JPS5655449A - Thermosetting resin composition - Google Patents

Thermosetting resin composition

Info

Publication number
JPS5655449A
JPS5655449A JP13082479A JP13082479A JPS5655449A JP S5655449 A JPS5655449 A JP S5655449A JP 13082479 A JP13082479 A JP 13082479A JP 13082479 A JP13082479 A JP 13082479A JP S5655449 A JPS5655449 A JP S5655449A
Authority
JP
Japan
Prior art keywords
monomaleimide
resin composition
maleimide compound
compound
butadiene polymer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13082479A
Other languages
English (en)
Other versions
JPS6153382B2 (ja
Inventor
Hikotada Tsuboi
Motoo Kawamata
Masayuki Oba
Nobushi Koga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Toatsu Chemicals Inc
Original Assignee
Mitsui Toatsu Chemicals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Toatsu Chemicals Inc filed Critical Mitsui Toatsu Chemicals Inc
Priority to JP13082479A priority Critical patent/JPS5655449A/ja
Publication of JPS5655449A publication Critical patent/JPS5655449A/ja
Publication of JPS6153382B2 publication Critical patent/JPS6153382B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Graft Or Block Polymers (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP13082479A 1979-10-12 1979-10-12 Thermosetting resin composition Granted JPS5655449A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13082479A JPS5655449A (en) 1979-10-12 1979-10-12 Thermosetting resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13082479A JPS5655449A (en) 1979-10-12 1979-10-12 Thermosetting resin composition

Publications (2)

Publication Number Publication Date
JPS5655449A true JPS5655449A (en) 1981-05-16
JPS6153382B2 JPS6153382B2 (ja) 1986-11-17

Family

ID=15043563

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13082479A Granted JPS5655449A (en) 1979-10-12 1979-10-12 Thermosetting resin composition

Country Status (1)

Country Link
JP (1) JPS5655449A (ja)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS587450A (ja) * 1981-07-07 1983-01-17 Mitsubishi Gas Chem Co Inc 硬化性樹脂コロイド溶液の製造法
JPS6426669A (en) * 1988-07-06 1989-01-27 Mitsubishi Gas Chemical Co Production of curable polymer colloidal solution
JP2017125196A (ja) * 2012-01-19 2017-07-20 イソラ・ユーエスエイ・コーポレーシヨンＩｓｏｌａ ＵＳＡ Ｃｏｒｐ． 合成樹脂並びにそれらから製造されるワニス、プレプレグおよび積層物
WO2022102781A1 (ja) * 2020-11-16 2022-05-19 昭和電工マテリアルズ株式会社 マレイミド樹脂組成物、プリプレグ、積層板、樹脂フィルム、プリント配線板及び半導体パッケージ
US12024624B2 (en) 2020-11-16 2024-07-02 Resonac Corporation Maleimide resin composition, prepreg, laminated board, resin film, printed wiring board, and semiconductor package

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS587450A (ja) * 1981-07-07 1983-01-17 Mitsubishi Gas Chem Co Inc 硬化性樹脂コロイド溶液の製造法
JPH0252655B2 (ja) * 1981-07-07 1990-11-14 Mitsubishi Gas Chemical Co
JPS6426669A (en) * 1988-07-06 1989-01-27 Mitsubishi Gas Chemical Co Production of curable polymer colloidal solution
JPH0333727B2 (ja) * 1988-07-06 1991-05-20 Mitsubishi Gas Chemical Co
JP2017125196A (ja) * 2012-01-19 2017-07-20 イソラ・ユーエスエイ・コーポレーシヨンＩｓｏｌａ ＵＳＡ Ｃｏｒｐ． 合成樹脂並びにそれらから製造されるワニス、プレプレグおよび積層物
WO2022102781A1 (ja) * 2020-11-16 2022-05-19 昭和電工マテリアルズ株式会社 マレイミド樹脂組成物、プリプレグ、積層板、樹脂フィルム、プリント配線板及び半導体パッケージ
US12024624B2 (en) 2020-11-16 2024-07-02 Resonac Corporation Maleimide resin composition, prepreg, laminated board, resin film, printed wiring board, and semiconductor package

Also Published As

Publication number Publication date
JPS6153382B2 (ja) 1986-11-17

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