk | リ−ドフレ−ムへの２色部分メッキ方法 |
| KR0165883B1 (ko) * | 1988-09-16 | 1999-02-01 | 존 엠. 클락 | 테이프 자동화 본딩 프로세스용의 금/주석 공정 본딩 |
-
1974
- 1974-04-25 JP JP4595474A patent/JPS5731298B2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS50139671A (https=) | 1975-11-08 |