JPS5680157A - Hybrid integrated circuit substrate for contactless igniting device - Google Patents

Hybrid integrated circuit substrate for contactless igniting device

Info

Publication number
JPS5680157A
JPS5680157A JP15677179A JP15677179A JPS5680157A JP S5680157 A JPS5680157 A JP S5680157A JP 15677179 A JP15677179 A JP 15677179A JP 15677179 A JP15677179 A JP 15677179A JP S5680157 A JPS5680157 A JP S5680157A
Authority
JP
Japan
Prior art keywords
integrated circuit
hybrid integrated
voltage
terminal
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15677179A
Other languages
Japanese (ja)
Inventor
Hitoshi Ishikawa
Terumi Nakazawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP15677179A priority Critical patent/JPS5680157A/en
Publication of JPS5680157A publication Critical patent/JPS5680157A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/01—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate comprising only passive thin-film or thick-film elements formed on a common insulating substrate
    • H01L27/013—Thick-film circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Ignition Installations For Internal Combustion Engines (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)

Abstract

PURPOSE:To provide a hybrid integrated circuit with voltage-resisting property and obtain a higher packaging density by forming thick film type capacitors between the conductor connected to the supply voltage terminal and the conductor connected to the earth terminal in order to discharge the surge voltage. CONSTITUTION:On an insulative substrate 1 for a hybrid integrated circuit, resistance patterns 4B, 4C, 4D, 4E, and 4G for the conductor connected to the input terminal are formed and an earth conductor 4F is formed being connected to an earth terminal 6 through a dielectric 5 of a proper width. Between the resistance patterns and the earth conductor, capacitors 10 are formed to discharge the surge voltage applied to the voltage terminal. Therefore, a hybrid integrated circuit of excellent voltage-resisting property can be formed. Moreover, because there is no necessity for providing capacitor chips individually, a higher packaging density can be obtained, and so an excellent hybrid integrated circuit for a contactless igniting device can be provided.
JP15677179A 1979-12-05 1979-12-05 Hybrid integrated circuit substrate for contactless igniting device Pending JPS5680157A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15677179A JPS5680157A (en) 1979-12-05 1979-12-05 Hybrid integrated circuit substrate for contactless igniting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15677179A JPS5680157A (en) 1979-12-05 1979-12-05 Hybrid integrated circuit substrate for contactless igniting device

Publications (1)

Publication Number Publication Date
JPS5680157A true JPS5680157A (en) 1981-07-01

Family

ID=15634948

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15677179A Pending JPS5680157A (en) 1979-12-05 1979-12-05 Hybrid integrated circuit substrate for contactless igniting device

Country Status (1)

Country Link
JP (1) JPS5680157A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002299480A (en) * 2001-03-30 2002-10-11 Diamond Electric Mfg Co Ltd Surge protective structure in dielectric of hybrid integrated circuit

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002299480A (en) * 2001-03-30 2002-10-11 Diamond Electric Mfg Co Ltd Surge protective structure in dielectric of hybrid integrated circuit

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