KR960029492A - 리플로우 도금부재의 제조방법, 그 방법으로 얻어진 리플로우 도금부재 - Google Patents

리플로우 도금부재의 제조방법, 그 방법으로 얻어진 리플로우 도금부재 Download PDF

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KR960029492A
KR960029492A KR1019950034573A KR19950034573A KR960029492A KR 960029492 A KR960029492 A KR 960029492A KR 1019950034573 A KR1019950034573 A KR 1019950034573A KR 19950034573 A KR19950034573 A KR 19950034573A KR 960029492 A KR960029492 A KR 960029492A
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South Korea
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reflow
plating layer
alloy
layer
plating
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KR1019950034573A
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KR100422026B1 (ko
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사또시 스즈끼
가즈야 다까하시
데루오 가와다
유우지 스즈끼
모리마사 다니모또
Original Assignee
후루까와 쥰노스께
후루까와덴끼고오교 가부시끼가이샤
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Publication of KR100422026B1 publication Critical patent/KR100422026B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C25D5/50—After-treatment of electroplated surfaces by heat-treatment
    • C25D5/505—After-treatment of electroplated surfaces by heat-treatment of electroplated tin coatings, e.g. by melting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S379/00—Telephonic communications
    • Y10S379/912—Geographically adaptive
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/922—Static electricity metal bleed-off metallic stock
    • Y10S428/9335—Product by special process
    • Y10S428/934—Electrical process
    • Y10S428/935—Electroplating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/922—Static electricity metal bleed-off metallic stock
    • Y10S428/9335—Product by special process
    • Y10S428/939—Molten or fused coating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12708—Sn-base component
    • Y10T428/12715—Next to Group IB metal-base component

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

하기의 공정을 구비하고 있는 리플로우 도금부재의 제조방법: 적어도 표면이 Cu 또는 Cu 합금으로 이루어지는 기재의 상기 표면에 전기도금법으로 Sn 또는 Sn 합금으로 이루어지는 도금층을 형성하는 공정: 및 상기 기재의 소정온도의 가열로중에 연속주행시켜서 리플로우 처리를 행할때에, 상기 부재를, 상기 도금층이 용융하지 않을때의 가장 느린 주행속도에 대하여 80~96%에 상당하는 주행속도로 주행시키는 공정이 제공되고, 얻어진 리플로우 땜납도금부재는, 납땜성, 내열성, 벤딩 가공성, 내마모성, 내식성이 모두가 우수하다.

Description

리플로우 도금부재의 제조방법. 그 방법으로 얻어진 리플로우 도금부재
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명방법으로 제조한 리플로우 땜납도금층의 결정립조직을 나타내는 개략도, 제3도는 Sn-Pb 상태도.

Claims (6)

  1. 적어도 표면이 Cu 또는 Cu 합금으로 이루어지는 기재의 상기 표면에 전기도금법으로 Sn 또는 Sn 합금으로 이루어지는 도금층을 형성하는 공정: 및, 상기 기재의 소정온도의 가열로중에 연속주행시켜서 리플로우 처리를 행할 때에, 상기 부재를 상기 도금층이 용융하지 않을 때의 가장 느린 주행속도에 대하여 80~96%에 상당하는 주행속도로 주행시키는 공정을 구비하고 있는 리플로우 도금부재의 제조방법.
  2. 적어도 표면이 Cu 또는 Cu 합금으로 이루어지는 기재; 상기 기재의 표면을 피복하는 Sn 또는 Sn 합금으로 이루어지는 리플로우 도금층; 및 상기 리플로우층의 내층부는 전기도금법으로 형성된 결정립 조직이 남아 있는 리플로우 도금부재.
  3. Cu 또는 Cu 합금으로 이루어지는 각선; 상기 각선의 표면을 피복하는 리플로우 땜납 도금층; 및 상기 리플로우 땜납 도금층은, Sn 결정립의 집합체와 상기 결정립의 입계에 석출하는 Pb상인 것으로 이루어지는 리플로우 도금부재.
  4. 제3항에 있어서, 상기 Sn 결정립의 입경이 2㎛ 이상인 리플로우 도금부재.
  5. 제3항에 있어서, 상기 각선과 상기 리플로우 땜납도금층의 계면에 생성되는 CuSn 금속간 화합물의 층의 두께가 0.45㎛ 이하인 리플로우 도금부재.
  6. 제3항에 있어서, 상기 리플로우 땜납층의 편육도(K: 콜리메이터 직경을 0.1㎜로 한 형광 X선막후계로 리플로우 땜납 도금층의 두께를 측정하였을 때의 최대치를, 정전류 아노드 용해법으로 리프로우 땜납층의 두께를 측정하였을 때의 평균치로 나눈값)는 1.5 이하인 리플로우 도금부재.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019950034573A 1995-01-19 1995-10-09 리플로우도금부재의제조방법,그방법으로얻어진리플로우도금부재 KR100422026B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP95-6370 1995-01-19
JP637095 1995-01-19

Publications (2)

Publication Number Publication Date
KR960029492A true KR960029492A (ko) 1996-08-17
KR100422026B1 KR100422026B1 (ko) 2004-04-21

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US (1) US5614328A (ko)
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US6652990B2 (en) 1992-03-27 2003-11-25 The Louis Berkman Company Corrosion-resistant coated metal and method for making the same
US6794060B2 (en) 1992-03-27 2004-09-21 The Louis Berkman Company Corrosion-resistant coated metal and method for making the same
US6861159B2 (en) * 1992-03-27 2005-03-01 The Louis Berkman Company Corrosion-resistant coated copper and method for making the same
US5849424A (en) * 1996-05-15 1998-12-15 Dowa Mining Co., Ltd. Hard coated copper alloys, process for production thereof and connector terminals made therefrom
JP2001110666A (ja) * 1999-10-08 2001-04-20 Murata Mfg Co Ltd 電子部品、および電子部品の製造方法
TW575688B (en) * 2001-01-19 2004-02-11 Furukawa Electric Co Ltd Metal-plated material and method for preparation thereof, and electric and electronic parts using the same
US20050037229A1 (en) * 2001-01-19 2005-02-17 Hitoshi Tanaka Plated material, method of producing same, and electrical / electronic part using same
US20060068218A1 (en) * 2004-09-28 2006-03-30 Hooghan Kultaransingh N Whisker-free lead frames
US7267861B2 (en) * 2005-05-31 2007-09-11 Texas Instruments Incorporated Solder joints for copper metallization having reduced interfacial voids
US20080308300A1 (en) * 2007-06-18 2008-12-18 Conti Mark A Method of manufacturing electrically conductive strips
JP2009108339A (ja) * 2007-10-26 2009-05-21 Renesas Technology Corp 半導体装置およびその製造方法
US8367244B2 (en) * 2008-04-17 2013-02-05 Enovix Corporation Anode material having a uniform metal-semiconductor alloy layer
EP2517593B1 (en) * 2009-12-25 2015-11-11 YKK Corporation Zipper component and slide zipper
JP5389097B2 (ja) * 2011-03-31 2014-01-15 Ｊｘ日鉱日石金属株式会社 Ｓｎめっき材
JP5587935B2 (ja) * 2012-03-30 2014-09-10 Ｊｘ日鉱日石金属株式会社 Ｓｎめっき材
JP6555455B1 (ja) * 2017-11-01 2019-08-07 日本製鉄株式会社 電気Ｓｎめっき鋼板

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US5614328A (en) 1997-03-25

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