JPS57170957A - Heat-resistant and flame-resistant resin composition - Google Patents

Heat-resistant and flame-resistant resin composition

Info

Publication number
JPS57170957A
JPS57170957A JP5499081A JP5499081A JPS57170957A JP S57170957 A JPS57170957 A JP S57170957A JP 5499081 A JP5499081 A JP 5499081A JP 5499081 A JP5499081 A JP 5499081A JP S57170957 A JPS57170957 A JP S57170957A
Authority
JP
Japan
Prior art keywords
compound
polyfunctional
resin composition
resistant
maleimide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5499081A
Other languages
Japanese (ja)
Inventor
Sadao Kajiura
Tetsuo Okuyama
Takeo Ito
Shiyuichi Suzuki
Moriyasu Wada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP5499081A priority Critical patent/JPS57170957A/en
Publication of JPS57170957A publication Critical patent/JPS57170957A/en
Pending legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)

Abstract

PURPOSE: To prepare a resin composition having excellent high-temperature electrical properties, mechanical properties, heat resistance, and flame resistance, and suitable for the manufacturing of a laminated board and molded article, by modifying a polyfunctional cyanamide compound or a polyfunctional N-cyano-N- amide compound with a maleimide compound.
CONSTITUTION: The resin composition contains (A) a polyfunctional cyanamide compound or a polyfunctional N-cyano-N-amide compound of formulaIor formula II (R is H, benzenesulfonyl, benzenecarbonyl, or benzyl; at least one R is H) and (B) a maleimide compound having at least one maleimide group in the molecule, e.g. phenylmaleimide, N,N'-phenylenebismaleimide, etc. The amount of the maleimide group of the compound (B) is 0.25W0.5 equivlent per 1 equivalent of the component (A). Both resin components have excellent mutual compatibility, and the composition maintains homogeneous structure even after curing.
COPYRIGHT: (C)1982,JPO&Japio
JP5499081A 1981-04-14 1981-04-14 Heat-resistant and flame-resistant resin composition Pending JPS57170957A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5499081A JPS57170957A (en) 1981-04-14 1981-04-14 Heat-resistant and flame-resistant resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5499081A JPS57170957A (en) 1981-04-14 1981-04-14 Heat-resistant and flame-resistant resin composition

Publications (1)

Publication Number Publication Date
JPS57170957A true JPS57170957A (en) 1982-10-21

Family

ID=12986081

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5499081A Pending JPS57170957A (en) 1981-04-14 1981-04-14 Heat-resistant and flame-resistant resin composition

Country Status (1)

Country Link
JP (1) JPS57170957A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61246234A (en) * 1985-04-24 1986-11-01 Hitachi Ltd Thermosetting resin composition and wiring board

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53149300A (en) * 1977-06-01 1978-12-26 Ciba Geigy Ag Thermal setting composite material and its manufacture

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53149300A (en) * 1977-06-01 1978-12-26 Ciba Geigy Ag Thermal setting composite material and its manufacture

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61246234A (en) * 1985-04-24 1986-11-01 Hitachi Ltd Thermosetting resin composition and wiring board
JPH0719936B2 (en) * 1985-04-24 1995-03-06 株式会社日立製作所 Wiring board

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