JPS5678170A - Semiconductor memory - Google Patents
Semiconductor memoryInfo
- Publication number
- JPS5678170A JPS5678170A JP14616779A JP14616779A JPS5678170A JP S5678170 A JPS5678170 A JP S5678170A JP 14616779 A JP14616779 A JP 14616779A JP 14616779 A JP14616779 A JP 14616779A JP S5678170 A JPS5678170 A JP S5678170A
- Authority
- JP
- Japan
- Prior art keywords
- read
- gate
- write
- transistor
- rate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title 1
- 239000000758 substrate Substances 0.000 abstract 2
- 239000012535 impurity Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/04—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS
- G11C16/0408—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells containing floating gate transistors
- G11C16/0441—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells containing floating gate transistors comprising cells containing multiple floating gate devices, e.g. separate read-and-write FAMOS transistors with connected floating gates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/788—Field effect transistors with field effect produced by an insulated gate with floating gate
- H01L29/7881—Programmable transistors with only two possible levels of programmation
- H01L29/7884—Programmable transistors with only two possible levels of programmation charging by hot carrier injection
- H01L29/7885—Hot carrier injection from the channel
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K3/00—Circuits for generating electric pulses; Monostable, bistable or multistable circuits
- H03K3/02—Generators characterised by the type of circuit or by the means used for producing pulses
- H03K3/353—Generators characterised by the type of circuit or by the means used for producing pulses by the use, as active elements, of field-effect transistors with internal or external positive feedback
- H03K3/356—Bistable circuits
- H03K3/356008—Bistable circuits ensuring a predetermined initial state when the supply voltage has been applied; storing the actual state when the supply voltage fails
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B69/00—Erasable-and-programmable ROM [EPROM] devices not provided for in groups H10B41/00 - H10B63/00, e.g. ultraviolet erasable-and-programmable ROM [UVEPROM] devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP54146167A JPS5929155B2 (ja) | 1979-11-12 | 1979-11-12 | 半導体記憶装置 |
EP80902128A EP0040251B1 (en) | 1979-11-12 | 1980-11-06 | Semiconductor memory device |
US06/280,008 US4403307A (en) | 1979-11-12 | 1980-11-06 | Semiconductor memory device |
PCT/JP1980/000276 WO1981001484A1 (en) | 1979-11-12 | 1980-11-06 | Semiconductor memory device |
DE8080902128T DE3071967D1 (en) | 1979-11-12 | 1980-11-06 | Semiconductor memory device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP54146167A JPS5929155B2 (ja) | 1979-11-12 | 1979-11-12 | 半導体記憶装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5678170A true JPS5678170A (en) | 1981-06-26 |
JPS5929155B2 JPS5929155B2 (ja) | 1984-07-18 |
Family
ID=15401639
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP54146167A Expired JPS5929155B2 (ja) | 1979-11-12 | 1979-11-12 | 半導体記憶装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US4403307A (ja) |
EP (1) | EP0040251B1 (ja) |
JP (1) | JPS5929155B2 (ja) |
DE (1) | DE3071967D1 (ja) |
WO (1) | WO1981001484A1 (ja) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59117270A (ja) * | 1982-12-24 | 1984-07-06 | Mitsubishi Electric Corp | 浮遊ゲ−ト型不揮発性mos半導体メモリ装置 |
JPH06188427A (ja) * | 1991-09-25 | 1994-07-08 | American Teleph & Telegr Co <Att> | Eeprom |
US5676562A (en) * | 1992-03-18 | 1997-10-14 | Yazaki Corporation | Connector adapted to be mounted on a glass plate |
JP2008257804A (ja) * | 2007-04-05 | 2008-10-23 | Renesas Technology Corp | 半導体装置 |
US9837727B2 (en) | 2012-09-14 | 2017-12-05 | Saint-Gobain Glass France | Pane having an electrical connection element |
US9967967B2 (en) | 2012-09-14 | 2018-05-08 | Saint-Gobain Glass France | Pane having an electrical connection element |
US10305239B2 (en) | 2011-05-10 | 2019-05-28 | Saint-Gobain Glass France | Pane comprising an electrical connection element |
US10355378B2 (en) | 2011-05-10 | 2019-07-16 | Saint-Gobain Glass France | Pane having an electrical connection element |
US11217907B2 (en) | 2011-05-10 | 2022-01-04 | Saint-Gobain Glass France | Disk having an electric connecting element |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4558344A (en) * | 1982-01-29 | 1985-12-10 | Seeq Technology, Inc. | Electrically-programmable and electrically-erasable MOS memory device |
JPS62163376A (ja) * | 1986-01-14 | 1987-07-20 | Fujitsu Ltd | 半導体記憶装置の製造方法 |
US4769788A (en) * | 1986-09-22 | 1988-09-06 | Ncr Corporation | Shared line direct write nonvolatile memory cell array |
US5055897A (en) * | 1988-07-27 | 1991-10-08 | Intel Corporation | Semiconductor cell for neural network and the like |
FR2635410B1 (fr) * | 1988-08-11 | 1991-08-02 | Sgs Thomson Microelectronics | Memoire de type eprom a haute densite d'integration avec une organisation en damier et un facteur de couplage ameliore et procede de fabrication |
US5262987A (en) * | 1988-11-17 | 1993-11-16 | Seiko Instruments Inc. | Floating gate semiconductor nonvolatile memory having impurity doped regions for low voltage operation |
DE69017755T2 (de) * | 1989-05-24 | 1995-07-13 | Texas Instruments Inc | Band/Band induzierte Injektion heisser Elektronen aus dem Substrat. |
KR100257661B1 (ko) * | 1991-01-17 | 2000-06-01 | 윌리엄 비. 켐플러 | 불휘발성 메모리 셀 구조물 및 그 형성 방법 |
US5739569A (en) * | 1991-05-15 | 1998-04-14 | Texas Instruments Incorporated | Non-volatile memory cell with oxide and nitride tunneling layers |
US5231299A (en) * | 1992-03-24 | 1993-07-27 | International Business Machines Corporation | Structure and fabrication method for EEPROM memory cell with selective channel implants |
FR2691289A1 (fr) * | 1992-05-15 | 1993-11-19 | Thomson Csf | Dispositif semiconducteur à effet de champ, procédé de réalisation et application à un dispositif à commande matricielle. |
US5329487A (en) * | 1993-03-08 | 1994-07-12 | Altera Corporation | Two transistor flash EPROM cell |
TW293981B (ja) | 1995-07-21 | 1996-12-21 | Philips Electronics Nv | |
JP4036923B2 (ja) * | 1997-07-17 | 2008-01-23 | 株式会社半導体エネルギー研究所 | 表示装置およびその駆動回路 |
TW337607B (en) | 1997-08-06 | 1998-08-01 | Mos Electronics Taiwan Inc | Process for forming a contact hole in an EEPROM with NOR construction |
US6781881B2 (en) * | 2002-12-19 | 2004-08-24 | Taiwan Semiconductor Manufacturing Company | Two-transistor flash cell for large endurance application |
US7038947B2 (en) * | 2002-12-19 | 2006-05-02 | Taiwan Semiconductor Manufacturing Co., Ltd. | Two-transistor flash cell for large endurance application |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5140084A (ja) * | 1974-10-01 | 1976-04-03 | Mitsubishi Electric Corp |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5321837B2 (ja) * | 1973-05-11 | 1978-07-05 | ||
JPS5387185A (en) * | 1977-01-11 | 1978-08-01 | Oki Electric Ind Co Ltd | Half-fixed electronic variable resistor |
DE2723738C2 (de) * | 1977-05-26 | 1984-11-08 | Deutsche Itt Industries Gmbh, 7800 Freiburg | Halbleiterspeicherzelle für das nichtflüchtige Speichern elektrischer Ladung und Verfahren zu deren Programmierung |
US4257056A (en) * | 1979-06-27 | 1981-03-17 | National Semiconductor Corporation | Electrically erasable read only memory |
-
1979
- 1979-11-12 JP JP54146167A patent/JPS5929155B2/ja not_active Expired
-
1980
- 1980-11-06 DE DE8080902128T patent/DE3071967D1/de not_active Expired
- 1980-11-06 EP EP80902128A patent/EP0040251B1/en not_active Expired
- 1980-11-06 US US06/280,008 patent/US4403307A/en not_active Expired - Lifetime
- 1980-11-06 WO PCT/JP1980/000276 patent/WO1981001484A1/ja active IP Right Grant
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5140084A (ja) * | 1974-10-01 | 1976-04-03 | Mitsubishi Electric Corp |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59117270A (ja) * | 1982-12-24 | 1984-07-06 | Mitsubishi Electric Corp | 浮遊ゲ−ト型不揮発性mos半導体メモリ装置 |
JPH06188427A (ja) * | 1991-09-25 | 1994-07-08 | American Teleph & Telegr Co <Att> | Eeprom |
US5676562A (en) * | 1992-03-18 | 1997-10-14 | Yazaki Corporation | Connector adapted to be mounted on a glass plate |
JP2008257804A (ja) * | 2007-04-05 | 2008-10-23 | Renesas Technology Corp | 半導体装置 |
US10305239B2 (en) | 2011-05-10 | 2019-05-28 | Saint-Gobain Glass France | Pane comprising an electrical connection element |
US10355378B2 (en) | 2011-05-10 | 2019-07-16 | Saint-Gobain Glass France | Pane having an electrical connection element |
US11217907B2 (en) | 2011-05-10 | 2022-01-04 | Saint-Gobain Glass France | Disk having an electric connecting element |
US11456546B2 (en) | 2011-05-10 | 2022-09-27 | Saint-Gobain Glass France | Pane having an electrical connection element |
US9837727B2 (en) | 2012-09-14 | 2017-12-05 | Saint-Gobain Glass France | Pane having an electrical connection element |
US9967967B2 (en) | 2012-09-14 | 2018-05-08 | Saint-Gobain Glass France | Pane having an electrical connection element |
Also Published As
Publication number | Publication date |
---|---|
WO1981001484A1 (en) | 1981-05-28 |
EP0040251B1 (en) | 1987-05-06 |
JPS5929155B2 (ja) | 1984-07-18 |
US4403307A (en) | 1983-09-06 |
EP0040251A4 (en) | 1984-08-10 |
DE3071967D1 (en) | 1987-06-11 |
EP0040251A1 (en) | 1981-11-25 |
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