JPS6398637U - - Google Patents
Info
- Publication number
- JPS6398637U JPS6398637U JP19297386U JP19297386U JPS6398637U JP S6398637 U JPS6398637 U JP S6398637U JP 19297386 U JP19297386 U JP 19297386U JP 19297386 U JP19297386 U JP 19297386U JP S6398637 U JPS6398637 U JP S6398637U
- Authority
- JP
- Japan
- Prior art keywords
- window
- semiconductors
- view
- opening
- metal cap
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000011521 glass Substances 0.000 claims description 2
- 238000002844 melting Methods 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
Landscapes
- Semiconductor Lasers (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Non-Volatile Memory (AREA)
Description
第１図Ａは、本考案の一実施例の平面図、同図
Ｂは、同実施例の断面図、第２図Ａは、同実施例
に用いられる窓材の平面図、同図Ｂは、同窓材の
正面図、第３図は、本考案の作用を示す説明図、
第４図Ａは、従来の半導体用窓付パツケージの平
面図、同図Ｂは、同半導体用窓付パツケージの正
面図、第５図Ａは、従来の半導体用窓付パツケー
ジに用いられる窓材の平面図、同図Ｂは、同窓材
の正面図である。
１０……金属キヤツプ、１１……開口部、１２
……窓部、１３……窓板、１４……低融点ガラス
、１５……半導体用窓付パツケージ。
1A is a plan view of an embodiment of the present invention, FIG. 1B is a sectional view of the embodiment, FIG. 2A is a plan view of a window material used in the embodiment, and FIG. , a front view of the alumni material, and FIG. 3 is an explanatory diagram showing the action of the present invention.
Figure 4A is a plan view of a conventional package with a window for semiconductors, Figure B is a front view of the same package with a window for semiconductors, and Figure 5A is a window material used in a conventional package with a window for semiconductors. Figure B is a front view of the alumni material. 10...metal cap, 11...opening, 12
...Window part, 13 ... Window plate, 14 ... Low melting point glass, 15 ... Windowed package for semiconductor.
Claims (1)
してなる金属キヤツプと、前記窓部を塞ぐように
周辺部に低融点ガラスを介して貼着された多角形
状の窓板とを具備することを特徴とする半導体用
窓付パツケージ。 Equipped with a metal cap with an opening at one end and a window at the other end, and a polygonal window plate attached to the periphery via low-melting glass to cover the window. A package cage with a window for semiconductors, which is characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19297386U JPS6398637U (en) | 1986-12-17 | 1986-12-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19297386U JPS6398637U (en) | 1986-12-17 | 1986-12-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6398637U true JPS6398637U (en) | 1988-06-25 |
Family
ID=31148557
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19297386U Pending JPS6398637U (en) | 1986-12-17 | 1986-12-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6398637U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5673477A (en) * | 1979-11-20 | 1981-06-18 | Toshiba Corp | Housing vessel for optical sensor |
-
1986
- 1986-12-17 JP JP19297386U patent/JPS6398637U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5673477A (en) * | 1979-11-20 | 1981-06-18 | Toshiba Corp | Housing vessel for optical sensor |