JPS56275A - Metal film formation - Google Patents
Metal film formationInfo
- Publication number
- JPS56275A JPS56275A JP7372379A JP7372379A JPS56275A JP S56275 A JPS56275 A JP S56275A JP 7372379 A JP7372379 A JP 7372379A JP 7372379 A JP7372379 A JP 7372379A JP S56275 A JPS56275 A JP S56275A
- Authority
- JP
- Japan
- Prior art keywords
- sputtering
- transition metal
- substrate
- inlet
- inert gas
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/0021—Reactive sputtering or evaporation
- C23C14/0036—Reactive sputtering
- C23C14/0057—Reactive sputtering using reactive gases other than O2, H2O, N2, NH3 or CH4
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electrodes Of Semiconductors (AREA)
- Physical Vapour Deposition (AREA)
Abstract
PURPOSE:To easily form a transition metal silicide layer having a desired composition with good reproducibility by sputtering on a substrate a transition metal in an inert gas atmosphere contg. slicon chloride cpd. CONSTITUTION:An Si semiconductor substrate 12 is mounted on the support plate 11 in the bell jar 14 of a sputtering apparatus. Transition metal such as W, Mo is mounted as a target 13. Chlorine cpd. such as SiH2Cl2 is admitted through an inlet 15 and an inert gas such as Ar is introduced through an inlet 16. Then, sputtering operation is performed in conventional manner. By this process, the content of Si in silicide layer on the substrate 12 can be controlled to a desired value by controlling sputtering power, and as a result, the electric properties of semiconductor elements are enhanced. The obtained layer is an important material for manufacturing highly integrated high-speed semiconductor devices.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7372379A JPS56275A (en) | 1979-06-12 | 1979-06-12 | Metal film formation |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7372379A JPS56275A (en) | 1979-06-12 | 1979-06-12 | Metal film formation |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS56275A true JPS56275A (en) | 1981-01-06 |
JPS6135270B2 JPS6135270B2 (en) | 1986-08-12 |
Family
ID=13526424
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7372379A Granted JPS56275A (en) | 1979-06-12 | 1979-06-12 | Metal film formation |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56275A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60188693U (en) * | 1984-05-25 | 1985-12-13 | 有限会社 船舶ジエツト推進研究所 | ship |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5040116A (en) * | 1973-08-15 | 1975-04-12 | ||
JPS5165038A (en) * | 1974-12-04 | 1976-06-05 | Suwa Seikosha Kk | TOKEI YOGA ISOBUHIN |
JPS5435172A (en) * | 1977-08-24 | 1979-03-15 | Anelva Corp | Chemical reactor using electric discharge |
-
1979
- 1979-06-12 JP JP7372379A patent/JPS56275A/en active Granted
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5040116A (en) * | 1973-08-15 | 1975-04-12 | ||
JPS5165038A (en) * | 1974-12-04 | 1976-06-05 | Suwa Seikosha Kk | TOKEI YOGA ISOBUHIN |
JPS5435172A (en) * | 1977-08-24 | 1979-03-15 | Anelva Corp | Chemical reactor using electric discharge |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60188693U (en) * | 1984-05-25 | 1985-12-13 | 有限会社 船舶ジエツト推進研究所 | ship |
Also Published As
Publication number | Publication date |
---|---|
JPS6135270B2 (en) | 1986-08-12 |
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