JPS6445426A - Polymer composition for sealing semiconductor device - Google Patents

Polymer composition for sealing semiconductor device

Info

Publication number
JPS6445426A
JPS6445426A JP20266087A JP20266087A JPS6445426A JP S6445426 A JPS6445426 A JP S6445426A JP 20266087 A JP20266087 A JP 20266087A JP 20266087 A JP20266087 A JP 20266087A JP S6445426 A JPS6445426 A JP S6445426A
Authority
JP
Japan
Prior art keywords
polymer
bifunctional
formula
semiconductor device
polymer composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP20266087A
Other languages
Japanese (ja)
Inventor
Shinetsu Fujieda
Akira Yoshizumi
Kazutaka Matsumoto
Takeshi Uchida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP20266087A priority Critical patent/JPS6445426A/en
Publication of JPS6445426A publication Critical patent/JPS6445426A/en
Pending legal-status Critical Current

Links

Landscapes

  • Sealing Material Composition (AREA)
  • Polyethers (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE:To obtain the titled composition having excellent thermal shock resistance, low coefficient of thermal expansion and moldability, comprising a specific maleimide polymer, a phenol aralkyl polymer as a curing agent and an organic phosphine compound as a curing catalyst CONSTITUTION:The aimed composition comprising (A) (i) an N,N'-substituted bismaleimide compound shown by formula I (X is bifunctional hydrocarbon, e.g. monocyclic or polycyclic arylene such as alkylene or cycloalkylene or bifunctional hydrocarbon bonded by bifunctional atom group such as -CH2-, -CO-, -SO2-, or -CONH-) and/or (ii) a poly(phenylmethylene)polymaleimide shown by formula II (n is 1-5) as a maleimide polymer, (B) a phenol aralkyl polymer as a curing agent and (C) an organic phosphine compound as a curing catalyst.
JP20266087A 1987-08-14 1987-08-14 Polymer composition for sealing semiconductor device Pending JPS6445426A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20266087A JPS6445426A (en) 1987-08-14 1987-08-14 Polymer composition for sealing semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20266087A JPS6445426A (en) 1987-08-14 1987-08-14 Polymer composition for sealing semiconductor device

Publications (1)

Publication Number Publication Date
JPS6445426A true JPS6445426A (en) 1989-02-17

Family

ID=16461032

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20266087A Pending JPS6445426A (en) 1987-08-14 1987-08-14 Polymer composition for sealing semiconductor device

Country Status (1)

Country Link
JP (1) JPS6445426A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0359500A2 (en) * 1988-09-12 1990-03-21 MITSUI TOATSU CHEMICALS, Inc. Resin compositions for sealing semiconductors
WO2018058760A1 (en) * 2016-09-28 2018-04-05 广东生益科技股份有限公司 Silicone epoxy resin containing phosphine imide, preparation method therefor and application thereof
US10994516B2 (en) * 2017-09-07 2021-05-04 Taiwan Union Technology Corporation Resin composition, and pre-preg, metal-clad laminate and printed circuit board prepared using the same
JP2022058582A (en) * 2016-07-20 2022-04-12 昭和電工マテリアルズ株式会社 Resin composition, resin layer-attached support, prepreg, laminate, multilayer printed board and printed wiring board for millimeter wave radar

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0359500A2 (en) * 1988-09-12 1990-03-21 MITSUI TOATSU CHEMICALS, Inc. Resin compositions for sealing semiconductors
JP2022058582A (en) * 2016-07-20 2022-04-12 昭和電工マテリアルズ株式会社 Resin composition, resin layer-attached support, prepreg, laminate, multilayer printed board and printed wiring board for millimeter wave radar
WO2018058760A1 (en) * 2016-09-28 2018-04-05 广东生益科技股份有限公司 Silicone epoxy resin containing phosphine imide, preparation method therefor and application thereof
US10994516B2 (en) * 2017-09-07 2021-05-04 Taiwan Union Technology Corporation Resin composition, and pre-preg, metal-clad laminate and printed circuit board prepared using the same

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