GB1187595A - Improvements in or relating to Integrated Circuits - Google Patents

Improvements in or relating to Integrated Circuits

Info

Publication number
GB1187595A
GB1187595A GB09119/67A GB1911967A GB1187595A GB 1187595 A GB1187595 A GB 1187595A GB 09119/67 A GB09119/67 A GB 09119/67A GB 1911967 A GB1911967 A GB 1911967A GB 1187595 A GB1187595 A GB 1187595A
Authority
GB
United Kingdom
Prior art keywords
substrate
heating element
temperature
integrated circuit
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB09119/67A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Telefunken Patentverwertungs GmbH
Original Assignee
Telefunken Patentverwertungs GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Telefunken Patentverwertungs GmbH filed Critical Telefunken Patentverwertungs GmbH
Publication of GB1187595A publication Critical patent/GB1187595A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/345—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N97/00—Electric solid-state thin-film or thick-film devices, not otherwise provided for
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Semiconductor Integrated Circuits (AREA)

Abstract

1,187,595. Semi-conductor devices; electric component assemblies. TELEFUNKEN PATENTVERWERTUNGS G.m.b.H. 26 April, 1967 [27 April, 1966], No. 19119/67. Headings H1K and H1R. [Also in Division G3] An integrated circuit formed on a base of thermally conductive material is provided with a heating element and a temperature-sensitive component both mounted on the base and connected so that the component controls the current through the heating element to maintain the temperature of the base substantially constant. The integrated circuit may be of the thick or thin film type or may be a monolithic semi-conductor element. In an embodiment, Fig. 1 (not shown), comprising a thick-film circuit on one side of a thermally-conductive substrate, the heating element is deposited on the underside of the substrate so as to cover nearly the whole surface. The temperature-sensitive component comprises a diode applied to the top of the substrate and forming one arm of a bridge circuit, the output of which is applied to a differential amplifier which controls the current flowing through the heating element to maintain the temperature of the substrate constant, Fig. 2 (not shown). The resistors forming the other three arms of the bridge together with the differential amplifier can be formed on the component side of the substrate as an integrated circuit. The whole device may be surrounded by thermal lagging material.
GB09119/67A 1966-04-27 1967-04-26 Improvements in or relating to Integrated Circuits Expired GB1187595A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DET31004A DE1245458B (en) 1966-04-27 1966-04-27 Integrated circuit, the carrier plate of which has good thermal conductivity

Publications (1)

Publication Number Publication Date
GB1187595A true GB1187595A (en) 1970-04-08

Family

ID=7555990

Family Applications (1)

Application Number Title Priority Date Filing Date
GB09119/67A Expired GB1187595A (en) 1966-04-27 1967-04-26 Improvements in or relating to Integrated Circuits

Country Status (2)

Country Link
DE (1) DE1245458B (en)
GB (1) GB1187595A (en)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2469803A1 (en) * 1979-08-29 1981-05-22 Kyoto Ceramic SUPPORT DEVICE WITH PREHEATING ELEMENT FOR INTEGRATED SEMICONDUCTOR CIRCUIT
FR2504293A1 (en) * 1981-04-20 1982-10-22 Burr Brown Res Corp METHOD AND MODULE FOR TEMPERATURE REGULATION FOR AN ELECTRONIC CIRCUIT
GB2163008A (en) * 1984-08-08 1986-02-12 Varian Associates Miniature, temperature controlled phase detector
EP0268935A1 (en) * 1986-11-28 1988-06-01 Siemens Aktiengesellschaft Vertically pluggable single-in-line circuit module
GB2198593A (en) * 1986-12-08 1988-06-15 Fluke Mfg Co John Temperature controlled hybrid circuit
EP0292059A2 (en) * 1987-05-18 1988-11-23 STMicroelectronics S.r.l. Modular resin-encapsulated multi-chip circuit package and its manufacturing method
EP0514873A1 (en) * 1991-05-24 1992-11-25 Honda Giken Kogyo Kabushiki Kaisha Heater type hybrid integrated circuit
USRE34179E (en) * 1986-12-08 1993-02-16 John Fluke Mfg. Co., Inc. Temperature controlled hybrid assembly
EP0840534A1 (en) * 1996-11-01 1998-05-06 E.G.O. ELEKTRO-GERÄTEBAU GmbH Electric heating and control thereof
EP1443014A1 (en) * 2003-01-31 2004-08-04 Fiat OM Carrelli Elevatori S.p.A. Electronic control for industrial truck, especially towbar guided industrial truck

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3326977A1 (en) * 1983-07-27 1985-02-07 Bruno 7441 Wolfschlugen Kümmerle Cooling set for electrical switch cabinets
DE4418457C2 (en) * 1994-05-26 1999-07-22 Wimmer Ulrich Dipl Ing Fh Device for filtering cooling air
DE102007033003A1 (en) * 2007-07-16 2009-01-22 Robert Bosch Gmbh Component with at least one semiconductor substrate with an integrated electrical circuit

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2469803A1 (en) * 1979-08-29 1981-05-22 Kyoto Ceramic SUPPORT DEVICE WITH PREHEATING ELEMENT FOR INTEGRATED SEMICONDUCTOR CIRCUIT
FR2504293A1 (en) * 1981-04-20 1982-10-22 Burr Brown Res Corp METHOD AND MODULE FOR TEMPERATURE REGULATION FOR AN ELECTRONIC CIRCUIT
GB2163008A (en) * 1984-08-08 1986-02-12 Varian Associates Miniature, temperature controlled phase detector
EP0268935A1 (en) * 1986-11-28 1988-06-01 Siemens Aktiengesellschaft Vertically pluggable single-in-line circuit module
GB2198593A (en) * 1986-12-08 1988-06-15 Fluke Mfg Co John Temperature controlled hybrid circuit
GB2198593B (en) * 1986-12-08 1991-07-03 Fluke Mfg Co John Temperature controlled hybrid assembly
USRE34179E (en) * 1986-12-08 1993-02-16 John Fluke Mfg. Co., Inc. Temperature controlled hybrid assembly
EP0292059A2 (en) * 1987-05-18 1988-11-23 STMicroelectronics S.r.l. Modular resin-encapsulated multi-chip circuit package and its manufacturing method
EP0292059A3 (en) * 1987-05-18 1989-03-08 Sgs-Thomson Microelectronics S.P.A. Modular resin-encapsulated multi-chip circuit and relative manufacturing method
EP0514873A1 (en) * 1991-05-24 1992-11-25 Honda Giken Kogyo Kabushiki Kaisha Heater type hybrid integrated circuit
EP0840534A1 (en) * 1996-11-01 1998-05-06 E.G.O. ELEKTRO-GERÄTEBAU GmbH Electric heating and control thereof
EP1443014A1 (en) * 2003-01-31 2004-08-04 Fiat OM Carrelli Elevatori S.p.A. Electronic control for industrial truck, especially towbar guided industrial truck

Also Published As

Publication number Publication date
DE1245458B (en) 1967-07-27

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PLNP Patent lapsed through nonpayment of renewal fees