JPS5629381A - Compound-semiconductor light emitting element containing garium and manufacture thereof - Google Patents
Compound-semiconductor light emitting element containing garium and manufacture thereofInfo
- Publication number
- JPS5629381A JPS5629381A JP10403179A JP10403179A JPS5629381A JP S5629381 A JPS5629381 A JP S5629381A JP 10403179 A JP10403179 A JP 10403179A JP 10403179 A JP10403179 A JP 10403179A JP S5629381 A JPS5629381 A JP S5629381A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- atoms
- electrode
- light emitting
- emitting element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/40—Materials therefor
Abstract
PURPOSE:To obtain an electrode whose bonding property is very excellent without losing the ohmic property at all by specifying the materials and compositions of the electrode which is formed on a P type layer of the compound-semiconductor light emitting element containing Ga. CONSTITUTION:A P type GaP layer 22 is epitaxially grown in a liquid phase on a substrate 21 containing Ga such as N type GaP, GaAs, CaAsP, and the like, and a PN junction 23 is yielded. N-side electrodes 25 with a specified pattern comprising Au-Si alloy are formed on the back surface of the substrate 21. Then, a P-side electrode of a specified pattern is formed on a layer 22. In this case, the materials are selected as follows. An alloy layer 24a, which comprises the main component of Au, and Be or Zn, is used as the lowest lsyer; a metal layer 24b such as Ta, Mo, W, Nb, and the like is used as the medium layer; an Au layer 24c is used as the uppermost layer; thereby the layered electrode is formed. At this time, the ratio of the strength of the secondary ions of Ga atoms against A atoms in the vicinity of the surface of the Au layer is 0.2 or less, and the ratio of the strength of the Be atoms or Zn atoms against the Au atoms is 0.3 or less.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10403179A JPS5629381A (en) | 1979-08-17 | 1979-08-17 | Compound-semiconductor light emitting element containing garium and manufacture thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10403179A JPS5629381A (en) | 1979-08-17 | 1979-08-17 | Compound-semiconductor light emitting element containing garium and manufacture thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5629381A true JPS5629381A (en) | 1981-03-24 |
Family
ID=14369863
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10403179A Pending JPS5629381A (en) | 1979-08-17 | 1979-08-17 | Compound-semiconductor light emitting element containing garium and manufacture thereof |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5629381A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0386775A1 (en) * | 1989-03-10 | 1990-09-12 | Sumitomo Electric Industries, Ltd. | Electrode structure for III-V compound semiconductor element and method of manufacturing the same |
US5057454A (en) * | 1989-10-23 | 1991-10-15 | Sumitomo Electric Industries, Ltd. | Process for producing ohmic electrode for p-type cubic system boron nitride |
US5187560A (en) * | 1989-11-28 | 1993-02-16 | Sumitomo Electric Industries, Ltd. | Ohmic electrode for n-type cubic boron nitride and the process for manufacturing the same |
US5240877A (en) * | 1989-11-28 | 1993-08-31 | Sumitomo Electric Industries, Ltd. | Process for manufacturing an ohmic electrode for n-type cubic boron nitride |
US5412249A (en) * | 1993-03-31 | 1995-05-02 | Kabushiki Kaisha Toshiba | Semiconductor device having layered electrode |
US5790577A (en) * | 1995-10-05 | 1998-08-04 | Nippondenso Co., Ltd. | High output semiconductor laser element having robust electrode structure |
-
1979
- 1979-08-17 JP JP10403179A patent/JPS5629381A/en active Pending
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0386775A1 (en) * | 1989-03-10 | 1990-09-12 | Sumitomo Electric Industries, Ltd. | Electrode structure for III-V compound semiconductor element and method of manufacturing the same |
US5057454A (en) * | 1989-10-23 | 1991-10-15 | Sumitomo Electric Industries, Ltd. | Process for producing ohmic electrode for p-type cubic system boron nitride |
US5187560A (en) * | 1989-11-28 | 1993-02-16 | Sumitomo Electric Industries, Ltd. | Ohmic electrode for n-type cubic boron nitride and the process for manufacturing the same |
US5240877A (en) * | 1989-11-28 | 1993-08-31 | Sumitomo Electric Industries, Ltd. | Process for manufacturing an ohmic electrode for n-type cubic boron nitride |
US5412249A (en) * | 1993-03-31 | 1995-05-02 | Kabushiki Kaisha Toshiba | Semiconductor device having layered electrode |
US5790577A (en) * | 1995-10-05 | 1998-08-04 | Nippondenso Co., Ltd. | High output semiconductor laser element having robust electrode structure |
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