JPS5687677A - Method of producing copper foil for printed circuit - Google Patents

Method of producing copper foil for printed circuit

Info

Publication number
JPS5687677A
JPS5687677A JP16411079A JP16411079A JPS5687677A JP S5687677 A JPS5687677 A JP S5687677A JP 16411079 A JP16411079 A JP 16411079A JP 16411079 A JP16411079 A JP 16411079A JP S5687677 A JPS5687677 A JP S5687677A
Authority
JP
Japan
Prior art keywords
copper foil
film
oxide
surface side
amount
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16411079A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6133908B2 (enrdf_load_stackoverflow
Inventor
Eiji Hino
Masanori Hayashi
Takashi Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Eneos Corp
Original Assignee
Nippon Mining Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mining Co Ltd filed Critical Nippon Mining Co Ltd
Priority to JP16411079A priority Critical patent/JPS5687677A/ja
Publication of JPS5687677A publication Critical patent/JPS5687677A/ja
Publication of JPS6133908B2 publication Critical patent/JPS6133908B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
    • C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
    • C23C22/24—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 containing hexavalent chromium compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemical Coating By Surface Reaction (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Chemical Treatment Of Metals (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP16411079A 1979-12-19 1979-12-19 Method of producing copper foil for printed circuit Granted JPS5687677A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16411079A JPS5687677A (en) 1979-12-19 1979-12-19 Method of producing copper foil for printed circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16411079A JPS5687677A (en) 1979-12-19 1979-12-19 Method of producing copper foil for printed circuit

Publications (2)

Publication Number Publication Date
JPS5687677A true JPS5687677A (en) 1981-07-16
JPS6133908B2 JPS6133908B2 (enrdf_load_stackoverflow) 1986-08-05

Family

ID=15786935

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16411079A Granted JPS5687677A (en) 1979-12-19 1979-12-19 Method of producing copper foil for printed circuit

Country Status (1)

Country Link
JP (1) JPS5687677A (enrdf_load_stackoverflow)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0441696A (ja) * 1990-06-05 1992-02-12 Fukuda Metal Foil & Powder Co Ltd 印刷回路用銅箔の表面処理方法
EP0618755A1 (en) * 1993-03-29 1994-10-05 Japan Energy Corporation Copper foil for printed circuits and process for producing the same
EP0541997A3 (en) * 1991-11-15 1994-11-02 Nikko Gould Foil Kk Surface treatment method of a copper foil for printed circuits
US5389446A (en) * 1992-02-19 1995-02-14 Nikko Gould Foil Co., Ltd. Copper foil for printed circuits
WO2000036188A3 (de) * 1998-12-11 2000-11-23 Bolta Werke Gmbh Verfahren zur herstellung einer selbsttragenden metallfolie
JP2011129858A (ja) * 2009-11-18 2011-06-30 Dainippon Printing Co Ltd 配線シート及び太陽電池モジュール並びにこれらの製造方法
JP2013004236A (ja) * 2011-06-14 2013-01-07 Dainippon Printing Co Ltd 太陽電池用集電シートの配線パターン形成用の導電性基材
US9666746B2 (en) 2011-06-14 2017-05-30 Dai Nippon Printing Co., Ltd. Conductive base for forming wiring pattern of collector sheet for solar cells, and method for producing collector sheet for solar cells

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014208893A (ja) * 2013-03-28 2014-11-06 古河電気工業株式会社 表面処理銅箔及び該銅箔の表面処理方法、並びに、銅張積層板及び該積層板の製造方法

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0441696A (ja) * 1990-06-05 1992-02-12 Fukuda Metal Foil & Powder Co Ltd 印刷回路用銅箔の表面処理方法
EP0541997A3 (en) * 1991-11-15 1994-11-02 Nikko Gould Foil Kk Surface treatment method of a copper foil for printed circuits
US5389446A (en) * 1992-02-19 1995-02-14 Nikko Gould Foil Co., Ltd. Copper foil for printed circuits
EP0618755A1 (en) * 1993-03-29 1994-10-05 Japan Energy Corporation Copper foil for printed circuits and process for producing the same
US5552234A (en) * 1993-03-29 1996-09-03 Japan Energy Corporation Copper foil for printed circuits
WO2000036188A3 (de) * 1998-12-11 2000-11-23 Bolta Werke Gmbh Verfahren zur herstellung einer selbsttragenden metallfolie
US6632341B1 (en) 1998-12-11 2003-10-14 Bolta-Werke Gmbh Method for producing a self-supporting metal film
JP2011129858A (ja) * 2009-11-18 2011-06-30 Dainippon Printing Co Ltd 配線シート及び太陽電池モジュール並びにこれらの製造方法
JP2013004236A (ja) * 2011-06-14 2013-01-07 Dainippon Printing Co Ltd 太陽電池用集電シートの配線パターン形成用の導電性基材
US9666746B2 (en) 2011-06-14 2017-05-30 Dai Nippon Printing Co., Ltd. Conductive base for forming wiring pattern of collector sheet for solar cells, and method for producing collector sheet for solar cells

Also Published As

Publication number Publication date
JPS6133908B2 (enrdf_load_stackoverflow) 1986-08-05

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