JPS5649243A - Transfer type molding machine - Google Patents

Transfer type molding machine

Info

Publication number
JPS5649243A
JPS5649243A JP12403379A JP12403379A JPS5649243A JP S5649243 A JPS5649243 A JP S5649243A JP 12403379 A JP12403379 A JP 12403379A JP 12403379 A JP12403379 A JP 12403379A JP S5649243 A JPS5649243 A JP S5649243A
Authority
JP
Japan
Prior art keywords
pressure
resin
preset
plunger
oil
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12403379A
Other languages
English (en)
Other versions
JPS5835460B2 (ja
Inventor
Susumu Tsujiku
Aizo Kaneda
Junichi Saeki
Masayoshi Aoki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP54124033A priority Critical patent/JPS5835460B2/ja
Priority to DE3036441A priority patent/DE3036441C2/de
Publication of JPS5649243A publication Critical patent/JPS5649243A/ja
Priority to US06/411,759 priority patent/US4426341A/en
Publication of JPS5835460B2 publication Critical patent/JPS5835460B2/ja
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/76—Measuring, controlling or regulating
    • B29C45/77—Measuring, controlling or regulating of velocity or pressure of moulding material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP54124033A 1979-09-28 1979-09-28 トランスフア成形機 Expired JPS5835460B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP54124033A JPS5835460B2 (ja) 1979-09-28 1979-09-28 トランスフア成形機
DE3036441A DE3036441C2 (de) 1979-09-28 1980-09-26 Spritzpreßverfahren zum Einbetten elektronischer Teile und Spritzpreßformmaschine zur Durchführung des Verfahrens
US06/411,759 US4426341A (en) 1979-09-28 1982-08-26 Transfer molding method and transfer molding machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP54124033A JPS5835460B2 (ja) 1979-09-28 1979-09-28 トランスフア成形機

Publications (2)

Publication Number Publication Date
JPS5649243A true JPS5649243A (en) 1981-05-02
JPS5835460B2 JPS5835460B2 (ja) 1983-08-02

Family

ID=14875356

Family Applications (1)

Application Number Title Priority Date Filing Date
JP54124033A Expired JPS5835460B2 (ja) 1979-09-28 1979-09-28 トランスフア成形機

Country Status (3)

Country Link
US (1) US4426341A (ja)
JP (1) JPS5835460B2 (ja)
DE (1) DE3036441C2 (ja)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6018107U (ja) * 1983-07-16 1985-02-07 日瀝化学工業株式会社 舗装体
JPS6070606U (ja) * 1983-10-21 1985-05-18 日瀝化学工業株式会社 瀝青質舗装体
JPH03147340A (ja) * 1989-11-01 1991-06-24 Matsushita Electric Ind Co Ltd 半導体チップのモールドプレス装置
JP2013111983A (ja) * 2011-11-30 2013-06-10 Johnson & Johnson Vision Care Inc 射出成形の装置及び方法
JP2021154504A (ja) * 2020-03-25 2021-10-07 トヨタ自動車株式会社 繊維強化樹脂成形品の製造方法および製造装置

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59174332A (ja) * 1983-03-23 1984-10-02 Toshiba Mach Co Ltd 射出工程の圧力監視装置
JPS59179328A (ja) * 1983-03-31 1984-10-11 Fujitsu Ltd モ−ルド方法
DE3320520C1 (de) * 1983-06-07 1984-12-13 Klöckner-Werke AG, 4100 Duisburg Hydraulische Steuerung fuer Extruder-Spritzaggregate zum Verarbeiten von Kautschuk
DE3417293A1 (de) * 1984-05-10 1985-11-14 Gebrüder Bühler AG, Uzwil Druck- oder spritzgiessmaschine
JPS61106219A (ja) * 1984-10-31 1986-05-24 Fanuc Ltd 射出成形機のモニタ回路
JPH0675888B2 (ja) * 1986-11-28 1994-09-28 ソニー株式会社 デイスクの射出成形方法
JPH07320B2 (ja) * 1987-02-25 1995-01-11 株式会社日立製作所 半導体封止用トランスファ成形装置
DE3910146C2 (de) * 1988-03-29 1998-01-22 Toshiba Machine Co Ltd Verfahren zum Überwachen des Einspritzdrucks bei einer Spritz- oder Druckgießmaschine
US5169586A (en) * 1990-05-21 1992-12-08 Nec Corporation Method of manufacturing resin-sealed type semiconductor device
ATE141072T1 (de) * 1991-10-10 1996-08-15 Ckt Kunststoffverarbeitungstec Verfahren und einrichtung zur messwerterfassung und steuerung von spritzgiessmaschinen und pressen
US5516271A (en) * 1993-12-14 1996-05-14 United Technologies Corporation Apparatus for resin transfer molding
JP3486557B2 (ja) * 1998-07-30 2004-01-13 宮崎沖電気株式会社 トランスファ成形装置及び半導体装置の製造方法
US6555400B2 (en) * 2001-08-22 2003-04-29 Micron Technology, Inc. Method for substrate mapping
KR100455386B1 (ko) * 2002-05-07 2004-11-06 삼성전자주식회사 다수의 반도체 소자를 동시에 성형하는 성형 장비
US20040030441A1 (en) * 2002-08-12 2004-02-12 Kemet Electronics Corporation Closed loop material pressure control for the encapsulation process of electronic components
TWI237351B (en) * 2003-10-24 2005-08-01 Advanced Semiconductor Eng Molding apparatus with a molding flowability sensor for packaging semiconductor package
TWI221325B (en) * 2003-10-24 2004-09-21 Advanced Semiconductor Eng Molding apparatus with a pressure sensor for semiconductor package
US20100130867A1 (en) * 2007-04-19 2010-05-27 Mectron S.P.A. Ultrasound frequency resonant dipole for medical use

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3750134A (en) * 1971-02-11 1973-07-31 Package Machinery Co Plastic injection molding machine monitor
JPS535255A (en) * 1976-07-05 1978-01-18 Hitachi Ltd Mold for molding resin

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6018107U (ja) * 1983-07-16 1985-02-07 日瀝化学工業株式会社 舗装体
JPS6070606U (ja) * 1983-10-21 1985-05-18 日瀝化学工業株式会社 瀝青質舗装体
JPH03147340A (ja) * 1989-11-01 1991-06-24 Matsushita Electric Ind Co Ltd 半導体チップのモールドプレス装置
JP2013111983A (ja) * 2011-11-30 2013-06-10 Johnson & Johnson Vision Care Inc 射出成形の装置及び方法
JP2021154504A (ja) * 2020-03-25 2021-10-07 トヨタ自動車株式会社 繊維強化樹脂成形品の製造方法および製造装置

Also Published As

Publication number Publication date
DE3036441C2 (de) 1985-01-10
DE3036441A1 (de) 1981-04-16
US4426341A (en) 1984-01-17
JPS5835460B2 (ja) 1983-08-02

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