JPS5638830A - Sealing method - Google Patents
Sealing methodInfo
- Publication number
- JPS5638830A JPS5638830A JP11499379A JP11499379A JPS5638830A JP S5638830 A JPS5638830 A JP S5638830A JP 11499379 A JP11499379 A JP 11499379A JP 11499379 A JP11499379 A JP 11499379A JP S5638830 A JPS5638830 A JP S5638830A
- Authority
- JP
- Japan
- Prior art keywords
- sealing
- resin
- frame body
- peripheral region
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11499379A JPS5638830A (en) | 1979-09-07 | 1979-09-07 | Sealing method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11499379A JPS5638830A (en) | 1979-09-07 | 1979-09-07 | Sealing method |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5638830A true JPS5638830A (en) | 1981-04-14 |
JPS6145379B2 JPS6145379B2 (enrdf_load_stackoverflow) | 1986-10-07 |
Family
ID=14651655
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11499379A Granted JPS5638830A (en) | 1979-09-07 | 1979-09-07 | Sealing method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5638830A (enrdf_load_stackoverflow) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61220358A (ja) * | 1985-03-27 | 1986-09-30 | Hitachi Micro Comput Eng Ltd | 半導体装置 |
JPS6393649U (enrdf_load_stackoverflow) * | 1986-12-08 | 1988-06-17 | ||
JPH01169953A (ja) * | 1987-12-25 | 1989-07-05 | Citizen Watch Co Ltd | 樹脂封止型ピングリッドアレイ構造 |
US7215010B2 (en) * | 2000-03-03 | 2007-05-08 | Infineon Technologies Ag | Device for packing electronic components using injection molding technology |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4823962U (enrdf_load_stackoverflow) * | 1971-07-28 | 1973-03-19 |
-
1979
- 1979-09-07 JP JP11499379A patent/JPS5638830A/ja active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4823962U (enrdf_load_stackoverflow) * | 1971-07-28 | 1973-03-19 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61220358A (ja) * | 1985-03-27 | 1986-09-30 | Hitachi Micro Comput Eng Ltd | 半導体装置 |
JPS6393649U (enrdf_load_stackoverflow) * | 1986-12-08 | 1988-06-17 | ||
JPH01169953A (ja) * | 1987-12-25 | 1989-07-05 | Citizen Watch Co Ltd | 樹脂封止型ピングリッドアレイ構造 |
US7215010B2 (en) * | 2000-03-03 | 2007-05-08 | Infineon Technologies Ag | Device for packing electronic components using injection molding technology |
Also Published As
Publication number | Publication date |
---|---|
JPS6145379B2 (enrdf_load_stackoverflow) | 1986-10-07 |
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