JPS5696842A - Microwave plasma treating apparatus - Google Patents

Microwave plasma treating apparatus

Info

Publication number
JPS5696842A
JPS5696842A JP17290679A JP17290679A JPS5696842A JP S5696842 A JPS5696842 A JP S5696842A JP 17290679 A JP17290679 A JP 17290679A JP 17290679 A JP17290679 A JP 17290679A JP S5696842 A JPS5696842 A JP S5696842A
Authority
JP
Japan
Prior art keywords
packing
chamber
cooling
cover plate
plasma treating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP17290679A
Other languages
Japanese (ja)
Other versions
JPS594849B2 (en
Inventor
Hiroshi Yano
Masanao Itoga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP54172906A priority Critical patent/JPS594849B2/en
Publication of JPS5696842A publication Critical patent/JPS5696842A/en
Publication of JPS594849B2 publication Critical patent/JPS594849B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/18—Vacuum locks ; Means for obtaining or maintaining the desired pressure within the vessel
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/002—Cooling arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/16—Vessels
    • H01J2237/166—Sealing means

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Analytical Chemistry (AREA)
  • Drying Of Semiconductors (AREA)

Abstract

PURPOSE:To maintain sufficient airtightness in a plasma treating chamber contained in a cavity chamber in the microwave plasma treating apparatus for a long period of time by arranging a cooling air diffuser at a packing inserted between the treating chamber body and a cover plate for cooling the packing. CONSTITUTION:The quartz treating chamber 1 is contained in the cavity chamber 8 having an antenna 9 on a ceiling while an exhaust port 2 and a gas supply port 3 provided at the chamber 1 are projected out of the chamber 8. This chamber 1 is formed of its body and a cover plate 4 for placing the semiconductor wafer 6, and an O-ring packing 5 formed of fluorine rubber is interposed at the contacting part therebetween to be airtight thereat. In this configuration an annular cooling gas diffuser 7 is provided around the peripheral edge of the cover plate 4 and the collar of the body for nipping the packing 5 is also provided. Cooling gas such as N2, Ar or the like is diffused toward the packing 5, thereby cooling the packing 5. Thus, the temperature rise of the packing 5 can be suppressed.
JP54172906A 1979-12-28 1979-12-28 Microwave plasma processing equipment Expired JPS594849B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP54172906A JPS594849B2 (en) 1979-12-28 1979-12-28 Microwave plasma processing equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP54172906A JPS594849B2 (en) 1979-12-28 1979-12-28 Microwave plasma processing equipment

Publications (2)

Publication Number Publication Date
JPS5696842A true JPS5696842A (en) 1981-08-05
JPS594849B2 JPS594849B2 (en) 1984-02-01

Family

ID=15950527

Family Applications (1)

Application Number Title Priority Date Filing Date
JP54172906A Expired JPS594849B2 (en) 1979-12-28 1979-12-28 Microwave plasma processing equipment

Country Status (1)

Country Link
JP (1) JPS594849B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59125628A (en) * 1982-12-29 1984-07-20 Fujitsu Ltd Microwave treating device
JPS63164218U (en) * 1986-10-15 1988-10-26
JPS6467908A (en) * 1987-09-08 1989-03-14 Sumitomo Metal Ind Plasma processing device

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JAPANESE JOURNAL OF APPLIEP PHYSICS=1977 *

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59125628A (en) * 1982-12-29 1984-07-20 Fujitsu Ltd Microwave treating device
JPS63164218U (en) * 1986-10-15 1988-10-26
JPS6467908A (en) * 1987-09-08 1989-03-14 Sumitomo Metal Ind Plasma processing device
JP2625756B2 (en) * 1987-09-08 1997-07-02 住友金属工業株式会社 Plasma process equipment

Also Published As

Publication number Publication date
JPS594849B2 (en) 1984-02-01

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