JPS5687675A - Production of copper foil - Google Patents

Production of copper foil

Info

Publication number
JPS5687675A
JPS5687675A JP16410879A JP16410879A JPS5687675A JP S5687675 A JPS5687675 A JP S5687675A JP 16410879 A JP16410879 A JP 16410879A JP 16410879 A JP16410879 A JP 16410879A JP S5687675 A JPS5687675 A JP S5687675A
Authority
JP
Japan
Prior art keywords
copper foil
zinc
printed circuit
amount
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16410879A
Other languages
English (en)
Other versions
JPS6133906B2 (ja
Inventor
Eiji Hino
Masanori Hayashi
Takashi Suzuki
Minoru Yamaguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Eneos Corp
Original Assignee
Nippon Mining Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mining Co Ltd filed Critical Nippon Mining Co Ltd
Priority to JP16410879A priority Critical patent/JPS5687675A/ja
Publication of JPS5687675A publication Critical patent/JPS5687675A/ja
Publication of JPS6133906B2 publication Critical patent/JPS6133906B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
    • C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
    • C23C22/24—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 containing hexavalent chromium compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemical Coating By Surface Reaction (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Chemical Treatment Of Metals (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP16410879A 1979-12-19 1979-12-19 Production of copper foil Granted JPS5687675A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16410879A JPS5687675A (en) 1979-12-19 1979-12-19 Production of copper foil

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16410879A JPS5687675A (en) 1979-12-19 1979-12-19 Production of copper foil

Publications (2)

Publication Number Publication Date
JPS5687675A true JPS5687675A (en) 1981-07-16
JPS6133906B2 JPS6133906B2 (ja) 1986-08-05

Family

ID=15786900

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16410879A Granted JPS5687675A (en) 1979-12-19 1979-12-19 Production of copper foil

Country Status (1)

Country Link
JP (1) JPS5687675A (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0541997A2 (en) * 1991-11-15 1993-05-19 Nikko Gould Foil Co., Ltd. Surface treatment method of a copper foil for printed circuits
EP1355518A1 (en) * 2001-01-22 2003-10-22 Sony Chemicals Corporation Flexible printed wiring board
JP2012158828A (ja) * 2011-02-03 2012-08-23 Furukawa Electric Co Ltd:The 表面処理銅箔及びその製造方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012184498A (ja) * 2011-02-18 2012-09-27 Jx Nippon Mining & Metals Corp 電磁波シールド用電解銅箔及びその製造方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0541997A2 (en) * 1991-11-15 1993-05-19 Nikko Gould Foil Co., Ltd. Surface treatment method of a copper foil for printed circuits
EP0541997A3 (en) * 1991-11-15 1994-11-02 Nikko Gould Foil Kk Surface treatment method of a copper foil for printed circuits
EP1355518A1 (en) * 2001-01-22 2003-10-22 Sony Chemicals Corporation Flexible printed wiring board
EP1355518A4 (en) * 2001-01-22 2011-06-01 Sony Chem & Inf Device Corp CIRCUIT BOARD PRINTED S FLEXIBLE
JP2012158828A (ja) * 2011-02-03 2012-08-23 Furukawa Electric Co Ltd:The 表面処理銅箔及びその製造方法

Also Published As

Publication number Publication date
JPS6133906B2 (ja) 1986-08-05

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