JPS5645060A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5645060A
JPS5645060A JP12082779A JP12082779A JPS5645060A JP S5645060 A JPS5645060 A JP S5645060A JP 12082779 A JP12082779 A JP 12082779A JP 12082779 A JP12082779 A JP 12082779A JP S5645060 A JPS5645060 A JP S5645060A
Authority
JP
Japan
Prior art keywords
copper plate
polyimide
supporting substance
supporting
ethylene fluoride
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12082779A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6138864B2 (https=
Inventor
Yasutoshi Kurihara
Komei Yatsuno
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP12082779A priority Critical patent/JPS5645060A/ja
Publication of JPS5645060A publication Critical patent/JPS5645060A/ja
Publication of JPS6138864B2 publication Critical patent/JPS6138864B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Die Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP12082779A 1979-09-21 1979-09-21 Semiconductor device Granted JPS5645060A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12082779A JPS5645060A (en) 1979-09-21 1979-09-21 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12082779A JPS5645060A (en) 1979-09-21 1979-09-21 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS5645060A true JPS5645060A (en) 1981-04-24
JPS6138864B2 JPS6138864B2 (https=) 1986-09-01

Family

ID=14795938

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12082779A Granted JPS5645060A (en) 1979-09-21 1979-09-21 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5645060A (https=)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58138395U (ja) * 1982-03-11 1983-09-17 電気化学工業株式会社 絶縁フイン
JPS603132A (ja) * 1983-06-20 1985-01-09 Nitto Electric Ind Co Ltd 半導体装置
JPS60102751A (ja) * 1983-11-09 1985-06-06 Nitto Electric Ind Co Ltd 半導体素子固定用接着フイルム
JPS60102750A (ja) * 1983-11-09 1985-06-06 Nitto Electric Ind Co Ltd 半導体素子固定用導電性接着フイルム
JPS60106471A (ja) * 1983-11-15 1985-06-11 住友ゴム工業株式会社 テニスボ−ル用コア
US5766740A (en) * 1995-05-26 1998-06-16 Sheldahl, Inc. Adherent film with low thermal impedance and high electrical impedance used in an electronic assembly with a heat sink
JP2007288054A (ja) * 2006-04-19 2007-11-01 Toyota Motor Corp パワーモジュール
WO2023110895A1 (de) * 2021-12-13 2023-06-22 Robert Bosch Gmbh Leistungsmodul mit hochvolt-isolierung

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58138395U (ja) * 1982-03-11 1983-09-17 電気化学工業株式会社 絶縁フイン
JPS603132A (ja) * 1983-06-20 1985-01-09 Nitto Electric Ind Co Ltd 半導体装置
JPS60102751A (ja) * 1983-11-09 1985-06-06 Nitto Electric Ind Co Ltd 半導体素子固定用接着フイルム
JPS60102750A (ja) * 1983-11-09 1985-06-06 Nitto Electric Ind Co Ltd 半導体素子固定用導電性接着フイルム
JPS60106471A (ja) * 1983-11-15 1985-06-11 住友ゴム工業株式会社 テニスボ−ル用コア
US5766740A (en) * 1995-05-26 1998-06-16 Sheldahl, Inc. Adherent film with low thermal impedance and high electrical impedance used in an electronic assembly with a heat sink
US5798171A (en) * 1995-05-26 1998-08-25 Sheldahl, Inc. Adherent film with low thermal impedance and high electrical impedance used in an electronic assembly with a heat sink
JP2007288054A (ja) * 2006-04-19 2007-11-01 Toyota Motor Corp パワーモジュール
WO2023110895A1 (de) * 2021-12-13 2023-06-22 Robert Bosch Gmbh Leistungsmodul mit hochvolt-isolierung

Also Published As

Publication number Publication date
JPS6138864B2 (https=) 1986-09-01

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