JPS5673477A - Housing vessel for optical sensor - Google Patents

Housing vessel for optical sensor

Info

Publication number
JPS5673477A
JPS5673477A JP15014879A JP15014879A JPS5673477A JP S5673477 A JPS5673477 A JP S5673477A JP 15014879 A JP15014879 A JP 15014879A JP 15014879 A JP15014879 A JP 15014879A JP S5673477 A JPS5673477 A JP S5673477A
Authority
JP
Japan
Prior art keywords
vessel
transmitting plate
light transmitting
light receiving
base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15014879A
Other languages
Japanese (ja)
Inventor
Toshiharu Ito
Sadao Matsumura
Katsuyoshi Fukuda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP15014879A priority Critical patent/JPS5673477A/en
Publication of JPS5673477A publication Critical patent/JPS5673477A/en
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
    • G01J5/34—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using capacitors, e.g. pyroelectric capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4918—Disposition being disposed on at least two different sides of the body, e.g. dual array

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Light Receiving Elements (AREA)

Abstract

PURPOSE:To obtain a simple housing vessel having high mass-productivity by a method wherein a light transmitting plate is formed by a hexagonal pellet cut out from a Si monocrystal when the light transmitting plate is mounted to a light receiving window of the vessel housing an optical sensor. CONSTITUTION:An infrared ray detecting element 1 is formed in such a manner that an Au light receiving surface electrode 1c is made up on a surface of a pyroelectric crystal 1a consisting of LiTaO3 and a Cr electrode 1b on the back. Lead wires 3 are each connected to the electrodes 1c, 1b, one is attached to a conductive base 2 directly and the other to an electrode terminal 5 penetrating the base 2 through an insulating material 4, and the element 1 is hung in midair. A cylindrical metallic vessel 6, a lower section thereof has a flange 6a and an upper section thereof has a light receiving window 7 surrounded by a flange 6b, is placed on the base 2, covering the element 1, and a light transmitting plate 8 is fastened onto the window 7. In this constitution, the light transmitting plate 8 is not formed in a circular shape, and a hexagonal pellet cut out from a Si monocrystal wafer without waste is used as the plate 8, thus simplifying the formation of the vessel while reducing cost.
JP15014879A 1979-11-20 1979-11-20 Housing vessel for optical sensor Pending JPS5673477A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15014879A JPS5673477A (en) 1979-11-20 1979-11-20 Housing vessel for optical sensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15014879A JPS5673477A (en) 1979-11-20 1979-11-20 Housing vessel for optical sensor

Publications (1)

Publication Number Publication Date
JPS5673477A true JPS5673477A (en) 1981-06-18

Family

ID=15490538

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15014879A Pending JPS5673477A (en) 1979-11-20 1979-11-20 Housing vessel for optical sensor

Country Status (1)

Country Link
JP (1) JPS5673477A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6018559U (en) * 1983-07-13 1985-02-07 松下電子工業株式会社 cap with glass window
JPS6115742U (en) * 1984-07-04 1986-01-29 株式会社フジクラ Cap for seal package
JPS62177170U (en) * 1986-04-29 1987-11-10
JPS6398637U (en) * 1986-12-17 1988-06-25
JPH0494754U (en) * 1991-01-10 1992-08-17
WO2010098277A1 (en) * 2009-02-25 2010-09-02 住友電気工業株式会社 Optical semiconductor device

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6018559U (en) * 1983-07-13 1985-02-07 松下電子工業株式会社 cap with glass window
JPS6115742U (en) * 1984-07-04 1986-01-29 株式会社フジクラ Cap for seal package
JPS62177170U (en) * 1986-04-29 1987-11-10
JPS6398637U (en) * 1986-12-17 1988-06-25
JPH0494754U (en) * 1991-01-10 1992-08-17
WO2010098277A1 (en) * 2009-02-25 2010-09-02 住友電気工業株式会社 Optical semiconductor device

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