JPS5694761A - Epoxy resin composition for semiconductor sealing - Google Patents
Epoxy resin composition for semiconductor sealingInfo
- Publication number
- JPS5694761A JPS5694761A JP17248179A JP17248179A JPS5694761A JP S5694761 A JPS5694761 A JP S5694761A JP 17248179 A JP17248179 A JP 17248179A JP 17248179 A JP17248179 A JP 17248179A JP S5694761 A JPS5694761 A JP S5694761A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- added
- phenol
- resin composition
- hardening accelerator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003822 epoxy resin Substances 0.000 title abstract 4
- 229920000647 polyepoxide Polymers 0.000 title abstract 4
- 238000007789 sealing Methods 0.000 title abstract 2
- 239000000203 mixture Substances 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 abstract 4
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 abstract 3
- 229920003986 novolac Polymers 0.000 abstract 3
- QMKYBPDZANOJGF-UHFFFAOYSA-N benzene-1,3,5-tricarboxylic acid Chemical compound OC(=O)C1=CC(C(O)=O)=CC(C(O)=O)=C1 QMKYBPDZANOJGF-UHFFFAOYSA-N 0.000 abstract 2
- 150000001732 carboxylic acid derivatives Chemical class 0.000 abstract 2
- 239000003795 chemical substances by application Substances 0.000 abstract 2
- 239000000376 reactant Substances 0.000 abstract 2
- ARCGXLSVLAOJQL-UHFFFAOYSA-N trimellitic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 abstract 2
- 239000004593 Epoxy Substances 0.000 abstract 1
- 150000001875 compounds Chemical class 0.000 abstract 1
- 230000005494 condensation Effects 0.000 abstract 1
- 238000009833 condensation Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 229920005989 resin Polymers 0.000 abstract 1
- 239000011347 resin Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17248179A JPS5694761A (en) | 1979-12-28 | 1979-12-28 | Epoxy resin composition for semiconductor sealing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17248179A JPS5694761A (en) | 1979-12-28 | 1979-12-28 | Epoxy resin composition for semiconductor sealing |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5694761A true JPS5694761A (en) | 1981-07-31 |
| JPS621612B2 JPS621612B2 (enrdf_load_stackoverflow) | 1987-01-14 |
Family
ID=15942782
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17248179A Granted JPS5694761A (en) | 1979-12-28 | 1979-12-28 | Epoxy resin composition for semiconductor sealing |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5694761A (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0276247A (ja) * | 1988-09-12 | 1990-03-15 | Nitto Denko Corp | 半導体装置 |
| US6495270B1 (en) | 1998-02-19 | 2002-12-17 | Hitachi Chemical Company, Ltd. | Compounds, hardening accelerator, resin composition, and electronic part device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5126999A (enrdf_load_stackoverflow) * | 1974-08-29 | 1976-03-05 | Mitsubishi Electric Corp | |
| JPS5323273A (en) * | 1976-08-13 | 1978-03-03 | Mitsubishi Electric Corp | Production of resin seal ing type semiconductor device |
| JPS555929A (en) * | 1978-06-26 | 1980-01-17 | Nitto Electric Ind Co Ltd | Semiconductor sealing epoxy resin composition |
-
1979
- 1979-12-28 JP JP17248179A patent/JPS5694761A/ja active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5126999A (enrdf_load_stackoverflow) * | 1974-08-29 | 1976-03-05 | Mitsubishi Electric Corp | |
| JPS5323273A (en) * | 1976-08-13 | 1978-03-03 | Mitsubishi Electric Corp | Production of resin seal ing type semiconductor device |
| JPS555929A (en) * | 1978-06-26 | 1980-01-17 | Nitto Electric Ind Co Ltd | Semiconductor sealing epoxy resin composition |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0276247A (ja) * | 1988-09-12 | 1990-03-15 | Nitto Denko Corp | 半導体装置 |
| US6495270B1 (en) | 1998-02-19 | 2002-12-17 | Hitachi Chemical Company, Ltd. | Compounds, hardening accelerator, resin composition, and electronic part device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS621612B2 (enrdf_load_stackoverflow) | 1987-01-14 |
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