JPH0267647U - - Google Patents
Info
- Publication number
- JPH0267647U JPH0267647U JP1988146067U JP14606788U JPH0267647U JP H0267647 U JPH0267647 U JP H0267647U JP 1988146067 U JP1988146067 U JP 1988146067U JP 14606788 U JP14606788 U JP 14606788U JP H0267647 U JPH0267647 U JP H0267647U
- Authority
- JP
- Japan
- Prior art keywords
- ceramic
- package
- sealing surface
- cap
- concave groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 claims description 13
- 239000011521 glass Substances 0.000 claims description 2
- 238000002844 melting Methods 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 238000007789 sealing Methods 0.000 claims 2
- 230000008018 melting Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Landscapes
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Description
第１図ａ，ｂはそれぞれ本考案の一実施例のセ
ラミツクパツケージの縦断面図及び平面図、第２
図は本考案の他の実施例のセラミツクパツケージ
の縦断面図、第３図は従来のセラミツクパツケー
ジの縦断面図である。
１……セラミツクケース、２……セラミツクキ
ヤツプ、３……凹状の溝、４，８，１１……低融
点ガラス又は樹脂、５……セラミツクケース、６
……セラミツクキヤツプ、７……凹状の溝、９…
…セラミツクケース、１０……セラミツクキヤツ
プ。
1a and 1b are a vertical sectional view and a plan view, respectively, of a ceramic package according to an embodiment of the present invention;
The figure is a longitudinal sectional view of a ceramic package according to another embodiment of the present invention, and FIG. 3 is a longitudinal sectional view of a conventional ceramic package. 1... Ceramic case, 2... Ceramic cap, 3... Concave groove, 4, 8, 11... Low melting point glass or resin, 5... Ceramic case, 6
... Ceramic cap, 7 ... Concave groove, 9 ...
...ceramic case, 10...ceramic cap.
Claims (1)
にて封止を行なうセラミツクパツケージにおいて
、パツケージの外表面に向かう封止面に接する近
くのセラミツクキヤツプの外表面又は、前記封止
面に接する近くのパツケージの外表面のいずれか
に凹状の溝を設けたことを特徴とするセラミツク
パツケージ。 In a ceramic package in which a ceramic cap is sealed with low-melting glass or resin, the outer surface of the ceramic cap near the sealing surface facing the outer surface of the package or the outside of the package near the sealing surface. A ceramic package characterized by having a concave groove on one of its surfaces.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988146067U JPH0267647U (en) | 1988-11-08 | 1988-11-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988146067U JPH0267647U (en) | 1988-11-08 | 1988-11-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0267647U true JPH0267647U (en) | 1990-05-22 |
Family
ID=31415219
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988146067U Pending JPH0267647U (en) | 1988-11-08 | 1988-11-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0267647U (en) |
-
1988
- 1988-11-08 JP JP1988146067U patent/JPH0267647U/ja active Pending