JPS57170957A - Heat-resistant and flame-resistant resin composition - Google Patents
Heat-resistant and flame-resistant resin compositionInfo
- Publication number
- JPS57170957A JPS57170957A JP5499081A JP5499081A JPS57170957A JP S57170957 A JPS57170957 A JP S57170957A JP 5499081 A JP5499081 A JP 5499081A JP 5499081 A JP5499081 A JP 5499081A JP S57170957 A JPS57170957 A JP S57170957A
- Authority
- JP
- Japan
- Prior art keywords
- compound
- polyfunctional
- resin composition
- resistant
- maleimide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Abstract
PURPOSE: To prepare a resin composition having excellent high-temperature electrical properties, mechanical properties, heat resistance, and flame resistance, and suitable for the manufacturing of a laminated board and molded article, by modifying a polyfunctional cyanamide compound or a polyfunctional N-cyano-N- amide compound with a maleimide compound.
CONSTITUTION: The resin composition contains (A) a polyfunctional cyanamide compound or a polyfunctional N-cyano-N-amide compound of formulaIor formula II (R is H, benzenesulfonyl, benzenecarbonyl, or benzyl; at least one R is H) and (B) a maleimide compound having at least one maleimide group in the molecule, e.g. phenylmaleimide, N,N'-phenylenebismaleimide, etc. The amount of the maleimide group of the compound (B) is 0.25W0.5 equivlent per 1 equivalent of the component (A). Both resin components have excellent mutual compatibility, and the composition maintains homogeneous structure even after curing.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5499081A JPS57170957A (en) | 1981-04-14 | 1981-04-14 | Heat-resistant and flame-resistant resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5499081A JPS57170957A (en) | 1981-04-14 | 1981-04-14 | Heat-resistant and flame-resistant resin composition |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS57170957A true JPS57170957A (en) | 1982-10-21 |
Family
ID=12986081
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5499081A Pending JPS57170957A (en) | 1981-04-14 | 1981-04-14 | Heat-resistant and flame-resistant resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57170957A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61246234A (en) * | 1985-04-24 | 1986-11-01 | Hitachi Ltd | Thermosetting resin composition and wiring board |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53149300A (en) * | 1977-06-01 | 1978-12-26 | Ciba Geigy Ag | Thermal setting composite material and its manufacture |
-
1981
- 1981-04-14 JP JP5499081A patent/JPS57170957A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53149300A (en) * | 1977-06-01 | 1978-12-26 | Ciba Geigy Ag | Thermal setting composite material and its manufacture |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61246234A (en) * | 1985-04-24 | 1986-11-01 | Hitachi Ltd | Thermosetting resin composition and wiring board |
JPH0719936B2 (en) * | 1985-04-24 | 1995-03-06 | 株式会社日立製作所 | Wiring board |
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