JPS5638830A - Sealing method - Google Patents

Sealing method

Info

Publication number
JPS5638830A
JPS5638830A JP11499379A JP11499379A JPS5638830A JP S5638830 A JPS5638830 A JP S5638830A JP 11499379 A JP11499379 A JP 11499379A JP 11499379 A JP11499379 A JP 11499379A JP S5638830 A JPS5638830 A JP S5638830A
Authority
JP
Japan
Prior art keywords
sealing
resin
frame body
peripheral region
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11499379A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6145379B2 (enrdf_load_stackoverflow
Inventor
Kazuo Usada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP11499379A priority Critical patent/JPS5638830A/ja
Publication of JPS5638830A publication Critical patent/JPS5638830A/ja
Publication of JPS6145379B2 publication Critical patent/JPS6145379B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56Encapsulations, e.g. encapsulation layers, coatings
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP11499379A 1979-09-07 1979-09-07 Sealing method Granted JPS5638830A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11499379A JPS5638830A (en) 1979-09-07 1979-09-07 Sealing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11499379A JPS5638830A (en) 1979-09-07 1979-09-07 Sealing method

Publications (2)

Publication Number Publication Date
JPS5638830A true JPS5638830A (en) 1981-04-14
JPS6145379B2 JPS6145379B2 (enrdf_load_stackoverflow) 1986-10-07

Family

ID=14651655

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11499379A Granted JPS5638830A (en) 1979-09-07 1979-09-07 Sealing method

Country Status (1)

Country Link
JP (1) JPS5638830A (enrdf_load_stackoverflow)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61220358A (ja) * 1985-03-27 1986-09-30 Hitachi Micro Comput Eng Ltd 半導体装置
JPS6393649U (enrdf_load_stackoverflow) * 1986-12-08 1988-06-17
JPH01169953A (ja) * 1987-12-25 1989-07-05 Citizen Watch Co Ltd 樹脂封止型ピングリッドアレイ構造
US7215010B2 (en) * 2000-03-03 2007-05-08 Infineon Technologies Ag Device for packing electronic components using injection molding technology

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4823962U (enrdf_load_stackoverflow) * 1971-07-28 1973-03-19

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4823962U (enrdf_load_stackoverflow) * 1971-07-28 1973-03-19

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61220358A (ja) * 1985-03-27 1986-09-30 Hitachi Micro Comput Eng Ltd 半導体装置
JPS6393649U (enrdf_load_stackoverflow) * 1986-12-08 1988-06-17
JPH01169953A (ja) * 1987-12-25 1989-07-05 Citizen Watch Co Ltd 樹脂封止型ピングリッドアレイ構造
US7215010B2 (en) * 2000-03-03 2007-05-08 Infineon Technologies Ag Device for packing electronic components using injection molding technology

Also Published As

Publication number Publication date
JPS6145379B2 (enrdf_load_stackoverflow) 1986-10-07

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