JPS5636147A - Semiconductor device and its manufacture - Google Patents

Semiconductor device and its manufacture

Info

Publication number
JPS5636147A
JPS5636147A JP11189479A JP11189479A JPS5636147A JP S5636147 A JPS5636147 A JP S5636147A JP 11189479 A JP11189479 A JP 11189479A JP 11189479 A JP11189479 A JP 11189479A JP S5636147 A JPS5636147 A JP S5636147A
Authority
JP
Japan
Prior art keywords
film
wiring
hole portion
lead
opened hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11189479A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6318335B2 (ca
Inventor
Kenzo Hatada
Kosei Kajiwara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP11189479A priority Critical patent/JPS5636147A/ja
Publication of JPS5636147A publication Critical patent/JPS5636147A/ja
Publication of JPS6318335B2 publication Critical patent/JPS6318335B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/453—Leadframes comprising flexible metallic tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/701—Tape-automated bond [TAB] connectors

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP11189479A 1979-08-31 1979-08-31 Semiconductor device and its manufacture Granted JPS5636147A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11189479A JPS5636147A (en) 1979-08-31 1979-08-31 Semiconductor device and its manufacture

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11189479A JPS5636147A (en) 1979-08-31 1979-08-31 Semiconductor device and its manufacture

Publications (2)

Publication Number Publication Date
JPS5636147A true JPS5636147A (en) 1981-04-09
JPS6318335B2 JPS6318335B2 (ca) 1988-04-18

Family

ID=14572797

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11189479A Granted JPS5636147A (en) 1979-08-31 1979-08-31 Semiconductor device and its manufacture

Country Status (1)

Country Link
JP (1) JPS5636147A (ca)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6331565U (ca) * 1986-08-14 1988-03-01
JPH01181540A (ja) * 1988-01-15 1989-07-19 Internatl Business Mach Corp <Ibm> Ｔａｂパツケージ
JPH02119253A (ja) * 1988-10-28 1990-05-07 Nec Corp 混成集積回路装置
WO1996004682A1 (en) * 1994-07-29 1996-02-15 Havant International Limited Electronic circuit package
JP2001209774A (ja) * 2000-01-25 2001-08-03 Hitachi Cable Ltd Ｉｃカード及びその製造方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6331565U (ca) * 1986-08-14 1988-03-01
JPH01181540A (ja) * 1988-01-15 1989-07-19 Internatl Business Mach Corp <Ibm> Ｔａｂパツケージ
JPH02119253A (ja) * 1988-10-28 1990-05-07 Nec Corp 混成集積回路装置
WO1996004682A1 (en) * 1994-07-29 1996-02-15 Havant International Limited Electronic circuit package
JP2001209774A (ja) * 2000-01-25 2001-08-03 Hitachi Cable Ltd Ｉｃカード及びその製造方法

Also Published As

Publication number Publication date
JPS6318335B2 (ca) 1988-04-18

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