JPS5685839A - Structure for heat resistant electrode and wiring - Google Patents
Structure for heat resistant electrode and wiringInfo
- Publication number
- JPS5685839A JPS5685839A JP16154479A JP16154479A JPS5685839A JP S5685839 A JPS5685839 A JP S5685839A JP 16154479 A JP16154479 A JP 16154479A JP 16154479 A JP16154479 A JP 16154479A JP S5685839 A JPS5685839 A JP S5685839A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- aluminum
- electrode
- substrate
- heat resistant
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electrodes Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
PURPOSE:To reduce the contacting resistance of an electrode wiring structure by forming a heat resistant wire of double layer structure of Cr-Ag through an aluminum-doped layer on an Si substrate. CONSTITUTION:An SiO2 film is formed on an Si substrate 17 on which an N<+> layer and an N<-> layer are laminated and a diffused layer is formed as prescribed, is selectively opened with windows, and an aluminum layer 25 is covered thereon. After it is heated at 450 deg.C for approx. 30 minutes, the layer 25 is etched and removed. With this treatment an aluminum-doped layer 26 is formed on the aluminum layer portion making direct contact with the Si substrate. Subsequently, two-layer electrode wires of Cr layer 27 and Ag layer 28 is selectively formed thereon. Thereafter, it is covered with an insulating protective film 29, and a bump electrode 30 and two-layer electrode of Au layer 31 and Ag layer 32 are attached thereto. According to this configuration an electric wire having durability against a sealing temperature of approx. 700 deg.C, a contact resistance not increased, and electric characteristics as designed values can be formed.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16154479A JPS5685839A (en) | 1979-12-14 | 1979-12-14 | Structure for heat resistant electrode and wiring |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16154479A JPS5685839A (en) | 1979-12-14 | 1979-12-14 | Structure for heat resistant electrode and wiring |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5685839A true JPS5685839A (en) | 1981-07-13 |
Family
ID=15737114
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16154479A Pending JPS5685839A (en) | 1979-12-14 | 1979-12-14 | Structure for heat resistant electrode and wiring |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5685839A (en) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4936517A (en) * | 1972-08-08 | 1974-04-04 | ||
JPS51126762A (en) * | 1975-04-28 | 1976-11-05 | Oki Electric Ind Co Ltd | Integrated circuit manufacturing process |
-
1979
- 1979-12-14 JP JP16154479A patent/JPS5685839A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4936517A (en) * | 1972-08-08 | 1974-04-04 | ||
JPS51126762A (en) * | 1975-04-28 | 1976-11-05 | Oki Electric Ind Co Ltd | Integrated circuit manufacturing process |
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