JPS5645017A - Moving method and apparatus for semiconductor wafer - Google Patents

Moving method and apparatus for semiconductor wafer

Info

Publication number
JPS5645017A
JPS5645017A JP12006079A JP12006079A JPS5645017A JP S5645017 A JPS5645017 A JP S5645017A JP 12006079 A JP12006079 A JP 12006079A JP 12006079 A JP12006079 A JP 12006079A JP S5645017 A JPS5645017 A JP S5645017A
Authority
JP
Japan
Prior art keywords
moving
wafer
nozzles
breakage
groove
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12006079A
Other languages
English (en)
Other versions
JPS5846170B2 (ja
Inventor
Ikuo Nibari
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP54120060A priority Critical patent/JPS5846170B2/ja
Publication of JPS5645017A publication Critical patent/JPS5645017A/ja
Publication of JPS5846170B2 publication Critical patent/JPS5846170B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP54120060A 1979-09-20 1979-09-20 半導体ウェファ−の搬送方法および搬送装置 Expired JPS5846170B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP54120060A JPS5846170B2 (ja) 1979-09-20 1979-09-20 半導体ウェファ−の搬送方法および搬送装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP54120060A JPS5846170B2 (ja) 1979-09-20 1979-09-20 半導体ウェファ−の搬送方法および搬送装置

Publications (2)

Publication Number Publication Date
JPS5645017A true JPS5645017A (en) 1981-04-24
JPS5846170B2 JPS5846170B2 (ja) 1983-10-14

Family

ID=14776888

Family Applications (1)

Application Number Title Priority Date Filing Date
JP54120060A Expired JPS5846170B2 (ja) 1979-09-20 1979-09-20 半導体ウェファ−の搬送方法および搬送装置

Country Status (1)

Country Link
JP (1) JPS5846170B2 (ja)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58112703U (ja) * 1982-01-28 1983-08-02 三菱電機株式会社 油圧操作装置
JPS59138235U (ja) * 1983-03-04 1984-09-14 株式会社不二越 シリコンウエ−ハの搬送装置
JPS59215729A (ja) * 1983-05-21 1984-12-05 Ulvac Corp 半導体もしくは磁気記録媒体等の基板の洗浄装置
JPS6260225A (ja) * 1985-09-10 1987-03-16 Toshiba Ceramics Co Ltd シリコンウエハの洗浄方法
JPH024986A (ja) * 1987-10-31 1990-01-09 Dainippon Screen Mfg Co Ltd 基板の表面処理方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3553052A (en) * 1965-10-24 1971-01-05 Louis A Scholz Etching control device
JPS5051671A (ja) * 1973-09-07 1975-05-08
JPS5244177A (en) * 1975-10-01 1977-04-06 Ibm System for transferring pieces under treatment

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3553052A (en) * 1965-10-24 1971-01-05 Louis A Scholz Etching control device
JPS5051671A (ja) * 1973-09-07 1975-05-08
JPS5244177A (en) * 1975-10-01 1977-04-06 Ibm System for transferring pieces under treatment

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58112703U (ja) * 1982-01-28 1983-08-02 三菱電機株式会社 油圧操作装置
JPS59138235U (ja) * 1983-03-04 1984-09-14 株式会社不二越 シリコンウエ−ハの搬送装置
JPS59215729A (ja) * 1983-05-21 1984-12-05 Ulvac Corp 半導体もしくは磁気記録媒体等の基板の洗浄装置
JPH0129054B2 (ja) * 1983-05-21 1989-06-07 Ulvac Corp
JPS6260225A (ja) * 1985-09-10 1987-03-16 Toshiba Ceramics Co Ltd シリコンウエハの洗浄方法
JPH024986A (ja) * 1987-10-31 1990-01-09 Dainippon Screen Mfg Co Ltd 基板の表面処理方法

Also Published As

Publication number Publication date
JPS5846170B2 (ja) 1983-10-14

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