JPS5627945A - Semiconductor device with multilayered wiring - Google Patents

Semiconductor device with multilayered wiring

Info

Publication number
JPS5627945A
JPS5627945A JP10399879A JP10399879A JPS5627945A JP S5627945 A JPS5627945 A JP S5627945A JP 10399879 A JP10399879 A JP 10399879A JP 10399879 A JP10399879 A JP 10399879A JP S5627945 A JPS5627945 A JP S5627945A
Authority
JP
Japan
Prior art keywords
wiring
layer
emitter
base
junction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10399879A
Other languages
English (en)
Other versions
JPS6222454B2 (ja
Inventor
Takashi Yamaguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP10399879A priority Critical patent/JPS5627945A/ja
Publication of JPS5627945A publication Critical patent/JPS5627945A/ja
Publication of JPS6222454B2 publication Critical patent/JPS6222454B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
JP10399879A 1979-08-17 1979-08-17 Semiconductor device with multilayered wiring Granted JPS5627945A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10399879A JPS5627945A (en) 1979-08-17 1979-08-17 Semiconductor device with multilayered wiring

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10399879A JPS5627945A (en) 1979-08-17 1979-08-17 Semiconductor device with multilayered wiring

Publications (2)

Publication Number Publication Date
JPS5627945A true JPS5627945A (en) 1981-03-18
JPS6222454B2 JPS6222454B2 (ja) 1987-05-18

Family

ID=14368954

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10399879A Granted JPS5627945A (en) 1979-08-17 1979-08-17 Semiconductor device with multilayered wiring

Country Status (1)

Country Link
JP (1) JPS5627945A (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63253649A (ja) * 1987-04-10 1988-10-20 Nec Corp 半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63253649A (ja) * 1987-04-10 1988-10-20 Nec Corp 半導体装置

Also Published As

Publication number Publication date
JPS6222454B2 (ja) 1987-05-18

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