JPS5696875A - Semiconductor pressure sensing device and manufacture thereof - Google Patents

Semiconductor pressure sensing device and manufacture thereof

Info

Publication number
JPS5696875A
JPS5696875A JP17272379A JP17272379A JPS5696875A JP S5696875 A JPS5696875 A JP S5696875A JP 17272379 A JP17272379 A JP 17272379A JP 17272379 A JP17272379 A JP 17272379A JP S5696875 A JPS5696875 A JP S5696875A
Authority
JP
Japan
Prior art keywords
diaphragm
lead
support
electrodes
pressure sensing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP17272379A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6325512B2 (enrdf_load_html_response
Inventor
Shoichi Kakimoto
Toru Kameda
Toshio Sogo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP17272379A priority Critical patent/JPS5696875A/ja
Publication of JPS5696875A publication Critical patent/JPS5696875A/ja
Publication of JPS6325512B2 publication Critical patent/JPS6325512B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D48/00—Individual devices not covered by groups H10D1/00 - H10D44/00
    • H10D48/50—Devices controlled by mechanical forces, e.g. pressure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/10155—Shape being other than a cuboid
    • H01L2924/10158—Shape being other than a cuboid at the passive surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15151—Shape the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections

Landscapes

  • Pressure Sensors (AREA)
JP17272379A 1979-12-29 1979-12-29 Semiconductor pressure sensing device and manufacture thereof Granted JPS5696875A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17272379A JPS5696875A (en) 1979-12-29 1979-12-29 Semiconductor pressure sensing device and manufacture thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17272379A JPS5696875A (en) 1979-12-29 1979-12-29 Semiconductor pressure sensing device and manufacture thereof

Publications (2)

Publication Number Publication Date
JPS5696875A true JPS5696875A (en) 1981-08-05
JPS6325512B2 JPS6325512B2 (enrdf_load_html_response) 1988-05-25

Family

ID=15947128

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17272379A Granted JPS5696875A (en) 1979-12-29 1979-12-29 Semiconductor pressure sensing device and manufacture thereof

Country Status (1)

Country Link
JP (1) JPS5696875A (enrdf_load_html_response)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5878470A (ja) * 1981-11-04 1983-05-12 Mitsubishi Electric Corp 半導体圧力検出装置
JP2006200926A (ja) * 2005-01-18 2006-08-03 Denso Corp 圧力センサ
JP2013024824A (ja) * 2011-07-26 2013-02-04 Denso Corp センサ装置の製造方法
JP2023540238A (ja) * 2020-08-25 2023-09-22 エドワーズ ライフサイエンシーズ コーポレイション 埋め込み型圧力センサパッケージング

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53103375A (en) * 1977-02-22 1978-09-08 Toshiba Corp Semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53103375A (en) * 1977-02-22 1978-09-08 Toshiba Corp Semiconductor device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5878470A (ja) * 1981-11-04 1983-05-12 Mitsubishi Electric Corp 半導体圧力検出装置
JP2006200926A (ja) * 2005-01-18 2006-08-03 Denso Corp 圧力センサ
JP2013024824A (ja) * 2011-07-26 2013-02-04 Denso Corp センサ装置の製造方法
JP2023540238A (ja) * 2020-08-25 2023-09-22 エドワーズ ライフサイエンシーズ コーポレイション 埋め込み型圧力センサパッケージング

Also Published As

Publication number Publication date
JPS6325512B2 (enrdf_load_html_response) 1988-05-25

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