JPS5673441A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS5673441A JPS5673441A JP15002979A JP15002979A JPS5673441A JP S5673441 A JPS5673441 A JP S5673441A JP 15002979 A JP15002979 A JP 15002979A JP 15002979 A JP15002979 A JP 15002979A JP S5673441 A JPS5673441 A JP S5673441A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- junction surface
- depletion
- mesa
- layers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title abstract 2
- 238000005530 etching Methods 0.000 abstract 2
- 230000015556 catabolic process Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 230000002093 peripheral effect Effects 0.000 abstract 1
- 230000001681 protective effect Effects 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Bipolar Transistors (AREA)
- Formation Of Insulating Films (AREA)
Abstract
PURPOSE:To obtain the high-tension resistance for the subject semiconductor device by a method wherein a junction surface is provided in such a manner that one of layers is annually surrounding the other layer, a main junction surface is formed by performing a mesa etching on one of the layers in such way that the edge of the junction surface of the other layer is located on the mesa-side circumferential surface. CONSTITUTION:The P<+> layer 41 of an N type substrate 2 is projected by performing a mesa etching, the junction end of a P<+> layer 42 is extended to a mesa- side surface 5 and it is annularly surrounding the outside of the layer 41. The edge of the main junction surface 11 and the edge of an auxiliary junction surface 12 are covered by a protective film 3. When an inverse voltage is applied, a depletion layer width xd(V) is generated, and when a depletion layer 61 is enlarged to the lateral direction and reaches to the P<+> layer 42, a floating potential is induced on the layer 42, a new depletion layer 62 is generated on the peripheral section of the auxiliary junction surface 12, and a depletion layer width xd(L) is generated by the composition of the above two depletion layers, thereby enabling to weaken the surface field strength and to increase the breakdown voltage.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15002979A JPS5673441A (en) | 1979-11-21 | 1979-11-21 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15002979A JPS5673441A (en) | 1979-11-21 | 1979-11-21 | Semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5673441A true JPS5673441A (en) | 1981-06-18 |
Family
ID=15487935
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15002979A Pending JPS5673441A (en) | 1979-11-21 | 1979-11-21 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5673441A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009055063A (en) * | 2003-04-09 | 2009-03-12 | Kansai Electric Power Co Inc:The | Gate turnoff thyristor |
-
1979
- 1979-11-21 JP JP15002979A patent/JPS5673441A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009055063A (en) * | 2003-04-09 | 2009-03-12 | Kansai Electric Power Co Inc:The | Gate turnoff thyristor |
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