JPS5643736A - Attaching method of semiconductor element - Google Patents
Attaching method of semiconductor elementInfo
- Publication number
- JPS5643736A JPS5643736A JP12030379A JP12030379A JPS5643736A JP S5643736 A JPS5643736 A JP S5643736A JP 12030379 A JP12030379 A JP 12030379A JP 12030379 A JP12030379 A JP 12030379A JP S5643736 A JPS5643736 A JP S5643736A
- Authority
- JP
- Japan
- Prior art keywords
- melting point
- semiconductor element
- radiator
- point metal
- low melting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0105—Tin [Sn]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12030379A JPS5643736A (en) | 1979-09-18 | 1979-09-18 | Attaching method of semiconductor element |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12030379A JPS5643736A (en) | 1979-09-18 | 1979-09-18 | Attaching method of semiconductor element |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5643736A true JPS5643736A (en) | 1981-04-22 |
JPH0118580B2 JPH0118580B2 (ja) | 1989-04-06 |
Family
ID=14782891
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12030379A Granted JPS5643736A (en) | 1979-09-18 | 1979-09-18 | Attaching method of semiconductor element |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5643736A (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58188447A (ja) * | 1982-04-23 | 1983-11-02 | カルテンバツハ・ウント・フオイクト・ゲ−エムベ−ハ−・ウント・コンパニ− | 歯科医療用ハンドピ−ス |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS509148A (ja) * | 1973-05-30 | 1975-01-30 | ||
JPS52143763A (en) * | 1976-05-26 | 1977-11-30 | Hitachi Ltd | Soldering method to holding substrate for semiconductor substrates |
JPH05149A (ja) * | 1991-06-24 | 1993-01-08 | Mitsubishi Petrochem Co Ltd | 使い捨ておむつ |
-
1979
- 1979-09-18 JP JP12030379A patent/JPS5643736A/ja active Granted
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS509148A (ja) * | 1973-05-30 | 1975-01-30 | ||
JPS52143763A (en) * | 1976-05-26 | 1977-11-30 | Hitachi Ltd | Soldering method to holding substrate for semiconductor substrates |
JPH05149A (ja) * | 1991-06-24 | 1993-01-08 | Mitsubishi Petrochem Co Ltd | 使い捨ておむつ |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58188447A (ja) * | 1982-04-23 | 1983-11-02 | カルテンバツハ・ウント・フオイクト・ゲ−エムベ−ハ−・ウント・コンパニ− | 歯科医療用ハンドピ−ス |
JPH0372298B2 (ja) * | 1982-04-23 | 1991-11-18 | Karutenbatsuha Unto Fuoikuto Gmbh Unto Co |
Also Published As
Publication number | Publication date |
---|---|
JPH0118580B2 (ja) | 1989-04-06 |
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