JPS56500889A - - Google Patents

Info

Publication number
JPS56500889A
JPS56500889A JP50185680A JP50185680A JPS56500889A JP S56500889 A JPS56500889 A JP S56500889A JP 50185680 A JP50185680 A JP 50185680A JP 50185680 A JP50185680 A JP 50185680A JP S56500889 A JPS56500889 A JP S56500889A
Authority
JP
Japan
Prior art keywords
adhesive system
adhesive
oxirane
detackifiable
tapes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP50185680A
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS56500889A publication Critical patent/JPS56500889A/ja
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03C—PHOTOSENSITIVE MATERIALS FOR PHOTOGRAPHIC PURPOSES; PHOTOGRAPHIC PROCESSES, e.g. CINE, X-RAY, COLOUR, STEREO-PHOTOGRAPHIC PROCESSES; AUXILIARY PROCESSES IN PHOTOGRAPHY
    • G03C5/00—Photographic processes or agents therefor; Regeneration of such processing agents
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F3/00—Labels, tag tickets, or similar identification or indication means; Seals; Postage or like stamps
    • G09F3/08—Fastening or securing by means not forming part of the material of the label itself
    • G09F3/10—Fastening or securing by means not forming part of the material of the label itself by an adhesive layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0012—Processes making use of the tackiness of the photolithographic materials, e.g. for mounting; Packaging for photolithographic material; Packages obtained by processing photolithographic materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/029—Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F3/00—Labels, tag tickets, or similar identification or indication means; Seals; Postage or like stamps
    • G09F3/02—Forms or constructions
    • G09F2003/023—Adhesive
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F3/00—Labels, tag tickets, or similar identification or indication means; Seals; Postage or like stamps
    • G09F3/02—Forms or constructions
    • G09F2003/023—Adhesive
    • G09F2003/0241—Repositionable or pressure sensitive adhesive
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y10T156/1153—Temperature change for delamination [e.g., heating during delaminating, etc.]
    • Y10T156/1158—Electromagnetic radiation applied to work for delamination [e.g., microwave, uv, ir, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2809—Web or sheet containing structurally defined element or component and having an adhesive outermost layer including irradiated or wave energy treated component
JP50185680A 1979-07-25 1980-06-30 Pending JPS56500889A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/060,276 US4286047A (en) 1979-07-25 1979-07-25 Pressure-sensitive adhesive susceptible to ultraviolet light-induced detackification

Publications (1)

Publication Number Publication Date
JPS56500889A true JPS56500889A (ja) 1981-07-02

Family

ID=22028488

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50185680A Pending JPS56500889A (ja) 1979-07-25 1980-06-30

Country Status (10)

Country Link
US (1) US4286047A (ja)
EP (1) EP0032936B1 (ja)
JP (1) JPS56500889A (ja)
KR (1) KR830002705B1 (ja)
AT (1) ATE15727T1 (ja)
BR (1) BR8008768A (ja)
CA (1) CA1124935A (ja)
DE (1) DE3071094D1 (ja)
IT (1) IT1188944B (ja)
WO (1) WO1981000309A1 (ja)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6254779A (ja) * 1985-09-04 1987-03-10 Bando Chem Ind Ltd 感圧接着性シート
JPS6254778A (ja) * 1985-09-04 1987-03-10 Bando Chem Ind Ltd 感圧接着性シート
JPH01252682A (ja) * 1988-04-01 1989-10-09 Nitto Denko Corp 粘着部材の製造方法
JP2004043732A (ja) * 2002-07-15 2004-02-12 Three M Innovative Properties Co 発泡性接着剤組成物
WO2012165623A1 (ja) * 2011-06-02 2012-12-06 Dic株式会社 易解体性粘着剤組成物及び易解体性粘着テープ
WO2012165619A1 (ja) * 2011-06-02 2012-12-06 Dic株式会社 易解体性粘着剤組成物及び易解体性粘着テープ
WO2012165625A1 (ja) * 2011-06-02 2012-12-06 Dic株式会社 易解体性粘着剤組成物及び易解体性粘着テープ

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US4478967A (en) * 1980-08-11 1984-10-23 Minnesota Mining And Manufacturing Company Photolabile blocked surfactants and compositions containing the same
US4454179A (en) * 1982-05-10 1984-06-12 Minnesota Mining And Manufacturing Company Dry transfer article
US4396675A (en) * 1982-09-22 1983-08-02 Minnesota Mining And Manufacturing Company Storable, crosslinkable pressure-sensitive adhesive tape
US4404246A (en) * 1982-09-22 1983-09-13 Minnesota Mining And Manufacturing Company Storable, crosslinkable pressure-sensitive adhesive tape
US4671975A (en) * 1983-02-04 1987-06-09 The Garrett Corporation Radiant heat reflective inflatable structure
US4582734A (en) * 1983-02-04 1986-04-15 The Garrett Corporation Radiant heat reflective inflatable structure and methods for making same
GB2137626B (en) * 1983-03-31 1986-10-15 Sericol Group Ltd Water based photopolymerisable compositions and their use
US5714029A (en) * 1984-03-12 1998-02-03 Nitto Electric Industrial Co., Ltd. Process for working a semiconductor wafer
US4558792A (en) * 1984-04-12 1985-12-17 Baxter Travenol Laboratories, Inc. Container such as a nursing container, with flexible liner and access site and method of making said access site
WO1985004572A1 (en) * 1984-04-12 1985-10-24 Baxter Travenol Laboratories, Inc. Container such as a nursing container, with flexible liner and access site and method of making same
EP0191534B1 (en) * 1985-02-14 1990-05-23 Bando Chemical Industries, Ltd. A method for dicing a semiconductor wafer
US5132172A (en) * 1986-06-11 1992-07-21 Minnesota Mining And Manufacturing Company Primed polyolefin surfaces for epoxy adhesives
US4857372A (en) * 1986-09-10 1989-08-15 Minnesota Mining And Manufacturing Company Graphic composite with thermally detackifiable adhesive premask tape
JPH0715087B2 (ja) * 1988-07-21 1995-02-22 リンテック株式会社 粘接着テープおよびその使用方法
TW201327B (ja) * 1991-07-19 1993-03-01 Minnesota Mining & Mfg
US5667893A (en) * 1992-10-09 1997-09-16 Minnesota Mining And Manufacturing Company Substrate coated or impregnated with flexible epoxy composition
WO1994009497A1 (en) * 1992-10-09 1994-04-28 Minnesota Mining And Manufacturing Company Epoxy impregnated tape backing
DE69323741T2 (de) * 1992-10-13 1999-10-07 Loctite Corp Verfahren zum halten/lösen von linsen
US5380387A (en) * 1992-10-13 1995-01-10 Loctite Corporation Lens blocking/deblocking method
NL9400679A (nl) * 1994-04-27 1995-12-01 Tno Drager, in het bijzonder een folie, voorzien van een drukgevoelige lijmlaag.
US5721289A (en) * 1994-11-04 1998-02-24 Minnesota Mining And Manufacturing Company Stable, low cure-temperature semi-structural pressure sensitive adhesive
US5893958A (en) * 1995-01-05 1999-04-13 Moore Business Forms, Inc. De-tackified continuous extrusion process applied integrated label product
US5670260A (en) * 1995-04-21 1997-09-23 Adhesives Research, Inc. Radiation-cured adhesive film having differential surface adhesion
JP2000502114A (ja) * 1995-08-11 2000-02-22 スミス アンド ネフュー ピーエルシー 接着剤
US5707713A (en) * 1996-02-21 1998-01-13 Moore Business Forms, Inc. Variable double sided linerless labels
WO1998026811A2 (en) * 1996-12-18 1998-06-25 Vidacare International, Inc. Releasable adhesive closure
GB9908000D0 (en) * 1999-04-09 1999-06-02 Smith & Nephew Curable compositions
US6938783B2 (en) * 2000-07-26 2005-09-06 Amerasia International Technology, Inc. Carrier tape
DE10044374A1 (de) * 2000-09-08 2002-08-08 Tesa Ag Verfahren zur Vernetzung von Polyacrylaten
US20020156144A1 (en) * 2001-02-09 2002-10-24 Williams Kevin Alan UV-curable, non-chlorinated adhesion promoters
US8058354B2 (en) * 2001-02-09 2011-11-15 Eastman Chemical Company Modified carboxylated polyolefins and their use as adhesion promoters
US6627309B2 (en) 2001-05-08 2003-09-30 3M Innovative Properties Company Adhesive detackification
FR2838048B1 (fr) * 2002-04-03 2005-05-27 Prod Dentaires Pierre Rolland Produit dentaire reticulable/dereticulable
US20050224978A1 (en) * 2002-06-24 2005-10-13 Kohichiro Kawate Heat curable adhesive composition, article, semiconductor apparatus and method
US8058355B2 (en) 2004-10-06 2011-11-15 Eastman Chemical Company Modified chlorinated carboxylated polyolefins and their use as adhesion promoters
US20060225832A1 (en) * 2005-03-30 2006-10-12 Saidman Laurence B Method for dispensing an energy reactive adhesive
US20080076853A1 (en) * 2006-06-09 2008-03-27 Xiaoming Jin Photopolymerizable and photocleavable resins and low shrink and low stress composite compositions
CA2655070C (en) 2006-06-09 2014-12-30 Dentsply International Inc. Flowable dental resin compositions with low polymerization stress
GB0904582D0 (en) * 2008-09-24 2009-04-29 Lumina Adhesives Switchable adhesives
JP5547954B2 (ja) * 2009-12-14 2014-07-16 日東電工株式会社 粘着テープ剥離方法およびその装置
JP5711767B2 (ja) 2010-03-09 2015-05-07 ヘンケル ユーエス アイピー エルエルシー 感圧接着剤用カチオン性ｕｖ架橋型アクリルポリマー
EP2371920A1 (en) 2010-03-31 2011-10-05 Lumina Adhesives AB Switchable adhesives
US8785517B2 (en) 2011-05-25 2014-07-22 3M Innovative Properties Company Pressure-sensitive adhesives with onium-epdxy crosslinking system
WO2012177337A1 (en) 2011-06-23 2012-12-27 3M Innovative Properties Company Pressure-sensitive adhesives with onium-epoxy resin crosslinking system
DE102012208597B4 (de) 2012-05-23 2018-05-30 Tesa Se Haftklebemasse für medizinische Zwecke, Verfahren zu ihrer Herstellung und die Haftklebmasse enthaltende Mischung
US9434866B2 (en) 2013-03-13 2016-09-06 3M Innovative Properties Company Adhesives comprising epoxy-acid crosslinked groups and methods
EP2957611A1 (en) 2014-06-20 2015-12-23 Nitto Denko Corporation Debondable adhesive composition
EP2957610A1 (en) 2014-06-20 2015-12-23 Nitto Denko Corporation Debondable adhesive composition
EP3056225A1 (en) 2015-02-16 2016-08-17 Nitto Denko Corporation Debondable adhesive system
US20200130342A1 (en) * 2018-10-31 2020-04-30 Microsoft Technology Licensing, Llc Bonding and de-bonding system and process
US11604366B2 (en) 2020-02-21 2023-03-14 Meta Platforms Technologies, Llc Head-mounted display devices with removable prescription lenses

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US3981897A (en) * 1975-05-02 1976-09-21 General Electric Company Method for making certain halonium salt photoinitiators
US4058401A (en) * 1974-05-02 1977-11-15 General Electric Company Photocurable compositions containing group via aromatic onium salts
US4101513A (en) * 1977-02-02 1978-07-18 Minnesota Mining And Manufacturing Company Catalyst for condensation of hydrolyzable silanes and storage stable compositions thereof
US4108747A (en) * 1976-07-14 1978-08-22 General Electric Company Curable compositions and method for curing such compositions
JPS53121833A (en) * 1977-04-01 1978-10-24 Hitachi Chem Co Ltd Method of protecting surface

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DE1719096B2 (de) * 1967-10-31 1976-11-04 Beiersdorf Ag, 2000 Hamburg Verfahren zur herstellung von selbstklebebaendern oder -folien
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US4054451A (en) * 1974-09-26 1977-10-18 American Can Company Method of polymerizing a copolymer of glycidyl methacrylate and allyl glycidyl ether
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US4090936A (en) * 1976-10-28 1978-05-23 Minnesota Mining And Manufacturing Company Photohardenable compositions
US4113792A (en) * 1977-06-20 1978-09-12 National Starch And Chemical Corporation Pressure sensitive adhesive compositions
US4169732A (en) * 1978-01-09 1979-10-02 International Business Machines Corporation Photosensitive coating composition and use thereof
US4173476A (en) * 1978-02-08 1979-11-06 Minnesota Mining And Manufacturing Company Complex salt photoinitiator
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Patent Citations (5)

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Publication number Priority date Publication date Assignee Title
US4058401A (en) * 1974-05-02 1977-11-15 General Electric Company Photocurable compositions containing group via aromatic onium salts
US3981897A (en) * 1975-05-02 1976-09-21 General Electric Company Method for making certain halonium salt photoinitiators
US4108747A (en) * 1976-07-14 1978-08-22 General Electric Company Curable compositions and method for curing such compositions
US4101513A (en) * 1977-02-02 1978-07-18 Minnesota Mining And Manufacturing Company Catalyst for condensation of hydrolyzable silanes and storage stable compositions thereof
JPS53121833A (en) * 1977-04-01 1978-10-24 Hitachi Chem Co Ltd Method of protecting surface

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6254779A (ja) * 1985-09-04 1987-03-10 Bando Chem Ind Ltd 感圧接着性シート
JPS6254778A (ja) * 1985-09-04 1987-03-10 Bando Chem Ind Ltd 感圧接着性シート
JPH01252682A (ja) * 1988-04-01 1989-10-09 Nitto Denko Corp 粘着部材の製造方法
JP2004043732A (ja) * 2002-07-15 2004-02-12 Three M Innovative Properties Co 発泡性接着剤組成物
WO2012165623A1 (ja) * 2011-06-02 2012-12-06 Dic株式会社 易解体性粘着剤組成物及び易解体性粘着テープ
WO2012165619A1 (ja) * 2011-06-02 2012-12-06 Dic株式会社 易解体性粘着剤組成物及び易解体性粘着テープ
WO2012165625A1 (ja) * 2011-06-02 2012-12-06 Dic株式会社 易解体性粘着剤組成物及び易解体性粘着テープ
US9206340B2 (en) 2011-06-02 2015-12-08 Dic Corporation Easily dismantlable adhesive composition and easily dismantlable adhesive tape
US9321944B2 (en) 2011-06-02 2016-04-26 Dic Corporation Easily dismantlable adhesive agent composition and easily dismantlable adhesive tape
US10301515B2 (en) 2011-06-02 2019-05-28 Dic Corporation Easily dismantlable adhesive composition and easily dismantlable adhesive tape

Also Published As

Publication number Publication date
EP0032936A1 (en) 1981-08-05
US4286047A (en) 1981-08-25
IT8049321A0 (it) 1980-07-24
BR8008768A (pt) 1981-05-26
CA1124935A (en) 1982-06-01
IT1188944B (it) 1988-01-28
KR830003749A (ko) 1983-06-22
IT8049321A1 (it) 1982-01-24
DE3071094D1 (en) 1985-10-24
EP0032936B1 (en) 1985-09-18
KR830002705B1 (ko) 1983-12-08
WO1981000309A1 (en) 1981-02-05
EP0032936A4 (en) 1982-08-05
ATE15727T1 (de) 1985-10-15

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