JPS5618450A - Semiconductor element assembling structure - Google Patents

Semiconductor element assembling structure

Info

Publication number
JPS5618450A
JPS5618450A JP9445679A JP9445679A JPS5618450A JP S5618450 A JPS5618450 A JP S5618450A JP 9445679 A JP9445679 A JP 9445679A JP 9445679 A JP9445679 A JP 9445679A JP S5618450 A JPS5618450 A JP S5618450A
Authority
JP
Japan
Prior art keywords
block unit
semiconductor element
assembling
simplify
formation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9445679A
Other languages
Japanese (ja)
Inventor
Hiroyuki Fujii
Kenichi Tateno
Mikio Nishikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electronics Corp filed Critical Matsushita Electronics Corp
Priority to JP9445679A priority Critical patent/JPS5618450A/en
Publication of JPS5618450A publication Critical patent/JPS5618450A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49568—Lead-frames or other flat leads specifically adapted to facilitate heat dissipation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4334—Auxiliary members in encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting

Abstract

PURPOSE:To simplify the formation of a semiconductor element assembling structure and to improve the workability thereof by stamping a lead frame of special shape from one uniformly thick metallic thin plate and assembling it with a heat dissipating block unit. CONSTITUTION:One uniformly thick metallic thin plate is stamped in a body having a plurality of, such as three, lead wires 11-13, one of which as designated by 12 has a wide portion 14. The wide portion 14 is placed with a solder plate thereon, is bonded with a heat dissipating block unit 20 having a semiconductor element substrate placing portion at predetermined position by controlling the position by the folded portion, and a semiconductor substrate 19 is then placed on the block unit 20. The block unit 20 and the lead wires are made of copper. In this manner, the copper plate of the body is wound in rolled state for an easy machining to simplify the formation of the assembling, regulating procedure for positioning and to improve the production workability.
JP9445679A 1979-07-24 1979-07-24 Semiconductor element assembling structure Pending JPS5618450A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9445679A JPS5618450A (en) 1979-07-24 1979-07-24 Semiconductor element assembling structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9445679A JPS5618450A (en) 1979-07-24 1979-07-24 Semiconductor element assembling structure

Publications (1)

Publication Number Publication Date
JPS5618450A true JPS5618450A (en) 1981-02-21

Family

ID=14110762

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9445679A Pending JPS5618450A (en) 1979-07-24 1979-07-24 Semiconductor element assembling structure

Country Status (1)

Country Link
JP (1) JPS5618450A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3223826A1 (en) * 1981-06-25 1983-01-13 Sony Corp., Tokyo TELEVISION SOUND RECEIVER

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3223826A1 (en) * 1981-06-25 1983-01-13 Sony Corp., Tokyo TELEVISION SOUND RECEIVER

Similar Documents

Publication Publication Date Title
JPS5618450A (en) Semiconductor element assembling structure
JPS5423484A (en) Semiconductor integrated circuit and its manufacture
JPS5643740A (en) Semiconductor wafer
JPS5412263A (en) Semiconductor element and production of the same
JPS5322365A (en) Resin mold type semiconductor device and its production
JPS5618451A (en) Manufacture of substrate for semiconductor device
JPS5642669A (en) Thermal printer head
JPS5296880A (en) Crystal oscillator holder
JPS6455831A (en) Die bonder
JPS57109347A (en) Semiconductor device
JPS542068A (en) Manufacture for semiconductor device
JPS5231670A (en) Assembling method of semiconductor integrated circuit element
JPS5394885A (en) Mount structure for semiconductor laser element
JPS5323272A (en) Semiconductor device
JPS5310266A (en) Production of soldred semiconductor wafers
JPS52119075A (en) Manufacture of semiconductor device
JPS5366369A (en) Semiconductor device
JPS52109872A (en) Semiconductor device
JPS54115071A (en) Semiconductor element
JPS52104869A (en) Manufacture for semiconductor device
JPS5324268A (en) Pro duction of semiconductor device and bonding wire for the same
JPS55124241A (en) Method of fabricating semiconductor device
JPS54124988A (en) Hybrid type semiconductor device
JPS5345173A (en) Production of semiconductor device
JPS5258464A (en) Semiconductor device