TW350981B - Method and system for plasma-processing - Google Patents
Method and system for plasma-processingInfo
- Publication number
- TW350981B TW350981B TW086118960A TW86118960A TW350981B TW 350981 B TW350981 B TW 350981B TW 086118960 A TW086118960 A TW 086118960A TW 86118960 A TW86118960 A TW 86118960A TW 350981 B TW350981 B TW 350981B
- Authority
- TW
- Taiwan
- Prior art keywords
- chamber
- plasma
- processing
- mixed gas
- semiconductor substrate
- Prior art date
Links
Landscapes
- Drying Of Semiconductors (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Chemical Vapour Deposition (AREA)
- ing And Chemical Polishing (AREA)
Abstract
A method for processing a semiconductor substrate placed in a chamber, a mixed gas of oxygen and inert gas is supplied into the chamber and plasma is generated with the mixed gas in the chamber, for generation of plasma in the mixed gas in the chamber and before processing the semiconductor substrate, heating the inside of the chamber to a predetermined temperature.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP28647496A JPH10130872A (en) | 1996-10-29 | 1996-10-29 | Plasma treatment |
Publications (1)
Publication Number | Publication Date |
---|---|
TW350981B true TW350981B (en) | 1999-01-21 |
Family
ID=17704871
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW086118960A TW350981B (en) | 1996-10-29 | 1997-12-16 | Method and system for plasma-processing |
Country Status (2)
Country | Link |
---|---|
JP (1) | JPH10130872A (en) |
TW (1) | TW350981B (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6129808A (en) * | 1998-03-31 | 2000-10-10 | Lam Research Corporation | Low contamination high density plasma etch chambers and methods for making the same |
JP4490704B2 (en) * | 2004-02-27 | 2010-06-30 | 株式会社日立ハイテクノロジーズ | Plasma processing method |
JP2007158230A (en) * | 2005-12-08 | 2007-06-21 | Nec Electronics Corp | Cleaning method for plasma etching equipment and plasma etching equipment |
JP4490938B2 (en) * | 2006-04-20 | 2010-06-30 | 株式会社日立ハイテクノロジーズ | Plasma processing equipment |
US20100151150A1 (en) * | 2007-05-18 | 2010-06-17 | Ulvac, Inc. | Plasma processing apparatus and manufacturing method of deposition-inhibitory member |
KR102614972B1 (en) * | 2020-02-03 | 2023-12-19 | 주식회사 히타치하이테크 | Plasma processing device and plasma processing method |
-
1996
- 1996-10-29 JP JP28647496A patent/JPH10130872A/en active Pending
-
1997
- 1997-12-16 TW TW086118960A patent/TW350981B/en active
Also Published As
Publication number | Publication date |
---|---|
JPH10130872A (en) | 1998-05-19 |
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