JPS5622311A - Thermosetting resin composition - Google Patents

Thermosetting resin composition

Info

Publication number
JPS5622311A
JPS5622311A JP9679379A JP9679379A JPS5622311A JP S5622311 A JPS5622311 A JP S5622311A JP 9679379 A JP9679379 A JP 9679379A JP 9679379 A JP9679379 A JP 9679379A JP S5622311 A JPS5622311 A JP S5622311A
Authority
JP
Japan
Prior art keywords
halogen
resin composition
alkyl
formula
group
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9679379A
Other languages
Japanese (ja)
Inventor
Noboru Yamazaki
Tsutomu Takase
Yoshio Morimoto
Teruo Yuasa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Toatsu Chemicals Inc
Original Assignee
Mitsui Toatsu Chemicals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Toatsu Chemicals Inc filed Critical Mitsui Toatsu Chemicals Inc
Priority to JP9679379A priority Critical patent/JPS5622311A/en
Publication of JPS5622311A publication Critical patent/JPS5622311A/en
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/12Unsaturated polyimide precursors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)

Abstract

PURPOSE:Titled composition which is rapid-curing, excellent in heat resistance and useful as an adhesive or the like, comprising a maleimide compound as a specific bismaleimide or polymaleimide, an alkenylphenol derivative, a linear dimer thereof, etc. CONSTITUTION:The resin composition of the purpose is obtained by mixing at least one maleimide compound selected from the group consisting of a bismaleimide of formula I, wherein R1, R2, R3 and R4 are each H, halogen, a 1-10C alkyl or phenyl and Z is a bivalent organic group of at least 2C, and a polymaleimide of formula II, wherein R5-R10 are each H, halogen or a 1-10C alkyl which may be branched, and n>0, with at least one compound selected from the group consisting of an alkenylphenol derivative of formula III, wherein R11 and R12 are each H, halogen or a 1-10C alkyl, X is H or halogen, Y is hydroxyl or the like, and m1+m2+ m3=5, a linear dimer thereof and a polymer thereof.
JP9679379A 1979-07-31 1979-07-31 Thermosetting resin composition Pending JPS5622311A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9679379A JPS5622311A (en) 1979-07-31 1979-07-31 Thermosetting resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9679379A JPS5622311A (en) 1979-07-31 1979-07-31 Thermosetting resin composition

Publications (1)

Publication Number Publication Date
JPS5622311A true JPS5622311A (en) 1981-03-02

Family

ID=14174508

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9679379A Pending JPS5622311A (en) 1979-07-31 1979-07-31 Thermosetting resin composition

Country Status (1)

Country Link
JP (1) JPS5622311A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60184509A (en) * 1984-03-02 1985-09-20 Hitachi Ltd Thermosetting resin composition and prepolymer thereof
US4737568A (en) * 1985-07-20 1988-04-12 The Boots Company Plc Curable resin from bis-imide amino acid hydrazide and alkenyl phenol or ether
JPS63139943A (en) * 1986-12-02 1988-06-11 Asahi Glass Co Ltd Thermosetting resin composition
US4888402A (en) * 1986-08-06 1989-12-19 Ciba-Geigy Corporation Copolymes formed from N-hydroxyphenylmaleinimide (derivatives) and allyl compounds
US5302679A (en) * 1992-08-06 1994-04-12 Loctite Corporation Anaerobic compositions which expand when post-cured
JP2007253366A (en) * 2006-03-20 2007-10-04 Mitsubishi Plastics Ind Ltd Double-sided copper-clad board

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52994A (en) * 1975-06-19 1977-01-06 Ciba Geigy Ag Imide grouppcontaining crosslinked polymer and preparation thereof
JPS538882A (en) * 1976-07-13 1978-01-26 Aida Eng Ltd Device for stopping press

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52994A (en) * 1975-06-19 1977-01-06 Ciba Geigy Ag Imide grouppcontaining crosslinked polymer and preparation thereof
JPS538882A (en) * 1976-07-13 1978-01-26 Aida Eng Ltd Device for stopping press

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60184509A (en) * 1984-03-02 1985-09-20 Hitachi Ltd Thermosetting resin composition and prepolymer thereof
US4737568A (en) * 1985-07-20 1988-04-12 The Boots Company Plc Curable resin from bis-imide amino acid hydrazide and alkenyl phenol or ether
US4888402A (en) * 1986-08-06 1989-12-19 Ciba-Geigy Corporation Copolymes formed from N-hydroxyphenylmaleinimide (derivatives) and allyl compounds
JPS63139943A (en) * 1986-12-02 1988-06-11 Asahi Glass Co Ltd Thermosetting resin composition
JPH0415262B2 (en) * 1986-12-02 1992-03-17 Asahi Glass Co Ltd
US5302679A (en) * 1992-08-06 1994-04-12 Loctite Corporation Anaerobic compositions which expand when post-cured
US5373075A (en) * 1992-08-06 1994-12-13 Loctite Corporation Anaerobic compositions which expand when post-cured
JP2007253366A (en) * 2006-03-20 2007-10-04 Mitsubishi Plastics Ind Ltd Double-sided copper-clad board

Similar Documents

Publication Publication Date Title
JPS5611917A (en) Thermosetting resin composition
KR900006277A (en) Cyanato esters, curable resins thereof and articles made therefrom
FI905491A0 (en) STARENKOPOLYMER OCH FOERFARANDE FOER DESS FRAMSTAELLNING.
JPS5690823A (en) Curable resin composition
JPS5690824A (en) Curable resin composition
JPS5622311A (en) Thermosetting resin composition
JPS56141349A (en) Curable polyphenylene ether type resin composition
JPS55108450A (en) Hardening composition
GB1487258A (en) Alpha,beta-unsaturated schiff-base chain extension reactions for high temperature polymers
JPS5659834A (en) Thermosetting resin composition
MY107554A (en) Polyhydric phenol, and epoxy resin and epoxy resin composition derived therefrom.
JPS557861A (en) Thermosetting resin composition
JPS5655449A (en) Thermosetting resin composition
JPS5521461A (en) Resin composition
JPS6445426A (en) Polymer composition for sealing semiconductor device
JPS5670012A (en) Curable resin composition
JPS564637A (en) Antistatic resin composition having excellent nonstickness
JPS5655427A (en) Thermosetting resin composition
JPS5457566A (en) Heat-resistant composition for molding sliding bodies
JPS6462321A (en) Reactive polymer composition and method for reaction molding thereof
JPS5638319A (en) Heat-resistant resin composition
JPS57170957A (en) Heat-resistant and flame-resistant resin composition
JPS5626921A (en) Curable resin composition
JPS56125423A (en) Epoxy resin composition
JPS56141315A (en) Thermosetting resin composition