JPS5696875A - Semiconductor pressure sensing device and manufacture thereof - Google Patents

Semiconductor pressure sensing device and manufacture thereof

Info

Publication number
JPS5696875A
JPS5696875A JP17272379A JP17272379A JPS5696875A JP S5696875 A JPS5696875 A JP S5696875A JP 17272379 A JP17272379 A JP 17272379A JP 17272379 A JP17272379 A JP 17272379A JP S5696875 A JPS5696875 A JP S5696875A
Authority
JP
Japan
Prior art keywords
diaphragm
lead
support
electrodes
pressure sensing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP17272379A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6325512B2 (enExample
Inventor
Shoichi Kakimoto
Toru Kameda
Toshio Sogo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP17272379A priority Critical patent/JPS5696875A/ja
Publication of JPS5696875A publication Critical patent/JPS5696875A/ja
Publication of JPS6325512B2 publication Critical patent/JPS6325512B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D48/00—Individual devices not covered by groups H10D1/00 - H10D44/00
    • H10D48/50—Devices controlled by mechanical forces, e.g. pressure
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/681—Shapes or dispositions thereof comprising holes not having chips therein, e.g. for outgassing, underfilling or bond wire passage
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01515—Forming coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires

Landscapes

  • Pressure Sensors (AREA)
JP17272379A 1979-12-29 1979-12-29 Semiconductor pressure sensing device and manufacture thereof Granted JPS5696875A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17272379A JPS5696875A (en) 1979-12-29 1979-12-29 Semiconductor pressure sensing device and manufacture thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17272379A JPS5696875A (en) 1979-12-29 1979-12-29 Semiconductor pressure sensing device and manufacture thereof

Publications (2)

Publication Number Publication Date
JPS5696875A true JPS5696875A (en) 1981-08-05
JPS6325512B2 JPS6325512B2 (enExample) 1988-05-25

Family

ID=15947128

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17272379A Granted JPS5696875A (en) 1979-12-29 1979-12-29 Semiconductor pressure sensing device and manufacture thereof

Country Status (1)

Country Link
JP (1) JPS5696875A (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5878470A (ja) * 1981-11-04 1983-05-12 Mitsubishi Electric Corp 半導体圧力検出装置
JP2006200926A (ja) * 2005-01-18 2006-08-03 Denso Corp 圧力センサ
JP2013024824A (ja) * 2011-07-26 2013-02-04 Denso Corp センサ装置の製造方法
JP2023540238A (ja) * 2020-08-25 2023-09-22 エドワーズ ライフサイエンシーズ コーポレイション 埋め込み型圧力センサパッケージング

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53103375A (en) * 1977-02-22 1978-09-08 Toshiba Corp Semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53103375A (en) * 1977-02-22 1978-09-08 Toshiba Corp Semiconductor device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5878470A (ja) * 1981-11-04 1983-05-12 Mitsubishi Electric Corp 半導体圧力検出装置
JP2006200926A (ja) * 2005-01-18 2006-08-03 Denso Corp 圧力センサ
JP2013024824A (ja) * 2011-07-26 2013-02-04 Denso Corp センサ装置の製造方法
JP2023540238A (ja) * 2020-08-25 2023-09-22 エドワーズ ライフサイエンシーズ コーポレイション 埋め込み型圧力センサパッケージング

Also Published As

Publication number Publication date
JPS6325512B2 (enExample) 1988-05-25

Similar Documents

Publication Publication Date Title
US4295115A (en) Semiconductor absolute pressure transducer assembly and method
US4712082A (en) Pressure sensor
JPS5696875A (en) Semiconductor pressure sensing device and manufacture thereof
JPS57136132A (en) Semiconductor pressure transducer
GB2029094A (en) Pressure transducers having piezoresistive strain gauges and methods of manufacturing such transducers
JPH0196549A (ja) センサ素子
JPS5796573A (en) Semiconductor strain transducer
JPS5759389A (en) Semiconductor strain gauge type pressure sensor
JPH0317087B2 (enExample)
JPS63193053A (ja) 高温用ｐＨ測定装置
CN210571073U (zh) 一种cvd金刚石材料热电偶装置
KR830000113B1 (ko) 반도체 압력 변환기
JPH0810202B2 (ja) ガス検知方法
JPS5649548A (en) Semiconductor device
JPS56148870A (en) Semiconductor presssure converter
JPS60125535A (ja) 表面温度センサ
JPS55124271A (en) Semiconductor pressure transducer
SU122240A1 (ru) Полупроводниковый датчик концентрации (давлени ) паров
JPS59169183A (ja) ストレインゲ−ジ型半導体圧力センサ−
JPS551176A (en) Semiconductor strain convertor
JPH06213742A (ja) 表面加圧形半導体圧力センサ
JPS5533024A (en) Semiconductor device for converting pressure
JPS57204176A (en) Semiconductor pressure converter
JPS6175535A (ja) 半導体装置
JPS57114248A (en) Semiconductor device