JPS5623765A - Molded type electronic device - Google Patents

Molded type electronic device

Info

Publication number
JPS5623765A
JPS5623765A JP9729579A JP9729579A JPS5623765A JP S5623765 A JPS5623765 A JP S5623765A JP 9729579 A JP9729579 A JP 9729579A JP 9729579 A JP9729579 A JP 9729579A JP S5623765 A JPS5623765 A JP S5623765A
Authority
JP
Japan
Prior art keywords
lead wires
package
electronic device
type electronic
molded type
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9729579A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6216553B2 (enrdf_load_stackoverflow
Inventor
Kazuo Shimizu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP9729579A priority Critical patent/JPS5623765A/ja
Publication of JPS5623765A publication Critical patent/JPS5623765A/ja
Publication of JPS6216553B2 publication Critical patent/JPS6216553B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP9729579A 1979-08-01 1979-08-01 Molded type electronic device Granted JPS5623765A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9729579A JPS5623765A (en) 1979-08-01 1979-08-01 Molded type electronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9729579A JPS5623765A (en) 1979-08-01 1979-08-01 Molded type electronic device

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2866688A Division JPS63211659A (ja) 1988-02-12 1988-02-12 樹脂モールド型半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS5623765A true JPS5623765A (en) 1981-03-06
JPS6216553B2 JPS6216553B2 (enrdf_load_stackoverflow) 1987-04-13

Family

ID=14188499

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9729579A Granted JPS5623765A (en) 1979-08-01 1979-08-01 Molded type electronic device

Country Status (1)

Country Link
JP (1) JPS5623765A (enrdf_load_stackoverflow)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5842246A (ja) * 1981-09-07 1983-03-11 Toshiba Corp 半導体装置
JPS5845681A (ja) * 1981-09-07 1983-03-16 Toshiba Corp メモリシステム
JPS59119751A (ja) * 1982-12-25 1984-07-11 Rohm Co Ltd 半導体装置
JPS59103446U (ja) * 1982-12-28 1984-07-12 富士通株式会社 半導体装置
JPS59147448A (ja) * 1983-02-12 1984-08-23 Fujitsu Ltd 半導体素子搭載用リ−ドフレ−ムおよびこれを用いて製造される半導体装置とその製造方法
JPS6350136U (enrdf_load_stackoverflow) * 1986-09-19 1988-04-05
US6953054B2 (en) 2003-01-17 2005-10-11 Showa Corporation Relief valve
US7429791B2 (en) 2000-08-31 2008-09-30 Nec Corporation Semiconductor device in a resin sealed package with a radiating plate and manufacturing method thereof
JP2013175597A (ja) * 2012-02-24 2013-09-05 Sumitomo Electric Device Innovations Inc パッケージ

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5356545U (enrdf_load_stackoverflow) * 1976-10-15 1978-05-15

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5356545U (enrdf_load_stackoverflow) * 1976-10-15 1978-05-15

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5842246A (ja) * 1981-09-07 1983-03-11 Toshiba Corp 半導体装置
JPS5845681A (ja) * 1981-09-07 1983-03-16 Toshiba Corp メモリシステム
JPS59119751A (ja) * 1982-12-25 1984-07-11 Rohm Co Ltd 半導体装置
JPS59103446U (ja) * 1982-12-28 1984-07-12 富士通株式会社 半導体装置
JPS59147448A (ja) * 1983-02-12 1984-08-23 Fujitsu Ltd 半導体素子搭載用リ−ドフレ−ムおよびこれを用いて製造される半導体装置とその製造方法
JPS6350136U (enrdf_load_stackoverflow) * 1986-09-19 1988-04-05
US7429791B2 (en) 2000-08-31 2008-09-30 Nec Corporation Semiconductor device in a resin sealed package with a radiating plate and manufacturing method thereof
US6953054B2 (en) 2003-01-17 2005-10-11 Showa Corporation Relief valve
JP2013175597A (ja) * 2012-02-24 2013-09-05 Sumitomo Electric Device Innovations Inc パッケージ

Also Published As

Publication number Publication date
JPS6216553B2 (enrdf_load_stackoverflow) 1987-04-13

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