JPS5635383A - Semiconductor integrated circuit support with heating mechanism - Google Patents

Semiconductor integrated circuit support with heating mechanism

Info

Publication number
JPS5635383A
JPS5635383A JP11090479A JP11090479A JPS5635383A JP S5635383 A JPS5635383 A JP S5635383A JP 11090479 A JP11090479 A JP 11090479A JP 11090479 A JP11090479 A JP 11090479A JP S5635383 A JPS5635383 A JP S5635383A
Authority
JP
Japan
Prior art keywords
integrated circuit
semiconductor integrated
heating mechanism
circuit support
support
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11090479A
Other languages
English (en)
Inventor
Kazuo Inamori
Kiyoshige Miyawaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyoto Ceramic Co Ltd
Original Assignee
Kyoto Ceramic Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyoto Ceramic Co Ltd filed Critical Kyoto Ceramic Co Ltd
Priority to JP11090479A priority Critical patent/JPS5635383A/ja
Priority to US06/181,379 priority patent/US4374316A/en
Priority to DE19803031789 priority patent/DE3031789A1/de
Priority to GB8027691A priority patent/GB2057761B/en
Priority to FR8018769A priority patent/FR2469803A1/fr
Publication of JPS5635383A publication Critical patent/JPS5635383A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1092—Plug-in assemblages of components, e.g. IC sockets with built-in components, e.g. intelligent sockets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/345—Arrangements for heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
JP11090479A 1979-08-29 1979-08-29 Semiconductor integrated circuit support with heating mechanism Pending JPS5635383A (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP11090479A JPS5635383A (en) 1979-08-29 1979-08-29 Semiconductor integrated circuit support with heating mechanism
US06/181,379 US4374316A (en) 1979-08-29 1980-08-22 Semiconductor integrated circuit supporter having a heating element
DE19803031789 DE3031789A1 (de) 1979-08-29 1980-08-22 Traeger fuer eine integrierte halbleiterschaltung
GB8027691A GB2057761B (en) 1979-08-29 1980-08-27 Semiconductor device supporter having a heating element
FR8018769A FR2469803A1 (fr) 1979-08-29 1980-08-29 Dispositif de support a element de prechauffage pour circuit integre a semi-conducteurs

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11090479A JPS5635383A (en) 1979-08-29 1979-08-29 Semiconductor integrated circuit support with heating mechanism

Publications (1)

Publication Number Publication Date
JPS5635383A true JPS5635383A (en) 1981-04-08

Family

ID=14547605

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11090479A Pending JPS5635383A (en) 1979-08-29 1979-08-29 Semiconductor integrated circuit support with heating mechanism

Country Status (5)

Country Link
US (1) US4374316A (ja)
JP (1) JPS5635383A (ja)
DE (1) DE3031789A1 (ja)
FR (1) FR2469803A1 (ja)
GB (1) GB2057761B (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61188274U (ja) * 1985-05-15 1986-11-22

Families Citing this family (61)

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FR2538618B1 (fr) * 1982-12-28 1986-03-07 Inf Milit Spatiale Aeronaut Boitier pour composant electronique comportant un element fixant l'humidite
US4481403A (en) * 1983-03-04 1984-11-06 Honeywell Inc. Temperature control of solid state circuit chips
US4506139A (en) * 1983-04-04 1985-03-19 Honeywell Inc. Circuit chip
GB2163008A (en) * 1984-08-08 1986-02-12 Varian Associates Miniature, temperature controlled phase detector
US4626206A (en) * 1984-12-14 1986-12-02 Texas Instruments Incorporated Apparatus for integrated circuit assembly operations
US4739382A (en) * 1985-05-31 1988-04-19 Tektronix, Inc. Package for a charge-coupled device with temperature dependent cooling
US4684783A (en) * 1985-11-06 1987-08-04 Sawtek, Inc. Environmental control apparatus for electrical circuit elements
JPH0693485B2 (ja) * 1985-11-29 1994-11-16 日本電装株式会社 半導体装置
US4769525A (en) * 1986-09-02 1988-09-06 Hughes Aircraft Company Circuit package attachment apparatus and method
JPS6376279A (ja) * 1986-09-19 1988-04-06 株式会社日立製作所 コネクタ及びそれを用いた半導体素子実装構造
US4841170A (en) * 1986-12-08 1989-06-20 John Fluke Mfg. Co., Inc. Temperature controlled hybrid assembly
USRE34179E (en) * 1986-12-08 1993-02-16 John Fluke Mfg. Co., Inc. Temperature controlled hybrid assembly
US4980586A (en) * 1987-10-07 1990-12-25 Tektronix, Inc. Digital integrated circuit propagation delay regulator
FR2635612B1 (fr) * 1988-08-18 1992-02-21 Alsthom Cgee Procede et auxiliaire d'ajustage dynamique pour circuit electronique hybride
US5183597A (en) * 1989-02-10 1993-02-02 Minnesota Mining And Manufacturing Company Method of molding microstructure bearing composite plastic articles
EP0447155B1 (en) * 1990-03-12 1995-07-26 Ngk Insulators, Ltd. Wafer heaters for use in semi-conductor-producing apparatus, heating units using such wafer heaters, and production of heaters
FR2668876B1 (fr) * 1990-11-07 1992-12-24 Alcatel Espace Circuit electronique controle en temperature.
US5210485A (en) * 1991-07-26 1993-05-11 International Business Machines Corporation Probe for wafer burn-in test system
JPH05217121A (ja) * 1991-11-22 1993-08-27 Internatl Business Mach Corp <Ibm> 磁気変換器付きチップ等の感熱素子を結合する方法及び装置
FR2697717B1 (fr) * 1992-10-29 1994-12-16 Thomson Csf Dispositif de réchauffage de cartes électroniques.
US5539186A (en) * 1992-12-09 1996-07-23 International Business Machines Corporation Temperature controlled multi-layer module
JP3224930B2 (ja) * 1993-12-28 2001-11-05 株式会社東芝 半導体装置の再生方法
US5568892A (en) * 1994-06-16 1996-10-29 Lucent Technologies Inc. Alignment and bonding techniques
US5574627A (en) * 1995-07-24 1996-11-12 At&T Global Information Solutions Company Apparatus for preventing the formation of condensation on sub-cooled integrated circuit devices
US5951893A (en) * 1995-12-05 1999-09-14 Motorola, Inc. Integrated circuit pad structure with high temperature heating element and method therefor
US5742021A (en) * 1996-08-12 1998-04-21 International Business Machines Corporation High thermal conductivity substrate and the method of brazing a cap thereto
US6114674A (en) * 1996-10-04 2000-09-05 Mcdonnell Douglas Corporation Multilayer circuit board with electrically resistive heating element
DE19645095A1 (de) * 1996-11-01 1998-05-07 Ego Elektro Geraetebau Gmbh Beheizung
EP0853239A3 (en) * 1997-01-13 2001-01-17 Kabushiki Kaisha Riken Gas sensor and heater unit
US5896259A (en) * 1997-08-05 1999-04-20 Raytheon Company Preheating device for electronic circuits
GB2330289A (en) * 1997-10-13 1999-04-14 Ericsson Omc Limited Heated printed circuit board
FI981032A (fi) 1998-05-08 1999-11-09 Nokia Networks Oy Lämmitysmenetelmä ja piirilevy
US6404048B2 (en) * 1998-09-03 2002-06-11 Micron Technology, Inc. Heat dissipating microelectronic package
JP3470612B2 (ja) * 1998-09-18 2003-11-25 株式会社日立製作所 電子機器
US6127660A (en) * 1998-12-31 2000-10-03 Lucent Technologies, Inc. Heated microcell base station
US6423940B1 (en) * 2001-03-02 2002-07-23 Agilent Technologies, Inc. Temperature stabilization scheme for a circuit board
FR2828785B1 (fr) * 2001-08-14 2004-01-23 Bernard Peyronny Corps de chauffe electrique noye dans un bloc accumulateur de calories
JP2003151726A (ja) * 2001-11-19 2003-05-23 Nec Corp 加温装置、加温装置実装構造および光導波路デバイス
US20030116552A1 (en) * 2001-12-20 2003-06-26 Stmicroelectronics Inc. Heating element for microfluidic and micromechanical applications
US6825681B2 (en) * 2002-07-19 2004-11-30 Delta Design, Inc. Thermal control of a DUT using a thermal control substrate
US6911624B2 (en) * 2002-08-23 2005-06-28 Micron Technology, Inc. Component installation, removal, and replacement apparatus and method
US6900411B2 (en) * 2003-02-06 2005-05-31 The Raymond Corporation Flexible heater for heating electrical components in operator control handle
DE202005001163U1 (de) * 2005-01-24 2005-03-31 Juma Leiterplattentechologie M Leiterplatte oder Platine mit Heizdraht
US7102377B1 (en) * 2005-06-23 2006-09-05 International Business Machines Corporation Packaging reliability superchips
US7282938B2 (en) * 2005-12-05 2007-10-16 Silicon Integrated Systems Corp. Testing apparatus and method for providing temperature stress to electronic component
US11244727B2 (en) 2006-11-29 2022-02-08 Rambus Inc. Dynamic memory rank configuration
WO2009032928A2 (en) 2007-09-05 2009-03-12 Rambus Inc. Method and apparatus to repair defects in nonvolatile semiconductor memory devices
US8344475B2 (en) 2006-11-29 2013-01-01 Rambus Inc. Integrated circuit heating to effect in-situ annealing
KR20090097893A (ko) * 2006-11-29 2009-09-16 램버스 인코포레이티드 작동열화를 반전시킬 가열회로가 내장된 집적회로
US7474540B1 (en) * 2008-01-10 2009-01-06 International Business Machines Corporation Silicon carrier including an integrated heater for die rework and wafer probe
DE102008026135B4 (de) * 2008-05-30 2012-02-16 GLOBALFOUNDRIES Dresden Module One Ltd. Liability Company & Co. KG Steuerung für tiefe Temperaturen in einem Halbleiterbauelement
CN101835360A (zh) * 2010-05-10 2010-09-15 中兴通讯股份有限公司 单板的插拔装置和方法
US8704630B2 (en) 2010-08-25 2014-04-22 Itron, Inc. Apparatus and methods for temperature-based control of communication device operations
US8880765B2 (en) 2010-08-25 2014-11-04 Itron, Inc. Interface bus for utility-grade network communication devices
US9125301B2 (en) * 2011-10-18 2015-09-01 Integrated Microwave Corporation Integral heater assembly and method for carrier or host board of electronic package assembly
US9012811B2 (en) * 2012-01-13 2015-04-21 Viasystems Technologies Corp. L.L.C. Printed circuit board with embedded heater
US8964394B2 (en) * 2012-07-10 2015-02-24 Moxa Inc. Heating and heat dissipating multi-layer circuit board structure for keeping operating temperature of electronic components
US10285283B2 (en) 2016-06-03 2019-05-07 International Business Machines Corporation Heating of printed circuit board core during laminate cure
US11224098B2 (en) * 2018-11-01 2022-01-11 General Electric Company Systems and methods for passive heating of temperature-sensitive electronic components
US11382178B2 (en) * 2019-06-27 2022-07-05 General Electric Company System and method for heating an electrical bus in an electrical cabinet for cold startup and condensation/frost control
US11521908B2 (en) 2020-07-16 2022-12-06 Hewlett Packard Enterprise Development Lp Heater elements for processor devices

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IL23606A (en) * 1964-07-09 1969-11-12 Charbonnier R Electronic component with individual thermal regulation
US3383614A (en) * 1965-06-28 1968-05-14 Texas Instruments Inc Temperature stabilized semiconductor devices
DE1245458B (de) * 1966-04-27 1967-07-27 Telefunken Patent Integrierte Schaltung, deren Traegerplaettchen gut waermeleitfaehig ist
US3450863A (en) * 1967-06-19 1969-06-17 Caterpillar Tractor Co Thermal stabilizer for thermally sensitive components
GB1307818A (en) * 1969-04-14 1973-02-21 Electronic Components Ltd Thick film substrates
US3662150A (en) * 1971-01-18 1972-05-09 Hughes Aircraft Co Controlled temperature circuit package
US3947658A (en) * 1972-02-22 1976-03-30 Kureha Kagaku Kogyo Kabushiki Kaisha Protector for the plate-shaped heating element
US3887785A (en) * 1974-08-29 1975-06-03 Us Air Force Temperature controlled hybrid oven
US4035613A (en) * 1976-01-08 1977-07-12 Kyoto Ceramic Co., Ltd. Cylindrical ceramic heating device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61188274U (ja) * 1985-05-15 1986-11-22

Also Published As

Publication number Publication date
GB2057761A (en) 1981-04-01
FR2469803A1 (fr) 1981-05-22
DE3031789C2 (ja) 1990-10-18
GB2057761B (en) 1984-06-20
DE3031789A1 (de) 1981-03-19
US4374316A (en) 1983-02-15
FR2469803B1 (ja) 1983-11-18

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