FR2469803A1 - Dispositif de support a element de prechauffage pour circuit integre a semi-conducteurs - Google Patents

Dispositif de support a element de prechauffage pour circuit integre a semi-conducteurs

Info

Publication number
FR2469803A1
FR2469803A1 FR8018769A FR8018769A FR2469803A1 FR 2469803 A1 FR2469803 A1 FR 2469803A1 FR 8018769 A FR8018769 A FR 8018769A FR 8018769 A FR8018769 A FR 8018769A FR 2469803 A1 FR2469803 A1 FR 2469803A1
Authority
FR
France
Prior art keywords
heating element
electrically connected
integrated circuit
support device
semiconductor circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR8018769A
Other languages
English (en)
Other versions
FR2469803B1 (fr
Inventor
Kazuo Inamori
Kiyoshige Miyawaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyoto Ceramic Co Ltd
Original Assignee
Kyoto Ceramic Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyoto Ceramic Co Ltd filed Critical Kyoto Ceramic Co Ltd
Publication of FR2469803A1 publication Critical patent/FR2469803A1/fr
Application granted granted Critical
Publication of FR2469803B1 publication Critical patent/FR2469803B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1092—Plug-in assemblages of components, e.g. IC sockets with built-in components, e.g. intelligent sockets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/345—Arrangements for heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

CE DISPOSITIF DE SUPPORT COMPREND UN CORPS 1A DE BOITIER, DANS LEQUEL EST FORME UN LOGEMENT 6 DESTINE A RECEVOIR UN CIRCUIT INTEGRE, ET PRESENTANT A SA PERIPHERIE DES BORNES DE CONNEXION 2 DESTINEES A ETRE CONNECTEES RESPECTIVEMENT AUX BORNES DE SORTIE DU CIRCUIT INTEGRE. LES BORNES 2 SONT ELLES-MEMES CONNECTEES ELECTRIQUEMENT A DES BROCHES RESPECTIVES 2 PERMETTANT DE RACCORDER ELECTRIQUEMENT LE BOITIER A D'AUTRES COMPOSANTS. SUR LA FACE ARRIERE DU CORPS 1A EST FORME UN ELEMENT CHAUFFANT 5A CONSISTANT EN UN CONDUCTEUR RESISTIF METALLIQUE ET DONT LES DEUX EXTREMITES SONT CONNECTEES ELECTRIQUEMENT A DES BROCHES 2A PERMETTANT D'ALIMENTER L'ELEMENT CHAUFFANT 5A EN COURANT. L'ELEMENT CHAUFFANT 5A PERMET DE PRECHAUFFER LE CIRCUIT INTEGRE A SEMI-CONDUCTEURS DISPOSE DANS LE LOGEMENT 6 JUSQU'A LA TEMPERATURE REQUISE POUR SON FONCTIONNEMENT NORMAL PRECIS ET STABLE, PERMETTANT AINSI D'AMELIORER LA PRECISION ET LA SURETE DE FONCTIONNEMENT DES APPAREILS AUXQUELS UN TEL CIRCUIT INTEGRE EST INCORPORE, AINSI QUE LA COMMANDE ASSUREE PAR DE TELS APPAREILS.
FR8018769A 1979-08-29 1980-08-29 Dispositif de support a element de prechauffage pour circuit integre a semi-conducteurs Granted FR2469803A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11090479A JPS5635383A (en) 1979-08-29 1979-08-29 Semiconductor integrated circuit support with heating mechanism

Publications (2)

Publication Number Publication Date
FR2469803A1 true FR2469803A1 (fr) 1981-05-22
FR2469803B1 FR2469803B1 (fr) 1983-11-18

Family

ID=14547605

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8018769A Granted FR2469803A1 (fr) 1979-08-29 1980-08-29 Dispositif de support a element de prechauffage pour circuit integre a semi-conducteurs

Country Status (5)

Country Link
US (1) US4374316A (fr)
JP (1) JPS5635383A (fr)
DE (1) DE3031789A1 (fr)
FR (1) FR2469803A1 (fr)
GB (1) GB2057761B (fr)

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US4626206A (en) * 1984-12-14 1986-12-02 Texas Instruments Incorporated Apparatus for integrated circuit assembly operations
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US4684783A (en) * 1985-11-06 1987-08-04 Sawtek, Inc. Environmental control apparatus for electrical circuit elements
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US4769525A (en) * 1986-09-02 1988-09-06 Hughes Aircraft Company Circuit package attachment apparatus and method
JPS6376279A (ja) * 1986-09-19 1988-04-06 株式会社日立製作所 コネクタ及びそれを用いた半導体素子実装構造
US4841170A (en) * 1986-12-08 1989-06-20 John Fluke Mfg. Co., Inc. Temperature controlled hybrid assembly
USRE34179E (en) * 1986-12-08 1993-02-16 John Fluke Mfg. Co., Inc. Temperature controlled hybrid assembly
US4980586A (en) * 1987-10-07 1990-12-25 Tektronix, Inc. Digital integrated circuit propagation delay regulator
FR2635612B1 (fr) * 1988-08-18 1992-02-21 Alsthom Cgee Procede et auxiliaire d'ajustage dynamique pour circuit electronique hybride
US5183597A (en) * 1989-02-10 1993-02-02 Minnesota Mining And Manufacturing Company Method of molding microstructure bearing composite plastic articles
EP0447155B1 (fr) * 1990-03-12 1995-07-26 Ngk Insulators, Ltd. Calorifères pour pastilles semi-conductrices pour un appareil produisant des semi-conducteurs, unités de chauffage utilisant de tels calorifères, et production de calorifères
FR2668876B1 (fr) * 1990-11-07 1992-12-24 Alcatel Espace Circuit electronique controle en temperature.
US5210485A (en) * 1991-07-26 1993-05-11 International Business Machines Corporation Probe for wafer burn-in test system
JPH05217121A (ja) * 1991-11-22 1993-08-27 Internatl Business Mach Corp <Ibm> 磁気変換器付きチップ等の感熱素子を結合する方法及び装置
FR2697717B1 (fr) * 1992-10-29 1994-12-16 Thomson Csf Dispositif de réchauffage de cartes électroniques.
US5539186A (en) * 1992-12-09 1996-07-23 International Business Machines Corporation Temperature controlled multi-layer module
JP3224930B2 (ja) * 1993-12-28 2001-11-05 株式会社東芝 半導体装置の再生方法
US5568892A (en) * 1994-06-16 1996-10-29 Lucent Technologies Inc. Alignment and bonding techniques
US5574627A (en) * 1995-07-24 1996-11-12 At&T Global Information Solutions Company Apparatus for preventing the formation of condensation on sub-cooled integrated circuit devices
US5951893A (en) * 1995-12-05 1999-09-14 Motorola, Inc. Integrated circuit pad structure with high temperature heating element and method therefor
US5742021A (en) * 1996-08-12 1998-04-21 International Business Machines Corporation High thermal conductivity substrate and the method of brazing a cap thereto
US6114674A (en) * 1996-10-04 2000-09-05 Mcdonnell Douglas Corporation Multilayer circuit board with electrically resistive heating element
DE19645095A1 (de) * 1996-11-01 1998-05-07 Ego Elektro Geraetebau Gmbh Beheizung
EP0853239A3 (fr) * 1997-01-13 2001-01-17 Kabushiki Kaisha Riken Detecteur de gaz et dispositif de chaufage
US5896259A (en) * 1997-08-05 1999-04-20 Raytheon Company Preheating device for electronic circuits
GB2330289A (en) * 1997-10-13 1999-04-14 Ericsson Omc Limited Heated printed circuit board
FI981032A (fi) 1998-05-08 1999-11-09 Nokia Networks Oy Lämmitysmenetelmä ja piirilevy
US6404048B2 (en) * 1998-09-03 2002-06-11 Micron Technology, Inc. Heat dissipating microelectronic package
JP3470612B2 (ja) * 1998-09-18 2003-11-25 株式会社日立製作所 電子機器
US6127660A (en) * 1998-12-31 2000-10-03 Lucent Technologies, Inc. Heated microcell base station
US6423940B1 (en) * 2001-03-02 2002-07-23 Agilent Technologies, Inc. Temperature stabilization scheme for a circuit board
FR2828785B1 (fr) * 2001-08-14 2004-01-23 Bernard Peyronny Corps de chauffe electrique noye dans un bloc accumulateur de calories
JP2003151726A (ja) * 2001-11-19 2003-05-23 Nec Corp 加温装置、加温装置実装構造および光導波路デバイス
US20030116552A1 (en) * 2001-12-20 2003-06-26 Stmicroelectronics Inc. Heating element for microfluidic and micromechanical applications
US6825681B2 (en) * 2002-07-19 2004-11-30 Delta Design, Inc. Thermal control of a DUT using a thermal control substrate
US6911624B2 (en) * 2002-08-23 2005-06-28 Micron Technology, Inc. Component installation, removal, and replacement apparatus and method
US6900411B2 (en) * 2003-02-06 2005-05-31 The Raymond Corporation Flexible heater for heating electrical components in operator control handle
DE202005001163U1 (de) * 2005-01-24 2005-03-31 Juma Leiterplattentechologie M Leiterplatte oder Platine mit Heizdraht
US7102377B1 (en) * 2005-06-23 2006-09-05 International Business Machines Corporation Packaging reliability superchips
US7282938B2 (en) * 2005-12-05 2007-10-16 Silicon Integrated Systems Corp. Testing apparatus and method for providing temperature stress to electronic component
US11244727B2 (en) 2006-11-29 2022-02-08 Rambus Inc. Dynamic memory rank configuration
WO2009032928A2 (fr) 2007-09-05 2009-03-12 Rambus Inc. Procédé et appareil destinés à réparer des défauts dans des dispositifs de mémoires à semi-conducteurs non volatiles
US8344475B2 (en) 2006-11-29 2013-01-01 Rambus Inc. Integrated circuit heating to effect in-situ annealing
KR20090097893A (ko) * 2006-11-29 2009-09-16 램버스 인코포레이티드 작동열화를 반전시킬 가열회로가 내장된 집적회로
US7474540B1 (en) * 2008-01-10 2009-01-06 International Business Machines Corporation Silicon carrier including an integrated heater for die rework and wafer probe
DE102008026135B4 (de) * 2008-05-30 2012-02-16 GLOBALFOUNDRIES Dresden Module One Ltd. Liability Company & Co. KG Steuerung für tiefe Temperaturen in einem Halbleiterbauelement
CN101835360A (zh) * 2010-05-10 2010-09-15 中兴通讯股份有限公司 单板的插拔装置和方法
US8704630B2 (en) 2010-08-25 2014-04-22 Itron, Inc. Apparatus and methods for temperature-based control of communication device operations
US8880765B2 (en) 2010-08-25 2014-11-04 Itron, Inc. Interface bus for utility-grade network communication devices
US9125301B2 (en) * 2011-10-18 2015-09-01 Integrated Microwave Corporation Integral heater assembly and method for carrier or host board of electronic package assembly
US9012811B2 (en) * 2012-01-13 2015-04-21 Viasystems Technologies Corp. L.L.C. Printed circuit board with embedded heater
US8964394B2 (en) * 2012-07-10 2015-02-24 Moxa Inc. Heating and heat dissipating multi-layer circuit board structure for keeping operating temperature of electronic components
US10285283B2 (en) 2016-06-03 2019-05-07 International Business Machines Corporation Heating of printed circuit board core during laminate cure
US11224098B2 (en) * 2018-11-01 2022-01-11 General Electric Company Systems and methods for passive heating of temperature-sensitive electronic components
US11382178B2 (en) * 2019-06-27 2022-07-05 General Electric Company System and method for heating an electrical bus in an electrical cabinet for cold startup and condensation/frost control
US11521908B2 (en) 2020-07-16 2022-12-06 Hewlett Packard Enterprise Development Lp Heater elements for processor devices

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3387113A (en) * 1964-07-09 1968-06-04 Charbonnier Roger Electronic assembly
GB1187595A (en) * 1966-04-27 1970-04-08 Telefunken Patent Improvements in or relating to Integrated Circuits
GB1307818A (en) * 1969-04-14 1973-02-21 Electronic Components Ltd Thick film substrates

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US3383614A (en) * 1965-06-28 1968-05-14 Texas Instruments Inc Temperature stabilized semiconductor devices
US3450863A (en) * 1967-06-19 1969-06-17 Caterpillar Tractor Co Thermal stabilizer for thermally sensitive components
US3662150A (en) * 1971-01-18 1972-05-09 Hughes Aircraft Co Controlled temperature circuit package
US3947658A (en) * 1972-02-22 1976-03-30 Kureha Kagaku Kogyo Kabushiki Kaisha Protector for the plate-shaped heating element
US3887785A (en) * 1974-08-29 1975-06-03 Us Air Force Temperature controlled hybrid oven
US4035613A (en) * 1976-01-08 1977-07-12 Kyoto Ceramic Co., Ltd. Cylindrical ceramic heating device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3387113A (en) * 1964-07-09 1968-06-04 Charbonnier Roger Electronic assembly
GB1187595A (en) * 1966-04-27 1970-04-08 Telefunken Patent Improvements in or relating to Integrated Circuits
GB1307818A (en) * 1969-04-14 1973-02-21 Electronic Components Ltd Thick film substrates

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
EXBK/72 *

Also Published As

Publication number Publication date
GB2057761A (en) 1981-04-01
JPS5635383A (en) 1981-04-08
DE3031789C2 (fr) 1990-10-18
GB2057761B (en) 1984-06-20
DE3031789A1 (de) 1981-03-19
US4374316A (en) 1983-02-15
FR2469803B1 (fr) 1983-11-18

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Legal Events

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